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Wafer level package structure with internal conductive layer
Grant 11,424,209 - Albers , et al. August 23, 2 | 2022-08-23 |
Package Stacking Using Chip To Wafer Bonding
App 20220108976 - SEIDEMANN; Georg ; et al. | 2022-04-07 |
Package stacking using chip to wafer bonding
Grant 11,239,199 - Seidemann , et al. February 1, 2 | 2022-02-01 |
Microelectronic Packages With High Integration Microelectronic Dice Stack
App 20210035950 - PATTEN; Richard | 2021-02-04 |
Method, apparatus and system to interconnect packaged integrated circuit dies
Grant 10,910,347 - She , et al. February 2, 2 | 2021-02-02 |
Microelectronic packages with high integration microelectronic dice stack
Grant 10,872,881 - Patten December 22, 2 | 2020-12-22 |
Semiconductor die package with more than one hanging die
Grant 10,854,590 - Albers , et al. December 1, 2 | 2020-12-01 |
Integrated circuit packages including an optical redistribution layer
Grant 10,816,742 - Seidemann , et al. October 27, 2 | 2020-10-27 |
Wafer Level Package Structure With Internal Conductive Layer
App 20200273832 - ALBERS; Sven ; et al. | 2020-08-27 |
Microelectronic Packages With High Integration Microelectronic Dice Stack
App 20200219844 - PATTEN; Richard | 2020-07-09 |
Semiconductor Die Package With More Than One Hanging Die
App 20200176436 - ALBERS; Sven ; et al. | 2020-06-04 |
Wafer level package structure with internal conductive layer
Grant 10,672,731 - Albers , et al. | 2020-06-02 |
Microelectronic packages with high integration microelectronic dice stack
Grant 10,622,333 - Patten | 2020-04-14 |
Novel Wafer Level Chip Scale Package (wlcsp), Flip-chip Chip Scale Package (fccsp), And Fan Out Shielding Concepts
App 20200098698 - PATTEN; Richard ; et al. | 2020-03-26 |
Method, Apparatus And System To Interconnect Packaged Integrated Circuit Dies
App 20190341372 - She; Yong ; et al. | 2019-11-07 |
Fan Out Packaging Pop Mechanical Attach Method
App 20190312016 - O'Sullivan; David ; et al. | 2019-10-10 |
Microelectronic package with illuminated backside exterior
Grant 10,411,000 - Dittes , et al. Sept | 2019-09-10 |
Method, apparatus and system to interconnect packaged integrated circuit dies
Grant 10,396,055 - She , et al. A | 2019-08-27 |
Optical Fiber Connection On Package Edge
App 20190121041 - Albers; Sven ; et al. | 2019-04-25 |
Microelectronic Packages With High Integration Microelectronic Dice Stack
App 20190109114 - PATTEN; Richard | 2019-04-11 |
Integrated circuit package having wirebonded multi-die stack
Grant 10,249,598 - Meyer , et al. | 2019-04-02 |
Integrated Circuit Packages Including An Optical Redistribution Layer
App 20190072732 - Seidemann; Georg ; et al. | 2019-03-07 |
Integrated circuit packages including an optical redistribution layer
Grant 10,209,466 - Seidemann , et al. Feb | 2019-02-19 |
Method, Apparatus And System To Interconnect Packaged Integrated Circuit Dies
App 20190019777 - SHE; Yong ; et al. | 2019-01-17 |
Wafer Level Package Structure With Internal Conductive Layer
App 20180358317 - ALBERS; Sven ; et al. | 2018-12-13 |
Package Stacking Using Chip To Wafer Bonding
App 20180331070 - SEIDEMANN; Georg ; et al. | 2018-11-15 |
Integrated Circuit Package Having Wirebonded Multi-die Stack
App 20180315737 - Meyer; Thorsten ; et al. | 2018-11-01 |
Integrated Circuit Package Having Wirebonded Multi-die Stack
App 20180197840 - Meyer; Thorsten ; et al. | 2018-07-12 |
Integrated circuit package having wirebonded multi-die stack
Grant 9,972,601 - Meyer , et al. May 15, 2 | 2018-05-15 |
Electronic device package
Grant 9,859,255 - Yoon , et al. January 2, 2 | 2018-01-02 |
Microelectronic Package with Illuminated Backside Exterior
App 20170284636 - Dittes; Marc Stephan ; et al. | 2017-10-05 |
Integrated Circuit Packages Including An Optical Redistribution Layer
App 20170285280 - Seidemann; Georg ; et al. | 2017-10-05 |
Flip-chip Package With Thermal Dissipation Layer
App 20170178999 - Patten; Richard ; et al. | 2017-06-22 |
Integrated Circuit Package Having Wirebonded Multi-die Stack
App 20160276311 - Meyer; Thorsten ; et al. | 2016-09-22 |
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