Patlolla; Raghuveer R.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Patlolla; Raghuveer R..The latest application filed is for "semiconductor interconnect structure with double conductors".

Company Profile

35.37.39

Patlolla; Raghuveer R. - Guilderland NY
Patlolla; Raghuveer R. - Albany NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Liner and cap structures for reducing local interconnect vertical resistance without compromising reliability Grant 11,205,587 - Fan , et al. December 21, 2	2021-12-21
Wet clean solutions to prevent pattern collapse Grant 11,094,527 - Peethala , et al. August 17, 2	2021-08-17
Forming dual metallization interconnect structures in single metallization level Grant 11,037,875 - Amanapu , et al. June 15, 2	2021-06-15
Forming dual metallization interconnect structures in single metallization level Grant 11,031,337 - Amanapu , et al. June 8, 2	2021-06-08
Metal interconnects Grant 11,031,339 - Patlolla , et al. June 8, 2	2021-06-08
Semiconductor structures of more uniform thickness Grant 11,031,250 - Ebrish , et al. June 8, 2	2021-06-08
Metal interconnects Grant 11,018,087 - Patlolla , et al. May 25, 2	2021-05-25
Semiconductor Interconnect Structure With Double Conductors App 20210043563 - Briggs; Benjamin D. ; et al.	2021-02-11
Back end of line metallization structure Grant 10,910,307 - Patlolla , et al. February 2, 2	2021-02-02
Back end of line metallization structure Grant 10,903,161 - Patlolla , et al. January 26, 2	2021-01-26
Low oxygen cleaning for CMP equipment Grant 10,832,917 - Canaperi , et al. November 10, 2	2020-11-10
Low Aspect Ratio Interconnect App 20200328156 - Briggs; Benjamin D. ; et al.	2020-10-15
Semiconductor interconnect structure with double conductors Grant 10,804,193 - Briggs , et al. October 13, 2	2020-10-13
Back end of line metallization structures Grant 10,741,748 - Maniscalco , et al. A	2020-08-11
Back End Of Line Integration For Interconnects App 20200219759 - Peethala; Cornelius B. ; et al.	2020-07-09
Back end of line integration for interconnects Grant 10,699,945 - Peethala , et al.	2020-06-30
Liner and cap structures for reducing local interconnect vertical resistance without compromising reliability Grant 10,685,876 - Fan , et al.	2020-06-16
Back end of line metallization structures Grant 10,686,126 - Maniscalco , et al.	2020-06-16
Semiconductor Structures Of More Uniform Thickness App 20200176263 - Ebrish; Mona A. ; et al.	2020-06-04
Low aspect ratio interconnect Grant 10,672,707 - Briggs , et al.	2020-06-02
Back End Of Line Metallization Structure App 20200144180 - Patlolla; Raghuveer R. ; et al.	2020-05-07
Back End Of Line Metallization Structure App 20200144178 - Patlolla; Raghuveer R. ; et al.	2020-05-07
Wet Clean Solutions To Prevent Pattern Collapse App 20200118808 - Peethala; Cornelius B. ; et al.	2020-04-16
Back End Of Line Integration For Interconnects App 20200111699 - Peethala; Cornelius B. ; et al.	2020-04-09
Liner And Cap Structures For Reducing Local Interconnect Vertical Resistance Without Compromising Reliability App 20200090989 - Fan; Su Chen ; et al.	2020-03-19
Liner And Cap Structures For Reducing Local Interconnect Vertical Resistance Without Compromising Reliability App 20200090990 - Fan; Su Chen ; et al.	2020-03-19
Back End Of Line Metallization Structures App 20200083435 - Maniscalco; Joseph F. ; et al.	2020-03-12
Metal Interconnects App 20200083169 - Patlolla; Raghuveer R. ; et al.	2020-03-12
Forming dual metallization interconnect structures in single metallization level Grant 10,559,530 - Amanapu , et al. Feb	2020-02-11
Back End Of Line Metallization Structures App 20190393409 - Maniscalco; Joseph F. ; et al.	2019-12-26
Metal Interconnects App 20190333857 - Patlolla; Raghuveer R. ; et al.	2019-10-31
Bottom electrode for MRAM applications Grant 10,461,248 - Bhosale , et al. Oc	2019-10-29
Forming Dual Metallization Interconnect Structures In Single Metallization Level App 20190311986 - Amanapu; Hari P. ; et al.	2019-10-10
Selective surface modification of interconnect structures Grant 10,373,909 - Patlolla , et al.	2019-08-06
Cobalt contact and interconnect structures Grant 10,373,867 - Amanapu , et al.	2019-08-06
Forming Dual Metallization Interconnect Structures In Single Metallization Level App 20190221519 - Amanapu; Hari P. ; et al.	2019-07-18
Low-resistivity Metallic Interconnect Structures With Self-forming Diffusion Barrier Layers App 20190221477 - Amanapu; Hari P. ; et al.	2019-07-18
Forming Dual Metallization Interconnect Structures In Single Metallization Level App 20190198444 - Amanapu; Hari P. ; et al.	2019-06-27
Low Aspect Ratio Interconnect App 20190148296 - Briggs; Benjamin D. ; et al.	2019-05-16
Rework of patterned dielectric and metal hardmask films Grant 10,242,872 - Arnold , et al.	2019-03-26
Low aspect ratio interconnect Grant 10,211,153 - Briggs , et al. Feb	2019-02-19
Low-resistivity metallic interconnect structures with self-forming diffusion barrier layers Grant 10,204,829 - Amanapu , et al. Feb	2019-02-12
Cobalt contact and interconnect structures Grant 10,177,030 - Amanapu , et al. J	2019-01-08
Low Oxygen Cleaning For Cmp Equipment App 20180358231 - Canaperi; Donald F. ; et al.	2018-12-13
Low Oxygen Cleaning For Cmp Equipment App 20180358230 - Canaperi; Donald F. ; et al.	2018-12-13
Bottom electrode for MRAM applications Grant 10,096,769 - Bhosale , et al. October 9, 2	2018-10-09
Bottom Electrode For Mram Applications App 20180287051 - Bhosale; Prasad ; et al.	2018-10-04
Rework Of Patterned Dielectric And Metal Hardmask Films App 20180277369 - Arnold; John C. ; et al.	2018-09-27
Bottom Electrode For Mram Applications App 20180261759 - Bhosale; Prasad ; et al.	2018-09-13
Cobalt Contact And Interconnect Structures App 20180197773 - Amanapu; Hari P. ; et al.	2018-07-12
Cobalt Contact And Interconnect Structures App 20180197774 - Amanapu; Hari P. ; et al.	2018-07-12
Selective and non-selective barrier layer wet removal Grant 10,002,831 - Briggs , et al. June 19, 2	2018-06-19
Barrier Planarization For Interconnect Metallization App 20180114718 - Briggs; Benjamin D. ; et al.	2018-04-26
Barrier Planarization For Interconnect Metallization App 20180114719 - Briggs; Benjamin D. ; et al.	2018-04-26
Rework and stripping of complex patterning layers using chemical mechanical polishing Grant 9,934,980 - Abdallah , et al. April 3, 2	2018-04-03
Selective Surface Modification Of Interconnect Structures App 20180082955 - Patlolla; Raghuveer R. ; et al.	2018-03-22
Low Aspect Ratio Interconnect App 20180061761 - Briggs; Benjamin D. ; et al.	2018-03-01
Barrier planarization for interconnect metallization Grant 9,881,833 - Briggs , et al. January 30, 2	2018-01-30
Selective surface modification of interconnect structures Grant 9,859,218 - Patlolla , et al. January 2, 2	2018-01-02
Semiconductor interconnect structure with double conductors Grant 9,837,350 - Briggs , et al. December 5, 2	2017-12-05
Selective And Non-selective Barrier Layer Wet Removal App 20170317026 - Briggs; Benjamin D. ; et al.	2017-11-02
Selective and non-selective barrier layer wet removal Grant 9,806,023 - Briggs , et al. October 31, 2	2017-10-31
Selective And Non-selective Barrier Layer Wet Removal App 20170301624 - Briggs; Benjamin D. ; et al.	2017-10-19
Semiconductor Interconnect Structure With Double Conductors App 20170294382 - BRIGGS; BENJAMIN D. ; et al.	2017-10-12
Semiconductor Interconnect Structure With Double Conductors App 20170294381 - BRIGGS; BENJAMIN D. ; et al.	2017-10-12
Selective and non-selective barrier layer wet removal Grant 9,685,406 - Briggs , et al. June 20, 2	2017-06-20
Method and structure to reduce the electric field in semiconductor wiring interconnects Grant 9,666,529 - Huang , et al. May 30, 2	2017-05-30
Wafer bonding using boron and nitrogen based bonding stack Grant 9,640,514 - Lin , et al. May 2, 2	2017-05-02
Method and structure to reduce the electric field in semiconductor wiring interconnects Grant 9,379,057 - Huang , et al. June 28, 2	2016-06-28
Method And Structure To Reduce The Electric Field In Semiconductor Wiring Interconnects App 20160064330 - Huang; Elbert Emin ; et al.	2016-03-03
Method And Structure To Reduce The Electric Field In Semiconductor Wiring Interconnects App 20160064321 - Huang; Elbert Emin ; et al.	2016-03-03
Rework And Stripping Of Complex Patterning Layers Using Chemical Mechanical Polishing App 20150371863 - Abdallah; Jassem A. ; et al.	2015-12-24
Rework and stripping of complex patterning layers using chemical mechanical polishing Grant 9,190,285 - Abdallah , et al. November 17, 2	2015-11-17
Rework And Stripping Of Complex Patterning Layers Using Chemical Mechanical Polishing App 20150325450 - Abdallah; Jassem A. ; et al.	2015-11-12