| Patent | Date |
|---|
Susceptor shaft
Grant D965,044 - Patil , et al. September 27, 2 | 2022-09-27 |
Integrated circuit (IC) packages employing split, double-sided metallization structures to facilitate a semiconductor die ("die") module employing stacked dice, and related fabrication methods
Grant 11,456,291 - We , et al. September 27, 2 | 2022-09-27 |
Package comprising a substrate with interconnect routing over solder resist layer and an integrated device coupled to the substrate and method for manufacturing the package
Grant 11,444,019 - Patil , et al. September 13, 2 | 2022-09-13 |
Integrated circuit (IC) packages employing a thermal conductive package substrate with die region split, and related fabrication methods
Grant 11,437,335 - Kang , et al. September 6, 2 | 2022-09-06 |
Thermal Structures Adapted To Electronic Device Heights In Integrated Circuit (ic) Packages
App 20220278016 - Patil; Aniket ; et al. | 2022-09-01 |
Package Having A Substrate Comprising Surface Interconnects Aligned With A Surface Of The Substrate
App 20220246496 - WE; Hong Bok ; et al. | 2022-08-04 |
Package With A Substrate Comprising Periphery Interconnects
App 20220246531 - PATIL; Aniket ; et al. | 2022-08-04 |
Circular Bond Finger Pad
App 20220238488 - BUOT; Joan Rey Villarba ; et al. | 2022-07-28 |
Ultra-low profile stacked RDL semiconductor package
Grant 11,393,808 - Patil , et al. July 19, 2 | 2022-07-19 |
Package Comprising A Substrate And Interconnect Device Configured For Diagonal Routing
App 20220223529 - BUOT; Joan Rey Villarba ; et al. | 2022-07-14 |
Substrate Comprising Interconnects In A Core Layer Configured For Skew Matching
App 20220223499 - PATIL; Aniket ; et al. | 2022-07-14 |
Antenna Module
App 20220200166 - WE; Hong Bok ; et al. | 2022-06-23 |
Multi-terminal integrated passive devices embedded on die and a method for fabricating the multi-terminal integrated passive devices
Grant 11,342,246 - Patil , et al. May 24, 2 | 2022-05-24 |
Package Comprising Inter-substrate Gradient Interconnect Structure
App 20220148952 - PATIL; Aniket ; et al. | 2022-05-12 |
Package Structure For Passive Component To Die Critical Distance Reduction
App 20220130741 - PATIL; Aniket ; et al. | 2022-04-28 |
Passive device orientation in core for improved power delivery in package
Grant 11,302,656 - We , et al. April 12, 2 | 2022-04-12 |
Nested interconnect structure in concentric arrangement for improved package architecture
Grant 11,296,024 - Patil , et al. April 5, 2 | 2022-04-05 |
Susceptor shaft
Grant D947,913 - Patil , et al. April 5, 2 | 2022-04-05 |
Package and substrate comprising interconnects with semi-circular planar shape and/or trapezoid planar shape
Grant 11,296,022 - Patil , et al. April 5, 2 | 2022-04-05 |
Terminal Connection Routing
App 20220104359 - PATIL; Aniket ; et al. | 2022-03-31 |
Package comprising a substrate and a high-density interconnect structure coupled to the substrate
Grant 11,289,453 - Patil , et al. March 29, 2 | 2022-03-29 |
Integrated Circuit (ic) With Reconstituted Die Interposer For Improved Connectivity, And Related Methods Of Fabrication
App 20220084947 - Kim; Jonghae ; et al. | 2022-03-17 |
Package Comprising An Integrated Device Coupled To A Substrate Through A Cavity
App 20220077069 - PATIL; Aniket ; et al. | 2022-03-10 |
Package And Substrate Comprising Interconnects With Semi-circular Planar Shape And/or Trapezoid Planar Shape
App 20220068798 - PATIL; Aniket ; et al. | 2022-03-03 |
Packages With Local High-density Routing Region Embedded Within An Insulating Layer
App 20220051988 - PATIL; Aniket ; et al. | 2022-02-17 |
Multi-terminal Integrated Passive Devices Embedded On Die And A Method For Fabricating The Multi-terminal Integrated Passive Devices
App 20220028756 - PATIL; Aniket ; et al. | 2022-01-27 |
Redistribution Layer Connection
App 20220028816 - PATIL; Aniket ; et al. | 2022-01-27 |
Passive Device Orientation In Core For Improved Power Delivery In Package
App 20220028805 - WE; Hong Bok ; et al. | 2022-01-27 |
Hybrid Metallization And Laminate Structure
App 20210407919 - PATIL; Aniket ; et al. | 2021-12-30 |
Integrated Circuit (ic) Packages Employing Split, Double-sided Metallization Structures To Facilitate A Semiconductor Die ("die") Module Employing Stacked Dice, And Related Fabrication Methods
App 20210407979 - We; Hong Bok ; et al. | 2021-12-30 |
Substrate Comprising A High-density Interconnect Portion Embedded In A Core Layer
App 20210391247 - PATIL; Aniket ; et al. | 2021-12-16 |
Thermal Mitigation Die Using Back Side Etch
App 20210375712 - PATIL; Aniket ; et al. | 2021-12-02 |
Variable Dielectric Constant Materials In Same Layer Of A Package
App 20210375743 - PATIL; Aniket ; et al. | 2021-12-02 |
Multicore Substrate
App 20210375736 - BUOT; Joan Rey Villarba ; et al. | 2021-12-02 |
Nested Interconnect Structure In Concentric Arrangement For Improved Package Architecture
App 20210358839 - PATIL; Aniket ; et al. | 2021-11-18 |
Electromagnetic interference shielding for packages and modules
Grant 11,177,223 - Patil , et al. November 16, 2 | 2021-11-16 |
Package Comprising Multi-level Vertically Stacked Redistribution Portions
App 20210351145 - PATIL; Aniket ; et al. | 2021-11-11 |
Package Comprising A Substrate With Interconnect Routing Over Solder Resist Layer
App 20210313266 - PATIL; Aniket ; et al. | 2021-10-07 |
Hybrid Package Apparatus And Method Of Fabricating
App 20210305141 - Patil; Aniket ; et al. | 2021-09-30 |
Stacked Module Package Interconnect Structure With Flex Cable
App 20210296280 - PATIL; Aniket ; et al. | 2021-09-23 |
Integrated Circuit (ic) Packages Employing Split, Double-sided Metallization Structures To Facilitate A Semiconductor Die ("die") Module Employing Stacked Dice, And Related Fabrication Methods
App 20210280523 - We; Hong Bok ; et al. | 2021-09-09 |
Package Comprising A Substrate And A High-density Interconnect Structure Coupled To The Substrate
App 20210272931 - PATIL; Aniket ; et al. | 2021-09-02 |
Through-package partial via on package edge
Grant 11,101,220 - We , et al. August 24, 2 | 2021-08-24 |
Package With Integrated Structure
App 20210249359 - PATIL; Aniket ; et al. | 2021-08-12 |
Integrated Circuit (ic) Packages Employing A Thermal Conductive Package Substrate With Die Region Split, And Related Fabrication Methods
App 20210242160 - Kang; Kuiwon ; et al. | 2021-08-05 |
Package Comprising A Double-sided Redistribution Portion
App 20210175178 - WE; Hong Bok ; et al. | 2021-06-10 |
Integrated Direct Mount Branch Protection For Variable Frequency Drive
App 20210168960 - Kothari; Mayur ; et al. | 2021-06-03 |
Ultra-low Profile Stacked Rdl Semiconductor Package
App 20210104507 - PATIL; Aniket ; et al. | 2021-04-08 |
Package Comprising A Die And Die Side Redistribution Layers (rdl)
App 20210104467 - PATIL; Aniket ; et al. | 2021-04-08 |
Ground shield plane for ball grid array (BGA) package
Grant 10,971,455 - Patil , et al. April 6, 2 | 2021-04-06 |
Through-package Partial Via On Package Edge
App 20210066197A1 - | 2021-03-04 |
Split conductive pad for device terminal
Grant 10,879,158 - Patil , et al. December 29, 2 | 2020-12-29 |
Passive Device Embedded In A Fan-out Package-on-package Assembly
App 20200381405 - PATIL; Aniket ; et al. | 2020-12-03 |
Split Conductive Pad For Device Terminal
App 20200381344 - PATIL; Aniket ; et al. | 2020-12-03 |
Ground Shield Plane For Ball Grid Array (bga) Package
App 20200350260 - PATIL; Aniket ; et al. | 2020-11-05 |
Uniform Via Pad Structure
App 20200219803 - KANG; Kuiwon ; et al. | 2020-07-09 |
Spilt Pad For Package Routing And Electrical Performance Improvement
App 20200111758 - PATIL; Aniket ; et al. | 2020-04-09 |
Security enhancement through application access control
Grant 9,691,051 - Rexer , et al. June 27, 2 | 2017-06-27 |
Security Enhancement Through Application Access Control
App 20130311894 - Rexer; Peter ; et al. | 2013-11-21 |
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