Patel; Mitesh C.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Patel; Mitesh C..The latest application filed is for "apparatus and method for precise alignment of packaging caps on a substrate".

Company Profile

0.6.6

Patel; Mitesh C. - Phoenix AZ
Patel; Mitesh C. - Chandler AZ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Process for precise alignment of packaging caps on a substrate Grant 7,584,536 - Clemons , et al. September 8, 2	2009-09-08
Radio frequency and microwave radiation used in conjunction with convective thermal heating to expedite curing of an imprinted material Grant 7,518,091 - Tandon , et al. April 14, 2	2009-04-14
Apparatus and method for precise alignment of packaging caps on a substrate App 20070257360 - Clemons; Gregory S. ; et al.	2007-11-08
Apparatus for precise alignment of packaging caps on a substrate Grant 7,275,312 - Clemons , et al. October 2, 2	2007-10-02
Package stress management Grant 7,179,689 - Matayabas, Jr. , et al. February 20, 2	2007-02-20
Package stress management Grant 7,170,188 - Matayabas, Jr. , et al. January 30, 2	2007-01-30
Radio frequency and microwave radiation used in conjunction with convective thermal heating to expedite curing of an imprinted material Grant 7,119,314 - Tandon , et al. October 10, 2	2006-10-10
Radio frequency and microwave radiation used in conjunction with convective thermal heating to expedite curing of an imprinted material App 20060219715 - Tandon; Shalabh ; et al.	2006-10-05
Package stress management App 20060065984 - Matayabas; James C. JR. ; et al.	2006-03-30
Radio frequency and microwave radiation used in conjunction with convective thermal heating to expedite curing of an imprinted material App 20060011616 - Tandon; Shalabh ; et al.	2006-01-19
Package stress management App 20060001158 - Matayabas; James C. JR. ; et al.	2006-01-05
Apparatus and method for precise alignment of packaging caps on a substrate App 20040261262 - Clemons, Gregory S. ; et al.	2004-12-30

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