Passmore; Brandon
Patent Applications and Registrations
Patent applications and USPTO patent grants for Passmore; Brandon.The latest application filed is for "power module".
- Passmore; Brandon - Fayetteville AR
| Patent | Date |
|---|---|
| High voltage power module Grant 11,206,740 - Cole , et al. December 21, 2 | 2021-12-21 |
| High voltage power module Grant 11,172,584 - Cole , et al. November 9, 2 | 2021-11-09 |
| Power Module App 20210313256 - McPherson; Brice ; et al. | 2021-10-07 |
| Power module Grant D909,310 - McPherson , et al. February 2, 2 | 2021-02-02 |
| Power module Grant D908,632 - Cole , et al. January 26, 2 | 2021-01-26 |
| High Voltage Power Module App 20200359511 - Cole; Zachary ; et al. | 2020-11-12 |
| Silicon carbide power module Grant 10,784,235 - McPherson , et al. Sept | 2020-09-22 |
| High voltage power module Grant 10,750,627 - Cole , et al. A | 2020-08-18 |
| High Voltage Power Module App 20200053890 - Cole; Zachary ; et al. | 2020-02-13 |
| High voltage power module Grant 10,448,524 - Cole , et al. Oc | 2019-10-15 |
| Silicon Carbide Power Module App 20190237439 - McPherson; Brice ; et al. | 2019-08-01 |
| Low profile, highly configurable, current sharing paralleled wide band gap power device power module Grant 10,136,529 - McPherson , et al. November 20, 2 | 2018-11-20 |
| High voltage power chip module Grant 10,080,301 - Passmore , et al. September 18, 2 | 2018-09-18 |
| High Voltage Power Module App 20180070462 - Cole; Zachary ; et al. | 2018-03-08 |
| High voltage power module Grant 9,839,146 - Cole , et al. December 5, 2 | 2017-12-05 |
| Semiconductor device and fabrication method for the same Grant 9,761,506 - Otsuka , et al. September 12, 2 | 2017-09-12 |
| High Voltage Power Module App 20170112005 - Cole; Zachary ; et al. | 2017-04-20 |
| Low Profile, Highly Configurable, Current Sharing Paralleled Wide Band Gap Power Device Power Module App 20160353590 - McPherson; Brice ; et al. | 2016-12-01 |
| Low profile, highly configurable, current sharing paralleled wide band gap power device power module Grant 9,426,883 - McPherson , et al. August 23, 2 | 2016-08-23 |
| Method for reworkable packaging of high speed, low electrical parasitic power electronics modules through gate drive integration Grant 9,407,251 - Passmore , et al. August 2, 2 | 2016-08-02 |
| Low profile high temperature double sided flip chip power packaging Grant 9,275,938 - McPherson , et al. March 1, 2 | 2016-03-01 |
| Low Profile, Highly Configurable, Current Sharing Paralleled Wide Band Gap Power Device Power Module App 20150216067 - McPherson; Brice ; et al. | 2015-07-30 |
| High Voltage Power Chip Module App 20150131236 - Passmore; Brandon ; et al. | 2015-05-14 |
| Semiconductor Device And Fabrication Method For The Same App 20130221514 - OTSUKA; Takukazu ; et al. | 2013-08-29 |
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