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Clock Phase Management For Die-to-die (d2d) Interconnect
App 20220271912 - Pasdast; Gerald ; et al. | 2022-08-25 |
Valid Signal For Latency Sensitive Die-to-die (d2d) Interconnects
App 20220261308 - Lanka; Narasimha ; et al. | 2022-08-18 |
Clock-gating In Die-to-die (d2d) Interconnects
App 20220262756 - Lanka; Narasimha ; et al. | 2022-08-18 |
Link Initialization Training And Bring Up For Die-to-die Interconnect
App 20220237138 - Lanka; Narasimha ; et al. | 2022-07-28 |
Sideband Interface For Die-to-die Interconnects
App 20220222198 - Lanka; Narasimha ; et al. | 2022-07-14 |
Dual Loop Voltage Regulator
App 20220197321 - Tiagaraj; Sathya Narasimman ; et al. | 2022-06-23 |
Power-forwarding Bridge For Inter-chip Data Signal Transfer
App 20220199537 - Qian; Zhiguo ; et al. | 2022-06-23 |
Multiple dies hardware processors and methods
Grant 11,294,852 - Nassif , et al. April 5, 2 | 2022-04-05 |
Composite Interposer Structure And Method Of Providing Same
App 20220084949 - Elsherbini; Adel ; et al. | 2022-03-17 |
Composite interposer structure and method of providing same
Grant 11,270,947 - Elsherbini , et al. March 8, 2 | 2022-03-08 |
Multiple Dies Hardware Processors And Methods
App 20220050805 - NASSIF; NEVINE ; et al. | 2022-02-17 |
Vias In Composite Ic Chip Structures
App 20220037281 - Elsherbini; Adel ; et al. | 2022-02-03 |
Scalable And Interoperable Phyless Die-to-die Io Solution
App 20210398906 - QIAN; Zhiguo ; et al. | 2021-12-23 |
Vias in composite IC chip structures
Grant 11,205,630 - Elsherbini , et al. December 21, 2 | 2021-12-21 |
Composite Ic Chips Including A Chiplet Embedded Within Metallization Layers Of A Host Ic Chip
App 20210375830 - Elsherbini; Adel ; et al. | 2021-12-02 |
Composite IC chips including a chiplet embedded within metallization layers of a host IC chip
Grant 11,094,672 - Elsherbini , et al. August 17, 2 | 2021-08-17 |
Skip Level Vias In Metallization Layers For Integrated Circuit Devices
App 20210202377 - Elsherbini; Adel ; et al. | 2021-07-01 |
Composite Interposer Structure And Method Of Providing Same
App 20210159179 - Elsherbini; Adel ; et al. | 2021-05-27 |
Packaged device with a chiplet comprising memory resources
Grant 10,998,302 - Elsherbini , et al. May 4, 2 | 2021-05-04 |
Composite Ic Chips Including A Chiplet Embedded Within Metallization Layers Of A Host Ic Chip
App 20210098422 - Elsherbini; Adel ; et al. | 2021-04-01 |
Vias In Composite Ic Chip Structures
App 20210098407 - Elsherbini; Adel ; et al. | 2021-04-01 |
Packaged Device With A Chiplet Comprising Memory Resources
App 20210098440 - Elsherbini; Adel ; et al. | 2021-04-01 |
Inter-die passive interconnects approaching monolithic performance
Grant 10,854,548 - Wu , et al. December 1, 2 | 2020-12-01 |
Multiple Dies Hardware Processors And Methods
App 20200334196 - NASSIF; NEVINE ; et al. | 2020-10-22 |
Multiple dies hardware processors and methods
Grant 10,795,853 - Nassif , et al. October 6, 2 | 2020-10-06 |
Inter-die Passive Interconnects Approaching Monolithic Performance
App 20200211965 - Wu; Zuoguo ; et al. | 2020-07-02 |
Clock phase compensation apparatus and method
Grant 10,686,582 - Pasdast , et al. | 2020-06-16 |
Single Clock Source For A Multiple Die Package
App 20190041895 - Miao; Yingyu ; et al. | 2019-02-07 |
Multiple Dies Hardware Processors And Methods
App 20180101502 - NASSIF; NEVINE ; et al. | 2018-04-12 |
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