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Patent applications and USPTO patent grants for Partosa; Raymond M..The latest application filed is for "system for detecting warped carriers and associated methods".
Patent | Date |
---|---|
System for detecting warped carriers and associated methods Grant 7,326,025 - Viluan , et al. February 5, 2 | 2008-02-05 |
Wire bond integrity test system Grant 7,000,822 - Dacanay , et al. February 21, 2 | 2006-02-21 |
System for detecting warped carriers and associated methods App 20050247541 - Viluan, Ramil A. ;   et al. | 2005-11-10 |
Wire bond integrity test system App 20050112787 - Dacanay, Allan I. ;   et al. | 2005-05-26 |
Method of fabricating wire bond integrity test system Grant 6,808,943 - Dacanay , et al. October 26, 2 | 2004-10-26 |
Wire bond integrity test system App 20030227016 - Dacanay, Allan I. ;   et al. | 2003-12-11 |
Porous ceramic work stations for wire and die bonders Grant 6,650,011 - Partosa , et al. November 18, 2 | 2003-11-18 |
Porous ceramic work stations for wire and die bonders App 20030140470 - Partosa, Raymond M. ;   et al. | 2003-07-31 |
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