| Patent | Date |
|---|
Cyber Risk Analysis And Remediation Using Network Monitored Sensors And Methods Of Use
App 20220255965 - Parthasarathi; Arvind ; et al. | 2022-08-11 |
Cyber risk analysis and remediation using network monitored sensors and methods of use
Grant 11,265,350 - Parthasarathi , et al. March 1, 2 | 2022-03-01 |
Cloud-Based Multi-Tenancy Computing Systems and Methods for Providing Response Control and Analytics
App 20220027828 - Avala; Sai ; et al. | 2022-01-27 |
Cyber Risk Analysis And Remediation Using Network Monitored Sensors And Methods Of Use
App 20190342343 - Parthasarathi; Arvind ; et al. | 2019-11-07 |
Cyber risk analysis and remediation using network monitored sensors and methods of use
Grant 10,404,748 - Parthasarathi , et al. Sep | 2019-09-03 |
Diversity analysis with actionable feedback methodologies
Grant 10,341,376 - Ng , et al. | 2019-07-02 |
Cyber Risk Analysis and Remediation Using Network Monitored Sensors and Methods of Use
App 20160294854 - Parthasarathi; Arvind ; et al. | 2016-10-06 |
Method and device for users of enterprise software products to create, publish and share reviews of enterprise software products
App 20110010349 - Ellingson; Jeffrey Gordon ; et al. | 2011-01-13 |
Tin coatings incorporating selected elemental additions to reduce discoloration
Grant 6,136,460 - Chen , et al. October 24, 2 | 2000-10-24 |
Semiconductor package with molded plastic body
Grant 5,969,414 - Parthasarathi , et al. October 19, 1 | 1999-10-19 |
Anodized aluminum substrate having increased breakdown voltage
Grant 5,688,606 - Mahulikar , et al. November 18, 1 | 1997-11-18 |
Electronic package with improved thermal properties
Grant 5,650,663 - Parthasarathi July 22, 1 | 1997-07-22 |
Components for housing an integrated circuit device
Grant 5,578,869 - Hoffman , et al. November 26, 1 | 1996-11-26 |
Leadframe having exposed, solderable outer lead ends
Grant 5,563,442 - Mahulikar , et al. October 8, 1 | 1996-10-08 |
Method for the assembly of an electronic package
Grant 5,540,378 - Mahulikar , et al. July 30, 1 | 1996-07-30 |
Anodized aluminum substrate having increased breakdown voltage
Grant 5,534,356 - Mahulikar , et al. July 9, 1 | 1996-07-09 |
Lead frames with improved adhesion to a polymer
Grant 5,449,951 - Parthasarathi , et al. September 12, 1 | 1995-09-12 |
Lead frames having a chromium and zinc alloy coating
Grant 5,343,073 - Parthasarathi , et al. August 30, 1 | 1994-08-30 |
Multi-metal layer interconnect tape for tape automated bonding
Grant 4,997,517 - Parthasarathi March 5, 1 | 1991-03-05 |
Whisker resistant tin coatings and baths and methods for making such coatings
Grant 4,749,626 - Kadija , et al. June 7, 1 | 1988-06-07 |
Copper stainproofing technique
Grant 4,647,315 - Parthasarathi , et al. March 3, 1 | 1987-03-03 |
Process for producing electroplated and/or treated metal foil
Grant 4,568,431 - Polan , et al. February 4, 1 | 1986-02-04 |
Preparation for improving the adhesion properties of metal foils
Grant 4,552,627 - Parthasarathi November 12, 1 | 1985-11-12 |
Dendritic treatment of metallic surfaces for improving adhesive bonding
Grant 4,551,210 - Parthasarathi November 5, 1 | 1985-11-05 |
Electrochemical surface preparation for improving the adhesive properties of metallic surfaces
Grant 4,549,941 - Parthasarathi , et al. October 29, 1 | 1985-10-29 |
Systems for producing electroplated and/or treated metal foil
Grant 4,549,950 - Polan , et al. October 29, 1 | 1985-10-29 |
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