loadpatents
name:-0.015568971633911
name:-0.014430999755859
name:-0.00037193298339844
Parris; Gene Everad Patent Filings

Parris; Gene Everad

Patent Applications and Registrations

Patent applications and USPTO patent grants for Parris; Gene Everad.The latest application filed is for "etching compositions and methods for using same".

Company Profile
0.14.16
  • Parris; Gene Everad - Coopersburg PA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Etching compositions and methods for using same
Grant 10,400,167 - Liu , et al. Sep
2019-09-03
Stripping compositions having high WN/W etching selectivity
Grant 10,301,580 - Liu , et al.
2019-05-28
Semi-aqueous photoresist or semiconductor manufacturing residue stripping and cleaning composition with improved silicon passivation
Grant 10,073,351 - Agarwal , et al. September 11, 2
2018-09-11
Photoresist cleaning composition used in photolithography and a method for treating substrate therewith
Grant 10,072,237 - Chang , et al. September 11, 2
2018-09-11
Etchant solutions and method of use thereof
Grant 9,873,833 - Parris , et al. January 23, 2
2018-01-23
Etching Compositions and Methods for Using Same
App 20170145311 - Liu; Wen Dar ;   et al.
2017-05-25
Photoresist Cleaning Composition Used in Photolithography and a Method for Treating Substrate Therewith
App 20170037344 - Chang; Randy Li-Kai ;   et al.
2017-02-09
Etchant Solutions and Method of Use Thereof
App 20160186058 - Parris; Gene Everad ;   et al.
2016-06-30
Stripping Compositions Having High WN/W Etching Selectivity
App 20160186105 - Liu; Wen Dar ;   et al.
2016-06-30
Semi-Aqueous Photoresist or Semiconductor Manufacturing Residue Stripping and Cleaning Composition with Improved Silicon Passivation
App 20160179011 - Agarwal; Rajiv Krishan ;   et al.
2016-06-23
Method for wafer dicing and composition useful thereof
Grant 9,328,318 - Tamboli , et al. May 3, 2
2016-05-03
Method for wafer dicing and composition useful thereof
Grant 8,883,701 - Tamboli , et al. November 11, 2
2014-11-11
Method for Wafer Dicing and Composition Useful Thereof
App 20140170835 - Tamboli; Dnyanesh Chandrakant ;   et al.
2014-06-19
Method for Wafer Dicing and Composition Useful Thereof
App 20120009762 - Tamboli; Dnyanesh Chandrakant ;   et al.
2012-01-12
Immersion lithography fluids
Grant 8,007,986 - Zhang , et al. August 30, 2
2011-08-30
Immersion lithography fluids
Grant 7,879,531 - Zhang , et al. February 1, 2
2011-02-01
Immersion Lithography Fluids
App 20070229795 - Zhang; Peng ;   et al.
2007-10-04
Top coat for lithography processes
App 20070196773 - Weigel; Scott Jeffrey ;   et al.
2007-08-23
Method for removal of flux and other residue in dense fluid systems
App 20070137675 - McDermott; Wayne Thomas ;   et al.
2007-06-21
Processing of substrates with dense fluids comprising acetylenic diols and/or alcohols
Grant 7,211,553 - Subawalla , et al. May 1, 2
2007-05-01
Method for removal of flux and other residue in dense fluid systems
Grant 7,195,676 - McDermott , et al. March 27, 2
2007-03-27
Method for removal of flux and other residue in dense fluid systems
App 20060011217 - McDermott; Wayne Thomas ;   et al.
2006-01-19
Immersion lithography fluids
App 20050173682 - Zhang, Peng ;   et al.
2005-08-11
Immersion lithography fluids
App 20050161644 - Zhang, Peng ;   et al.
2005-07-28
Processing of semiconductor substrates with dense fluids comprising acetylenic diols and/or alcohols
App 20050029492 - Subawalla, Hoshang ;   et al.
2005-02-10
Processing of substrates with dense fluids comprising acetylenic diols and/or alcohols
App 20050029490 - Subawalla, Hoshang ;   et al.
2005-02-10
Dimethyl ether for methyl group attachment on a carbon adjacent to an electron withdrawing group
Grant 6,329,549 - Waller , et al. December 11, 2
2001-12-11

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