Parks; Howard L.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Parks; Howard L..The latest application filed is for "three-dimensional package for semiconductor devices".
- Parks; Howard L. - Los Gatos CA
- Parks; Howard L. - Woodland Hills CA
| Patent | Date |
|---|---|
| Three-dimensional package for semiconductor devices Grant 5,270,571 - Parks , et al. December 14, 1 | 1993-12-14 |
| Pressurized interconnection system for semiconductor chips Grant 5,089,880 - Meyer , et al. February 18, 1 | 1992-02-18 |
| Three-dimensional microelectronic package for semiconductor chips Grant 4,841,355 - Parks June 20, 1 | 1989-06-20 |
| Cooling system for multiwafer high density circuit Grant 4,283,754 - Parks August 11, 1 | 1981-08-11 |
| Method of fabricating an interconnection cable Grant 4,268,956 - Parks , et al. May 26, 1 | 1981-05-26 |
| Flexible connector cable Grant 4,184,729 - Parks , et al. January 22, 1 | 1980-01-22 |
| Component connection system Grant 4,095,867 - Parks June 20, 1 | 1978-06-20 |
| Method Of Fabricating A Multiwafer Electrical Circuit Structure Grant 3,775,844 - Parks December 4, 1 | 1973-12-04 |
| Method Of Making A Batch Fabricated Magnetic Memory Grant 3,708,874 - Parks January 9, 1 | 1973-01-09 |
| Electrical Circuit Packaging Structure And Method Of Fabrication Thereof Grant 3,705,332 - Parks December 5, 1 | 1972-12-05 |
| Batch Fabricated Magnetic Memory Grant 3,623,037 - Parks November 23, 1 | 1971-11-23 |
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