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name:-0.012916803359985
name:-0.0087261199951172
name:-0.0016958713531494
Parkhill; Scott Patent Filings

Parkhill; Scott

Patent Applications and Registrations

Patent applications and USPTO patent grants for Parkhill; Scott.The latest application filed is for "leadframe-based module dc bus design to reduce module inductance".

Company Profile
0.5.8
  • Parkhill; Scott - US
  • Parkhill; Scott - Perrysburg OH
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Leadframe-based Module Dc Bus Design To Reduce Module Inductance
App 20070193763 - Parkhill; Scott ;   et al.
2007-08-23
Leadframe-based module DC bus design to reduce module inductance
Grant 7,193,860 - Parkhill , et al. March 20, 2
2007-03-20
Leadframe-based module DC bus design to reduce module inductance
App 20060082983 - Parkhill; Scott ;   et al.
2006-04-20
Leadframe-based module DC bus design to reduce module inductance
Grant 7,012,810 - Parkhill , et al. March 14, 2
2006-03-14
Leadframe-based module DC bus design to reduce module inductance
App 20060028806 - Parkhill; Scott ;   et al.
2006-02-09
Substrate-level DC bus design to reduce module inductance
Grant 6,845,017 - Ahmed , et al. January 18, 2
2005-01-18
Press (non-soldered) contacts for high current electrical connections in power modules
Grant 6,793,502 - Parkhill , et al. September 21, 2
2004-09-21
EMI reduction in power modules through the use of integrated capacitors on the substrate level
Grant 6,636,429 - Maly , et al. October 21, 2
2003-10-21
Leadframe-based module DC bus design to reduce module inductance
App 20020167828 - Parkhill, Scott ;   et al.
2002-11-14
EMI reduction in power modules through the use of integrated capacitors on the substrate level
App 20020126465 - Maly, Douglas ;   et al.
2002-09-12
Substrate-level DC bus design to reduce module inductance
App 20020118560 - Ahmed, Sayeed ;   et al.
2002-08-29
Press (non-soldered) contacts for high current electrical connections in power modules
App 20020111050 - Parkhill, Scott ;   et al.
2002-08-15
Leadframe-based module DC bus design to reduce module inductance
App 20020034088 - Parkhill, Scott ;   et al.
2002-03-21

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