Park; Yun Mook

Patent Applications and Registrations

Patent applications and USPTO patent grants for Park; Yun Mook.The latest application filed is for "chip package and manufacturing method thereof".

Company Profile

1.6.6

Park; Yun Mook - Cheongju-si KR
Park; Yun-Mook - Pyeongtaek-si KR
Park; Yun Mook - Chungcheongbuk-do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Chip package with connection portion that passes through an encapsulation portion Grant 11,264,330 - Kwon , et al. March 1, 2	2022-03-01
Chip Package And Manufacturing Method Thereof App 20210151379 - KWON; Yongtae ; et al.	2021-05-20
Semiconductor package and method of manufacturing the same Grant 9,564,411 - Park , et al. February 7, 2	2017-02-07
Semiconductor Package And Method Of Manufacturing The Same App 20140353823 - Park; Yun-Mook ; et al.	2014-12-04
Bump structure and fabrication method thereof Grant 8,237,276 - Song , et al. August 7, 2	2012-08-07
Bump Structure And Fabrication Method Thereof App 20110285015 - Song; Chi Jung ; et al.	2011-11-24
Bump with multiple vias for semiconductor package and fabrication method thereof, and semiconductor package utilizing the same Grant 7,977,789 - Park July 12, 2	2011-07-12
Semiconductor package having a crack-propagation preventing unit Grant 7,919,833 - Park April 5, 2	2011-04-05
Wafer level system in package and fabrication method thereof Grant 7,906,842 - Park March 15, 2	2011-03-15
Bump With Multiple Vias For Semiconductor Package And Fabrication Method Thereof, And Semiconductor Package Utilizing The Same App 20090283903 - Park; Yun Mook	2009-11-19
Crack Resistant Semiconductor Package And Method Of Fabricating The Same App 20090091001 - PARK; Yun Mook	2009-04-09
Wafer Level System In Package And Fabrication Method Thereof App 20080290496 - PARK; Yun Mook	2008-11-27

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