Park; Young-Kuk

Patent Applications and Registrations

Patent applications and USPTO patent grants for Park; Young-Kuk.The latest application filed is for "adhesive on wire stacked semiconductor package".

Company Profile

0.11.13

Park; Young-Kuk - Gyeongsangbuk-do KR
Park; Young Kuk - Seoul KR
Park; Young-Kuk - Yongin-si KR
Park; Young-Kuk - Yongin KR
Park; Young-Kuk - Yongin-city KR
Park, Young-Kuk - Uiseong-gun KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Apparatus for cutting a liquid crystal display panel and method thereof Grant 8,191,750 - Park June 5, 2	2012-06-05
Adhesive on wire stacked semiconductor package Grant 8,143,727 - Oh , et al. March 27, 2	2012-03-27
Adhesive On Wire Stacked Semiconductor Package App 20110089564 - Oh; Kwang Seok ; et al.	2011-04-21
Adhesive on wire stacked semiconductor package Grant 7,863,723 - Oh , et al. January 4, 2	2011-01-04
Transmitter and transmitting method thereof in wireless communication system Grant 7,796,958 - Seo , et al. September 14, 2	2010-09-14
Transmitter and transmitting method thereof in wireless communication system Grant 7,783,268 - Seo , et al. August 24, 2	2010-08-24
Digital intermediate frequency transmitter for wireless communication Grant 7,590,391 - Seo , et al. September 15, 2	2009-09-15
I/Q modulator using current-mixing and direct conversion wireless communication transmitter using the same Grant 7,580,478 - Seo , et al. August 25, 2	2009-08-25
Adhesive on wire stacked semiconductor package App 20090134507 - Oh; Kwang Seok ; et al.	2009-05-28
Transmitter and Transmitting Method Thereof In Wireless Communication System App 20090054013 - Seo; Hae-Moon ; et al.	2009-02-26
Transmitter and Transmitting Method Thereof In Wireless Communication System App 20090054014 - SEO; Hae-Moon ; et al.	2009-02-26
Method of forming a stacked semiconductor package Grant 7,485,490 - Oh , et al. February 3, 2	2009-02-03
Digital Intermediate Frequency Transmitter For Wireless Communication App 20080132182 - SEO; Hae-Moon ; et al.	2008-06-05
Multi-band ZigBee transceiver supporting IEEE 802.15.4 wireless communication Grant 7,260,360 - Seo , et al. August 21, 2	2007-08-21
I/Q modulator using current-mixing and direct conversion wireless communication transmitter using the same App 20070058751 - Seo; Hae-Moon ; et al.	2007-03-15
Method of forming a stacked semiconductor package App 20060071315 - Oh; Kwang Seok ; et al.	2006-04-06
Multi-band zigbee transceiver supporting IEEE 802.15.4 wireless communication App 20060019700 - Seo; Hae Moon ; et al.	2006-01-26
Apparatus for cutting a liquid crystal display panel and method thereof App 20050061123 - Park, Young-Kuk	2005-03-24
Wire bonding method for a semiconductor package Grant 6,803,254 - Park , et al. October 12, 2	2004-10-12
Wire bonding method and semiconductor package manufactured using the same Grant 6,642,610 - Park , et al. November 4, 2	2003-11-04
Wire bonding method for a semiconductor package App 20030199118 - Park, Young Kuk ; et al.	2003-10-23
Stacking structure of semiconductor chips and semiconductor package using it App 20020125556 - Oh, Kwang Seok ; et al.	2002-09-12
Wire bonding method and semiconductor package manufactured using the same App 20020064905 - Park, Young Kuk ; et al.	2002-05-30
Semiconductor package and manufacturing method thereof App 20010004128 - Park, Young Kuk ; et al.	2001-06-21

Company Registrations

SEC

0001772581

Park Young Kuk

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