Park; Yeong-Lyeol

Patent Applications and Registrations

Patent applications and USPTO patent grants for Park; Yeong-Lyeol.The latest application filed is for "methods of fabricating semiconductor devices with blocking layer patterns".

Company Profile

0.16.18

Park; Yeong-Lyeol - Yongin-si KR
Park; Yeong-Lyeol - Gyeonggi-do KR
Park; Yeong-Lyeol - Suji-gu KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Methods of fabricating semiconductor devices with blocking layer patterns Grant 9,559,002 - Lee , et al. January 31, 2	2017-01-31
Semiconductor package having magnetic substance and related equipment Grant 9,437,554 - Ji , et al. September 6, 2	2016-09-06
Semiconductor devices including protection patterns and methods of forming the same Grant 9,293,415 - Kim , et al. March 22, 2	2016-03-22
Methods Of Fabricating Semiconductor Devices With Blocking Layer Patterns App 20160020145 - Lee; Seung-Taek ; et al.	2016-01-21
Semiconductor Devices Including Protection Patterns And Methods Of Forming The Same App 20150340314 - KIM; Eun-Ji ; et al.	2015-11-26
Semiconductor devices having back side bonding structures Grant 9,147,640 - Lee , et al. September 29, 2	2015-09-29
Method of fabricating semiconductor devices having through-silicon via (TSV) structures Grant 9,087,885 - Ji , et al. July 21, 2	2015-07-21
Semiconductor Devices App 20150137388 - KIM; Eun-Ji ; et al.	2015-05-21
Semiconductor Package Having Magnetic Substance And Related Equipment App 20150130075 - Ji; Sang-Wook ; et al.	2015-05-14
Method Of Fabricating Semiconductor Devices Having Through-silicon Via (tsv) Structures App 20150064899 - JI; SANG-WOOK ; et al.	2015-03-05
Integrated circuit devices including through-silicon via (TSV) contact pads electronically insulated from a substrate Grant 8,890,282 - Lee , et al. November 18, 2	2014-11-18
Semiconductor devices with stress relief layers Grant 8,841,754 - Kang , et al. September 23, 2	2014-09-23
Semiconductor device and method of manufacturing a semiconductor device Grant 8,836,109 - Yun , et al. September 16, 2	2014-09-16
Interposer Chip, Multi-chip Package Including The Interposer Chip, And Method Of Manufacturing The Same App 20140225113 - PARK; Yeong-Lyeol ; et al.	2014-08-14
Interposer chip, multi-chip package including the interposer chip, and method of manufacturing the same Grant 8,729,684 - Park , et al. May 20, 2	2014-05-20
Integrated Circuit Devices Including Through-Silicon Via (TSV) Contact Pads Electronically Insulated from a Substrate App 20140124951 - Lee; Woon-Seob ; et al.	2014-05-08
Semiconductor Devices Having Back Side Bonding Structures App 20140084375 - Lee; Woon-Seob ; et al.	2014-03-27
Semiconductor device Grant 8,592,988 - Lee , et al. November 26, 2	2013-11-26
Semiconductor Devices With Stress Relief Layers And Methods Of Manufacturing The Same App 20130249045 - Kang; Sin-Woo ; et al.	2013-09-26
Method Of Inspecting And Manufacturing A Stack Chip Package App 20130052760 - CHO; Sung-Dong ; et al.	2013-02-28
Semiconductor Device And Method Of Manufacturing A Semiconductor Device App 20120199970 - Yun; Ki-Young ; et al.	2012-08-09
Semiconductor Device App 20120056330 - Lee; Ho-Jin ; et al.	2012-03-08
Interposer Chip, Multi-chip Package Including The Interposer Chip, And Method Of Manufacturing The Same App 20120051019 - Park; Yeong-Lyeol ; et al.	2012-03-01
Method and system for managing wafer processing Grant 7,801,636 - Lee , et al. September 21, 2	2010-09-21
Test pattern and method of monitoring defects using the same Grant 7,705,621 - Lee , et al. April 27, 2	2010-04-27
Test Pattern And Method Of Monitoring Defects Using The Same App 20080084223 - Lee; Hyock-Jun ; et al.	2008-04-10
Method And System For Managing Wafer Processing App 20080077269 - Lee; Nam-young ; et al.	2008-03-27

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