Park; SooMoon

Patent Applications and Registrations

Patent applications and USPTO patent grants for Park; SooMoon.The latest application filed is for "semiconductor device and method of forming mold underfill using dispensing needle having same width as semiconductor die".

Company Profile

0.9.9

Park; SooMoon - Kyonggi-do KR
Park; SooMoon - Jinju-si N/A KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device and method of forming mold underfill using dispensing needle having same width as semiconductor die Grant 8,785,251 - Park , et al. July 22, 2	2014-07-22
Integrated circuit packaging system with thermal dispersal structures and method of manufacture thereof Grant 8,692,365 - Moon , et al. April 8, 2	2014-04-08
Semiconductor Device and Method of Forming Mold Underfill Using Dispensing Needle Having Same Width as Semiconductor Die App 20140004659 - Park; SooMoon ; et al.	2014-01-02
Semiconductor device and method of forming mold underfill using dispensing needle having same width as semiconductor die Grant 8,569,895 - Park , et al. October 29, 2	2013-10-29
Integrated Circuit Packaging System With Thermal Dispersal Structures And Method Of Manufacture Thereof App 20120319267 - Moon; DongSoo ; et al.	2012-12-20
Semiconductor Device and Method of Forming Mold Underfill Using Dispensing Needle Having Same Width as Semiconductor Die App 20120211904 - Park; SooMoon ; et al.	2012-08-23
Semiconductor device and method of forming mold underfill using dispensing needle having same width as semiconductor die Grant 8,193,036 - Park , et al. June 5, 2	2012-06-05
Integrated circuit package system flip chip Grant 8,143,096 - Park , et al. March 27, 2	2012-03-27
Semiconductor Device and Method of Forming Mold Underfill Using Dispensing Needle Having Same Width as Semiconductor Die App 20120061858 - Park; SooMoon ; et al.	2012-03-15
Integrated circuit packaging system with interconnect and method of manufacture thereof Grant 8,115,293 - Moon , et al. February 14, 2	2012-02-14
Integrated Circuit Packaging System With Interconnect And Method Of Manufacture Thereof App 20110133325 - Moon; DongSoo ; et al.	2011-06-09
Integrated Circuit Packaging System With Post Type Interconnector And Method Of Manufacture Thereof App 20100244212 - Ha; Jong-Woo ; et al.	2010-09-30
Semiconductor Substrate and Method of Forming Conformal Solder Wet-Enhancement Layer on Bump-on-Lead Site App 20100237500 - Kwon; ChoongHwan ; et al.	2010-09-23
Integrated circuit package system with underfill Grant 7,682,872 - Park , et al. March 23, 2	2010-03-23
Integrated Circuit Package System Flip Chip App 20100044882 - Park; SooMoon ; et al.	2010-02-25
Integrated Circuit Package System With Underfill App 20080211111 - Park; SooMoon ; et al.	2008-09-04

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