Park; Soojae

Patent Applications and Registrations

Patent applications and USPTO patent grants for Park; Soojae.The latest application filed is for "stress mitigation in organic laminates".

Company Profile

1.14.17

Park; Soojae - Asan-Si KR
Park; Soojae - Gyeonggi-do KR
Park; Soojae - Seongnam-si KR
Park; Soojae - Wappingers Falls NY US

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Stress mitigation in organic laminates Grant 11,315,803 - Sri-Jayantha , et al. April 26, 2	2022-04-26
Stress Mitigation In Organic Laminates App 20210358769 - Sri-Jayantha; Sri M. ; et al.	2021-11-18
Semiconductor Package And Method Of Fabricating The Same App 20210043592 - Park; Soojae ; et al.	2021-02-11
Printed circuit board and semiconductor package including the same Grant 10,777,495 - Park Sept	2020-09-15
Printed Circuit Board And Semiconductor Package Including The Same App 20190252306 - PARK; SOOJAE	2019-08-15
Package frame and method of manufacturing semiconductor package using the same Grant 10,147,616 - Park , et al. De	2018-12-04
Package substrate, method for fabricating the same, and package device including the package substrate Grant 10,134,666 - Park , et al. November 20, 2	2018-11-20
Package Substrate, Method For Fabricating The Same, And Package Device Including The Package Substrate App 20180211909 - PARK; Soojae ; et al.	2018-07-26
Package substrate, method for fabricating the same, and package device including the package substrate Grant 9,960,107 - Park , et al. May 1, 2	2018-05-01
Package Substrate, Method For Fabricating The Same, And Package Device Including The Package Substrate App 20170194240 - PARK; Soojae ; et al.	2017-07-06
Package Substrate And Methods For Manufacturing The Same App 20160329275 - PARK; Soojae ; et al.	2016-11-10
Semiconductor package having magnetic connection member Grant 9,402,315 - Chun , et al. July 26, 2	2016-07-26
Semiconductor package Grant 9,397,052 - Park , et al. July 19, 2	2016-07-19
Semiconductor packages including heat exhaust part Grant 9,391,009 - Jang , et al. July 12, 2	2016-07-12
Package Frame And Method Of Manufacturing Semiconductor Package Using The Same App 20160120032 - PARK; SOOJAE ; et al.	2016-04-28
Semiconductor Package Having Magnetic Connection Member App 20150115468 - CHUN; Hyunsuk ; et al.	2015-04-30
Semiconductor Packages Including Heat Exhaust Part App 20150054148 - JANG; Eon-Soo ; et al.	2015-02-26
Semiconductor Package App 20150048522 - PARK; Soojae ; et al.	2015-02-19
Curvilinear heat spreader/lid with improved heat dissipation Grant 8,877,566 - Gaynes , et al. November 4, 2	2014-11-04
Integrated framework for finite-element methods for package, device and circuit co-design Grant 8,352,230 - Kim , et al. January 8, 2	2013-01-08
Curvilinear Heat Spreader/lid With Improved Heat Dissipation App 20120309132 - Gaynes; Michael A. ; et al.	2012-12-06
Method Of Joining A Chip On A Substrate App 20120292375 - Blais; Pascal P. ; et al.	2012-11-22
Curvilinear heat spreader/lid with improved heat dissipation Grant 8,269,340 - Gaynes , et al. September 18, 2	2012-09-18
Integrated Framework for Finite-Element Methods for Package, Device and Circuit Co-Design App 20110224951 - Kim; Keunwoo ; et al.	2011-09-15
Method Of Joining A Chip On A Substrate App 20110049221 - Blais; Pascal P. ; et al.	2011-03-03
Method and apparatus for thermally induced testing of materials under transient temperature Grant 7,516,674 - Feger , et al. April 14, 2	2009-04-14
Curvilinear Heat Spreader/lid With Improved Heat Dissipation App 20090072387 - Gaynes; Michael A. ; et al.	2009-03-19

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