Park; Soo-San

Patent Applications and Registrations

Patent applications and USPTO patent grants for Park; Soo-San.The latest application filed is for "integrated circuit packaging system with thermal dispersal structures and method of manufacture thereof".

Company Profile

0.41.35

Park; Soo-San - Seoul N/A KR
Park; Soo-San - Singapore SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Integrated circuit packaging system having dual sided connection and method of manufacture thereof Grant 8,906,740 - Ko , et al. December 9, 2	2014-12-09
Stacked integrated circuit package system with face to face stack configuration Grant 8,810,018 - Ha , et al. August 19, 2	2014-08-19
Integrated circuit package system with waferscale spacer Grant 8,692,388 - Lee , et al. April 8, 2	2014-04-08
Integrated circuit packaging system with thermal dispersal structures and method of manufacture thereof Grant 8,692,365 - Moon , et al. April 8, 2	2014-04-08
Integrated circuit packaging system with encapsulation and underfill and method of manufacture thereof Grant 8,685,797 - Park , et al. April 1, 2	2014-04-01
Integrated circuit packaging system with ultra-thin die Grant 8,581,380 - Park , et al. November 12, 2	2013-11-12
Integrated circuit package system with stackable devices and a method of manufacture thereof Grant 8,559,185 - Lee , et al. October 15, 2	2013-10-15
Integrated circuit packaging system with cavity and method of manufacture thereof Grant 8,390,110 - Lee , et al. March 5, 2	2013-03-05
Integrated circuit package system employing an offset stacked configuration and method for manufacturing thereof Grant 8,383,458 - Choi , et al. February 26, 2	2013-02-26
Integrated Circuit Packaging System With Thermal Dispersal Structures And Method Of Manufacture Thereof App 20120319267 - Moon; DongSoo ; et al.	2012-12-20
Integrated Circuit Packaging System With Encapsulation And Underfill And Method Of Manufacture Thereof App 20120319266 - Park; Soo-San ; et al.	2012-12-20
Integrated Circuit Package System With Waferscale Spacer App 20120261810 - Lee; Sang-Ho ; et al.	2012-10-18
Integrated circuit packaging system with encapsulation and underfill and method of manufacture thereof Grant 8,273,607 - Park , et al. September 25, 2	2012-09-25
Integrated Circuit Package System With Stackable Devices And A Method Of Manufacture Thereof App 20120228767 - Lee; Sang-Ho ; et al.	2012-09-13
Mountable integrated circuit package system with intra-stack encapsulation Grant 8,247,893 - Kim , et al. August 21, 2	2012-08-21
Integrated circuit package system with waferscale spacer Grant 8,211,749 - Lee , et al. July 3, 2	2012-07-03
Integrated circuit package system for stackable devices Grant 8,189,344 - Lee , et al. May 29, 2	2012-05-29
Integrated circuit packaging system with interconnect and method of manufacture thereof Grant 8,115,293 - Moon , et al. February 14, 2	2012-02-14
Integrated circuit package system Grant 8,102,666 - Park , et al. January 24, 2	2012-01-24
Integrated circuit package-in-package system with side-by-side and offset stacking and method for manufacturing thereof Grant 8,093,727 - Park , et al. January 10, 2	2012-01-10
Integrated Circuit Packaging System With Encapsulation And Underfill And Method Of Manufacture Thereof App 20110312133 - Park; Soo-San ; et al.	2011-12-22
Integrated circuit package system for stackable devices Grant 8,067,307 - Choi , et al. November 29, 2	2011-11-29
System for solder ball inner stacking module connection Grant 8,067,828 - Ko , et al. November 29, 2	2011-11-29
Integrated circuit package system including wafer level spacer Grant 8,039,365 - Lee , et al. October 18, 2	2011-10-18
Integrated circuit packaging system with interposer and method of manufacture thereof Grant 8,004,073 - Ko , et al. August 23, 2	2011-08-23
Integrated Circuit Packaging System Having Dual Sided Connection And Method Of Manufacture Thereof App 20110186994 - Ko; Chan Hoon ; et al.	2011-08-04
Integrated circuit packaging system with package-on-package and method of manufacture thereof Grant 7,968,995 - Ko , et al. June 28, 2	2011-06-28
Integrated Circuit Packaging System With Interconnect And Method Of Manufacture Thereof App 20110133325 - Moon; DongSoo ; et al.	2011-06-09
Integrated Circuit Packaging System With Cavity And Method Of Manufacture Thereof App 20110089554 - Lee; Sang-Ho ; et al.	2011-04-21
Integrated Circuit Package System Employing An Offset Stacked Configuration And Method For Manufacturing Thereof App 20110084373 - Choi; DaeSik ; et al.	2011-04-14
Integrated circuit packaging system having dual sided connection and method of manufacture thereof Grant 7,923,290 - Ko , et al. April 12, 2	2011-04-12
Integrated circuit package system employing an offset stacked configuration Grant 7,872,340 - Choi , et al. January 18, 2	2011-01-18
Integrated circuit package system with molding vents Grant 7,863,761 - Lee , et al. January 4, 2	2011-01-04
Integrated Circuit Packaging System With Interposer And Method Of Manufacture Thereof App 20100320619 - Ko; Chan Hoon ; et al.	2010-12-23
Integrated Circuit Package-in-package System With Side-by-side And Offset Stacking And Method For Manufacturing Thereof App 20100320621 - Park; Soo-San ; et al.	2010-12-23
Integrated Circuit Packaging System With Package-on-package And Method Of Manufacture Thereof App 20100314736 - Ko; Chan Hoon ; et al.	2010-12-16
Integrated circuit package system with net spacer Grant 7,829,986 - Lee , et al. November 9, 2	2010-11-09
Integrated circuit package-in-package system with side-by-side and offset stacking Grant 7,812,435 - Park , et al. October 12, 2	2010-10-12
Integrated Circuit Packaging System Having Dual Sided Connection And Method Of Manufacture Thereof App 20100244221 - Ko; Chan Hoon ; et al.	2010-09-30
System for removal of an integrated circuit from a mount material Grant 7,763,145 - Park July 27, 2	2010-07-27
Integrated circuit package system with arched pedestal Grant 7,687,919 - Park March 30, 2	2010-03-30
Integrated Circuit Package System App 20100046183 - Park; HyungSang ; et al.	2010-02-25
Integrated circuit package-in-package system with carrier interposer Grant 7,659,609 - Ha , et al. February 9, 2	2010-02-09
Integrated circuit package system including stacked die Grant 7,652,376 - Park , et al. January 26, 2	2010-01-26
Integrated Circuit Package System For Stackable Devices App 20090303690 - Lee; Sang-Ho ; et al.	2009-12-10
System For Solder Ball Inner Stacking Module Connection App 20090230532 - Ko; Chan Hoon ; et al.	2009-09-17
Integrated Circuit Package System For Stackable Devices App 20090212408 - Choi; DaeSik ; et al.	2009-08-27
Mountable Integrated Circuit Package System With Intra-stack Encapsulation App 20090166886 - Kim; YoungJoon ; et al.	2009-07-02
Integrated Circuit Package System With Flip Chip App 20090152740 - Park; Soo-San ; et al.	2009-06-18
Integrated Circuit Package-on-package System With Stacking Via Interconnect App 20090140408 - Lee; Taewoo ; et al.	2009-06-04
Integrated Circuit Package-in-package System With Carrier Interposer App 20090057862 - Ha; Jong-Woo ; et al.	2009-03-05
Integrated Circuit Package System Employing An Offset Stacked Configuration App 20090057864 - Choi; DaeSik ; et al.	2009-03-05
Integrated Circuit Package-in-package System With Side-by-side And Offset Stacking App 20090057861 - Park; Soo-San ; et al.	2009-03-05
Integrated Circuit Package System Including Stacked Die App 20090014899 - Park; Soo-San ; et al.	2009-01-15
Integrated Circuit Package System With Symmetric Packaging App 20090001549 - Park; Soo-San ; et al.	2009-01-01
Integrated circuit package system including stacked die Grant 7,456,088 - Park , et al. November 25, 2	2008-11-25
Integrated Circuit Package System With Waferscale Spacer App 20080042245 - Lee; Sang-Ho ; et al.	2008-02-21
Integrated Circuit Package System With Molding Vents App 20080029873 - Lee; Dal Jae ; et al.	2008-02-07
Integrated Circuit Package System Including Wafer Level Spacer App 20080012095 - Lee; Sang-Ho ; et al.	2008-01-17
Integrated Circuit Packaging System With Ultra-thin Die App 20080006921 - Park; Soo-San ; et al.	2008-01-10
Integrated Circuit Package System With Net Spacer App 20070235846 - Lee; Sang-Ho ; et al.	2007-10-11
System For Removal Of An Integrated Circuit From A Mount Material App 20070215672 - Park; Soo-San	2007-09-20
Stacked Integrated Circuit Package System With Face To Face Stack Configuration App 20070181998 - Ha; Jong-Woo ; et al.	2007-08-09
Integrated Circuit Package System Including Stacked Die App 20070158833 - Park; Soo-San ; et al.	2007-07-12
System for peeling semiconductor chips from tape Grant 7,238,258 - Park , et al. July 3, 2	2007-07-03
Integrated Circuit Package System With Arched Pedestal App 20070108621 - Park; Soo-San	2007-05-17
System For Peeling Semiconductor Chips From Tape App 20060237142 - Park; Soo-San ; et al.	2006-10-26

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