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Patent applications and USPTO patent grants for Park; Soo Moon.The latest application filed is for "bonding wire for semiconductor package and semiconductor package including same".
Patent | Date |
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Bonding wire for semiconductor package and semiconductor package including same Grant 9,735,331 - Park , et al. August 15, 2 | 2017-08-15 |
Bonding Wire For Semiconductor Package And Semiconductor Package Including Same App 20170148963 - PARK; Soo Moon ;   et al. | 2017-05-25 |
Semiconductor device and method of forming uniform height insulating layer over interposer frame as standoff for semiconductor die Grant 8,877,567 - Lee , et al. November 4, 2 | 2014-11-04 |
Semiconductor Device and Method of Forming Uniform Height Insulating Layer Over Interposer Frame as Standoff for Semiconductor Die App 20120126395 - Lee; KyungHoon ;   et al. | 2012-05-24 |
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