Park; Seyang
Patent Applications and Registrations
Patent applications and USPTO patent grants for Park; Seyang.The latest application filed is for "method and apparatus for electroplating".
- Park; Seyang - Beaverton OR
| Patent | Date |
|---|---|
| Method and apparatus for electroplating Grant 8,308,931 - Reid , et al. November 13, 2 | 2012-11-13 |
| Two step process for uniform across wafer deposition and void free filling on ruthenium coated wafers Grant 7,799,684 - Reid , et al. September 21, 2 | 2010-09-21 |
| Method and apparatus for electroplating App 20100032310 - Reid; Jonathan ; et al. | 2010-02-11 |
| Anneal of ruthenium seed layer to improve copper plating Grant 7,442,267 - Webb , et al. October 28, 2 | 2008-10-28 |
| Methods for the electrochemical deposition of copper onto a barrier layer of a work piece Grant 7,405,157 - Reid , et al. July 29, 2 | 2008-07-29 |
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