Park; Seung-yong

Patent Applications and Registrations

Patent applications and USPTO patent grants for Park; Seung-yong.The latest application filed is for "glass laminate article and method of manufacturing the same".

Company Profile

3.1.13

Park; Seung-yong - Asan-si KR
PARK; Seung Yong - Seongnam-si KR
Park; Seung Yong - ChungCheongNam-Do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Glass Laminate Article And Method Of Manufacturing The Same App 20220088904 - Park; Cheol Hee ; et al.	2022-03-24
Wired/wireless Integrated Open Fronthaul Device App 20220070078 - PARK; Seung Yong ; et al.	2022-03-03
Open Fronthaul Device App 20220070080 - PARK; Seung Yong ; et al.	2022-03-03
Integrated Wired/wireless Network Intermediary Device, And Deep Packet Matching Method Therefor App 20220070090 - PARK; Seung Yong ; et al.	2022-03-03
Wired/wireless Convergence Network Packet Relay Device And Packet Timestamp Assigning Method Thereof App 20220070079 - PARK; Seung Yong ; et al.	2022-03-03
Open Fronthaul Network System App 20220070091 - PARK; Seung Yong ; et al.	2022-03-03
Integrated wire and wireless network packet broker and method for GTP correlation assigning method of the same Grant 10,904,140 - Park , et al. January 26, 2	2021-01-26
Integrated Wire And Wireless Network Packet Broker And Method For Gtp Correlation Assigning Method Of The Same App 20200344156 - PARK; Seung Yong ; et al.	2020-10-29
Intergrated Wire And Wireless Network Packet Broker And Method For Matching Deep Packet Of The Same App 20200259741 - A1	2020-08-13
Bonded Substrate And Method Of Manufacturing The Same App 20130093063 - Shur; Joong Won ; et al.	2013-04-18
Method Of Cleaving Substrate And Method Of Manufacturing Bonded Substrate Using The Same App 20130029473 - KIM; Dong-Woon ; et al.	2013-01-31
GaN BONDED SUBSTRATE AND METHOD OF MANUFACTURING GaN BONDED SUBSTRATE App 20130029472 - PARK; BONGMO ; et al.	2013-01-31

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