PARK; Se Chuel

Patent Applications and Registrations

Patent applications and USPTO patent grants for PARK; Se Chuel.The latest application filed is for "apparatus for and method of polishing surface of substrate".

Company Profile

1.10.11

PARK; Se Chuel - Changwon-si KR
Park; Se-Chuel - Changwon KR
Park; Se-Chuel - Changwon-city KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Apparatus For And Method Of Polishing Surface Of Substrate App 20210107094 - KANG; Sung Il ; et al.	2021-04-15
Lead frame, semiconductor package including the lead frame, and method of manufacturing the lead frame Grant 9,171,789 - Shin , et al. October 27, 2	2015-10-27
Lead frame and semiconductor package manufactured by using the same Grant 9,142,495 - Paek , et al. September 22, 2	2015-09-22
Lead frame and semiconductor package including the same Grant 8,937,378 - Paek , et al. January 20, 2	2015-01-20
Lead Frame And Semiconductor Package Manufactured By Using The Same App 20140319666 - Paek; Sung-Kwan ; et al.	2014-10-30
Lead Frame, Semiconductor Package Including The Lead Frame, And Method Of Manufacturing The Lead Frame App 20140252580 - SHIN; Dong-Il ; et al.	2014-09-11
Printed circuit board with multiple metallic layers and method of manufacturing the same Grant 8,409,726 - Shim , et al. April 2, 2	2013-04-02
Circuit Board Viaholes And Method Of Manufacturing The Same App 20120279775 - Shim; Chang-han ; et al.	2012-11-08
Circuit board viaholes and method of manufacturing the same Grant 8,278,564 - Shim , et al. October 2, 2	2012-10-02
Lead Frame And Semiconductor Package Including The Same App 20120175758 - Paek; Sung-kwan ; et al.	2012-07-12
Printed Circuit Board With Multiple Metallic Layers And Method Of Manufacturing The Same App 20100116528 - Shim; Chang-han ; et al.	2010-05-13
Circuit Board Viaholes And Method Of Manufacturing The Same App 20090283316 - Shim; Chang-han ; et al.	2009-11-19
Lead frame for semiconductor package Grant 7,285,845 - Kang , et al. October 23, 2	2007-10-23
Lead frame and method of manufacturing the same Grant 7,268,021 - Paek , et al. September 11, 2	2007-09-11
Lead frame and method for manufacturing semiconductor package with the same Grant 7,250,671 - Lee , et al. July 31, 2	2007-07-31
Lead frame for semiconductor package and method of manufacturing the same App 20060237824 - Lee; Sang-hun ; et al.	2006-10-26
Lead frame for semiconductor package App 20060231931 - Kang; Sung-il ; et al.	2006-10-19
Lead frame and method of manufacturing the same App 20050233566 - Paek, Sung-kwan ; et al.	2005-10-20
Lead frame and method for manufacturing semiconductor package with the same App 20050184366 - Lee, Sang-hun ; et al.	2005-08-25

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