| Patent | Date |
|---|
Semiconductor package
Grant 11,417,612 - Park , et al. August 16, 2 | 2022-08-16 |
Plurality of contact electrode connected to a light emitting element
Grant 11,393,964 - Kim , et al. July 19, 2 | 2022-07-19 |
Light Emitting Diode Display Device
App 20220140029 - PARK; Sang Ho ; et al. | 2022-05-05 |
Display Device And Method Of Manufacturing The Same
App 20220052108 - PARK; Mi Jin ; et al. | 2022-02-17 |
Light emitting diode display device
Grant 11,233,104 - Park , et al. January 25, 2 | 2022-01-25 |
Display Device And Manufacturing Method Thereof
App 20210335892 - LEE; Jin Woo ; et al. | 2021-10-28 |
Pharmaceutical Composition For Treating Cancer, Containing Guide Rna And Endonuclease As Active Ingredients
App 20210128697 - CHOE; Sunghwa ; et al. | 2021-05-06 |
Display Device
App 20210134768 - Lee; Sung Jin ; et al. | 2021-05-06 |
Display Device
App 20210111323 - KIM; Jin Yeong ; et al. | 2021-04-15 |
Method Of Manufacturing Display Device And Display Device
App 20210111303 - LEE; Sung Jin ; et al. | 2021-04-15 |
Sequence-specific In Vivo Cell Targeting
App 20210077594 - IN; Sungyong ; et al. | 2021-03-18 |
Light Emitting Diode Display Device
App 20210043707 - PARK; Sang Ho ; et al. | 2021-02-11 |
Semiconductor package
Grant 10,854,561 - Park , et al. December 1, 2 | 2020-12-01 |
Semiconductor Package
App 20200365527 - PARK; Ji Eun ; et al. | 2020-11-19 |
Semiconductor package
Grant 10,756,030 - Park , et al. A | 2020-08-25 |
Semiconductor Package
App 20200235058 - Park; Mi Jin ; et al. | 2020-07-23 |
Semiconductor Package
App 20200051928 - PARK; Ji Eun ; et al. | 2020-02-13 |
Semiconductor package
Grant 10,559,541 - Park , et al. Feb | 2020-02-11 |
Semiconductor Package
App 20190393168 - PARK; Mi Jin ; et al. | 2019-12-26 |
Fan-out Semiconductor Package
App 20170365567 - KIM; Yun Bog ; et al. | 2017-12-21 |
Printed Circuit Board And Electronic Component Module
App 20160198568 - PARK; Mi Jin ; et al. | 2016-07-07 |
Printed circuit board including a plurality of circuit layers and method for manufacturing the same
Grant 9,253,880 - Park , et al. February 2, 2 | 2016-02-02 |
Plug via stacked structure, stacked substrate having via stacked structure and manufacturing method thereof
Grant 9,236,339 - Park , et al. January 12, 2 | 2016-01-12 |
Asymmetrical multilayer substrate, RF module, and method for manufacturing asymmetrical multilayer substrate
Grant 9,204,533 - Christian , et al. December 1, 2 | 2015-12-01 |
Circuit board
Grant 9,095,068 - Park , et al. July 28, 2 | 2015-07-28 |
Semiconductor package and semiconductor package module having the same
Grant 8,987,888 - Park , et al. March 24, 2 | 2015-03-24 |
Interposer Substrate And Method Of Manufacturing The Same
App 20150055312 - LEE; Jeong Ho ; et al. | 2015-02-26 |
Printed Circuit Board
App 20140338955 - Park; Mi Jin ; et al. | 2014-11-20 |
Interposer-embedded printed circuit board
Grant 8,830,689 - Kim , et al. September 9, 2 | 2014-09-09 |
Semiconductor Substrate Having Crack Preventing Structure And Method Of Manufacturing The Same
App 20140061864 - HYUN; Jin Gul ; et al. | 2014-03-06 |
Plug Via Stacked Structure, Stacked Substrate Having Via Stacked Structure And Manufacturing Method Thereof
App 20130320561 - PARK; Seung Wook ; et al. | 2013-12-05 |
Interconnection structure, interposer, semiconductor package, and method of manufacturing interconnection structure
Grant 8,582,314 - Park , et al. November 12, 2 | 2013-11-12 |
Semiconductor package module and electric circuit assembly with the same
Grant 8,581,394 - Park , et al. November 12, 2 | 2013-11-12 |
Circuit Board
App 20130199833 - Park; Seung Wook ; et al. | 2013-08-08 |
Circuit Board
App 20130168143 - Park; Seung Wook ; et al. | 2013-07-04 |
Printed Circuit Board And Method For Manufacturing The Same
App 20130133928 - PARK; Mi Jin ; et al. | 2013-05-30 |
Semiconductor Package And Semiconductor Package Module Having The Same
App 20130127053 - PARK; Mi Jin ; et al. | 2013-05-23 |
Asymmetrical Multilayer Substrate, Rf Module, And Method For Manufacturing Asymmetrical Multilayer Substrate
App 20130106528 - Christian; Romero ; et al. | 2013-05-02 |
Package Substrate With Mesh Pattern And Method For Manufacturing The Same
App 20130075144 - PARK; Mi Jin ; et al. | 2013-03-28 |
Resistor having parallel structure and method of fabricating the same
Grant 8,373,537 - Park , et al. February 12, 2 | 2013-02-12 |
Semiconductor Package Module And Electric Circuit Assembly With The Same
App 20110309501 - Park; Seung Wook ; et al. | 2011-12-22 |
Resistor having parallel structure and method of fabricating the same
App 20110273266 - Park; Mi Jin ; et al. | 2011-11-10 |
Circuit board and method for manufacturing the same
App 20110269413 - Park; Seung Wook ; et al. | 2011-11-03 |
Interconnection structure, interposer, semiconductor package, and method of manufacturing interconnection structure
App 20110176285 - Park; Seung Wook ; et al. | 2011-07-21 |
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