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name:-0.0093519687652588
name:-0.0044839382171631
name:-0.0030591487884521
Park; Kunsang Patent Filings

Park; Kunsang

Patent Applications and Registrations

Patent applications and USPTO patent grants for Park; Kunsang.The latest application filed is for "semiconductor device and semiconductor package".

Company Profile
2.6.8
  • Park; Kunsang - Hwaseong-si KR
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Semiconductor device
Grant 11,342,221 - Hwang , et al. May 24, 2
2022-05-24
Semiconductor Device And Semiconductor Package
App 20220037236 - SEO; JUBIN ;   et al.
2022-02-03
Semiconductor Device Including Through Substrate Vias And Method Of Manufacturing The Semiconductor Device
App 20210351112 - PARK; MYUNGJOO ;   et al.
2021-11-11
Semiconductor device including through substrate vias and method of manufacturing the semiconductor device
Grant 11,101,196 - Park , et al. August 24, 2
2021-08-24
Semiconductor Device
App 20210066123 - Hwang; Jaewon ;   et al.
2021-03-04
Semiconductor Device Including Through Substrate Vias And Method Of Manufacturing The Semiconductor Device
App 20210020544 - PARK; Myungjoo ;   et al.
2021-01-21
Methods for fabricating semiconductor devices having through electrodes
Grant 9,543,200 - Park , et al. January 10, 2
2017-01-10
Semiconductor devices including through silicon via electrodes and methods of fabricating the same
Grant 9,153,559 - Lee , et al. October 6, 2
2015-10-06
Semiconductor devices having through electrodes
Grant 8,872,351 - Moon , et al. October 28, 2
2014-10-28
Methods for Fabricating Semiconductor Devices Having Through Electrodes
App 20140235052 - Park; Kunsang ;   et al.
2014-08-21
Semiconductor Devices Having Through Electrodes And Methods For Fabricating The Same
App 20130200526 - Moon; Kwangjin ;   et al.
2013-08-08
Semiconductor Devices Including Through Silicon Via Electrodes And Methods Of Fabricating The Same
App 20130127019 - LEE; Dosun ;   et al.
2013-05-23

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