Park; Jun Heyoung

Patent Applications and Registrations

Patent applications and USPTO patent grants for Park; Jun Heyoung.The latest application filed is for "semiconductor package and electromagnetic interference shielding structure for the same".

Company Profile

4.13.21

Park; Jun Heyoung - Suwon-si KR
Park; Jun Heyoung - Gyunggi-do N/A KR
Park; Jun-Heyoung - Hwaseong-si KR
Park; Jun-Heyoung - Chungcheongbuk-do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor package and electromagnetic interference shielding structure for the same Grant 10,847,474 - Kim , et al. November 24, 2	2020-11-24
Fan-out semiconductor package Grant 10,790,255 - Kim , et al. September 29, 2	2020-09-29
Semiconductor Package And Electromagnetic Interference Shielding Structure For The Same App 20200152580 - KIM; Woon Chun ; et al.	2020-05-14
Fan-out Semiconductor Package App 20200105703 - Kim; Woon Chun ; et al.	2020-04-02
Electromagnetic Interference Shielding Structure And Semiconductor Package Including The Same App 20190371737 - KIM; Woon Chun ; et al.	2019-12-05
Method of manufacturing cooling fin and package substrate with cooling fin Grant 8,377,748 - Lee , et al. February 19, 2	2013-02-19
Printed circuit board and manufacturing method thereof Grant 8,222,534 - Park , et al. July 17, 2	2012-07-17
Printed Circuit Board App 20120175162 - MOK; Jee Soo ; et al.	2012-07-12
Method Of Manufacturing A Printed Circuit Board App 20120168205 - HWANG; Jun-Oh ; et al.	2012-07-05
Method of manufacturing a printed circuit board Grant 8,166,647 - Hwang , et al. May 1, 2	2012-05-01
Method of fabricating a printed circuit board Grant 8,161,634 - Mok , et al. April 24, 2	2012-04-24
Method Of Fabricating Multilayer Printed Circuit Board App 20120080401 - MOK; Jee Soo ; et al.	2012-04-05
Method of manufacturing cooling fin and package substrate with cooling fin App 20110308069 - LEE; Eung Suek ; et al.	2011-12-22
Method of manufacturing printed circuit board Grant 8,065,798 - Kim , et al. November 29, 2	2011-11-29
Printed circuit board and manufacturing method thereof Grant 8,058,558 - Mok , et al. November 15, 2	2011-11-15
Method of manufacturing printed circuit board App 20110099807 - Kim; Dong Sun ; et al.	2011-05-05
Method of fabricating paste bump for printed circuit board Grant 7,841,074 - Mok , et al. November 30, 2	2010-11-30
Manufacturing method for printed circuit board Grant 7,836,590 - Mok , et al. November 23, 2	2010-11-23
Printed circuit board and fabricating method of the same Grant 7,794,820 - Kim , et al. September 14, 2	2010-09-14
Method for manufacturing printed circuit board having embedded component Grant 7,653,991 - Mok , et al. February 2, 2	2010-02-02
Printed Circuit Board And Manufacturing Method Thereof App 20090321109 - Hwang; Jun-Oh ; et al.	2009-12-31
Printed circuit board and method of manufacturing the same App 20090308650 - Lee; Eung Suek ; et al.	2009-12-17
Cooling fin and package substrate comprising the cooling fin and manufacturing method thereof App 20090294956 - Lee; Eung Suek ; et al.	2009-12-03
Manufacturing method for printed circuit board App 20090013525 - Mok; Jee-Soo ; et al.	2009-01-15
Multilayer printed circuit board and method of fabricating the same App 20080308315 - Mok; Jee Soo ; et al.	2008-12-18
Method of fabricating paste bump for printed circuit board App 20080307641 - Mok; Jee Soo ; et al.	2008-12-18
Printed circuit board and manufacturing method thereof App 20080310132 - Park; Jun-Heyoung ; et al.	2008-12-18
Printed circuit board and method of fabricating the same App 20080296055 - Mok; Jee Soo ; et al.	2008-12-04
Method for manufacturing printed circuit board having embedded component App 20080263860 - Mok; Jee-Soo ; et al.	2008-10-30
Printed circuit board and manufacturing method thereof App 20080115961 - Mok; Jee-Soo ; et al.	2008-05-22
Printed circuit board and method of manufacturing the same App 20080053688 - Park; Jun Heyoung ; et al.	2008-03-06
Printed circuit board and fabricating method of the same App 20080038523 - Kim; Dong Sun ; et al.	2008-02-14
Method of fabricating PCB in parallel manner App 20060029726 - Mok; Jee-Soo ; et al.	2006-02-09

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.