Park; Joo Hun

Patent Applications and Registrations

Patent applications and USPTO patent grants for Park; Joo Hun.The latest application filed is for "flip chip".

Company Profile

1.6.7

Park; Joo Hun - Osan-si KR
Park; Joo Hun - Kyungki-Do KR
Park; Joo Hun - Suwon KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Flip chip Grant 10,546,827 - Shim , et al. Ja	2020-01-28
Flip Chip App 20170358546 - SHIM; Young Seok ; et al.	2017-12-14
Stack type surface acoustic wave package, and method for manufacturing the same Grant 7,820,468 - Lee , et al. October 26, 2	2010-10-26
Stack Type Surface Acoustic Wave Package, And Method For Manufacturing The Same App 20100047949 - Lee; Seung Hee ; et al.	2010-02-25
Stack type surface acoustic wave package, and method for manufacturing the same Grant 7,336,017 - Lee , et al. February 26, 2	2008-02-26
Stack Type Surface Acoustic Wave Package, And Method For Manufacturing The Same App 20070145541 - LEE; Seung Hee ; et al.	2007-06-28
Stack type surface acoustic wave package, and method for manufacturing the same App 20060249824 - Lee; Seung Hee ; et al.	2006-11-09
Method for fabricating surface acoustic wave filter packages and package sheet used therein Grant 7,045,385 - Kim , et al. May 16, 2	2006-05-16
Method for fabricating surface acoustic wave filter package Grant 6,928,719 - Kim , et al. August 16, 2	2005-08-16
Method for fabricating surface acoustic wave filter packages and package sheet used therein App 20050042804 - Kim, Tae Hoon ; et al.	2005-02-24
Method for fabricating surface acoustic wave filter packages Grant 6,670,206 - Kim , et al. December 30, 2	2003-12-30
Method for fabricating surface acoustic wave filter packages App 20030109077 - Kim, Tae Hoon ; et al.	2003-06-12
Method for fabricating surface acoustic wave filter package App 20030009864 - Kim, Tae Hoon ; et al.	2003-01-16

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