PARK; Jong Ik
Patent Applications and Registrations
Patent applications and USPTO patent grants for PARK; Jong Ik.The latest application filed is for "inductor".
- PARK; Jong Ik - Suwon-si KR
- PARK; Jong Ik - Seoul KR
- Park; Jong-Ik - Gyeonggi-do KR
| Patent | Date |
|---|---|
| Inductor App 20200343038 - PARK; Jong Ik | 2020-10-29 |
| Coil Component App 20200312536 - PARK; Jong Ik | 2020-10-01 |
| Inductor Grant 10,734,157 - Park | 2020-08-04 |
| Actuator Coil Structure And Method For Manufacturing Same App 20200227984 - PARK; Jong Ik | 2020-07-16 |
| Coil component Grant 9,984,804 - Park , et al. May 29, 2 | 2018-05-29 |
| Coating apparatus and method of forming coating layer using the same Grant 9,931,663 - Jeong , et al. April 3, 2 | 2018-04-03 |
| Coating Apparatus And Method Of Forming Coating Layer Using The Same App 20170120282 - JEONG; Tae-Kyun ; et al. | 2017-05-04 |
| Coating apparatus including nozzle cleaning mechanism and method of forming coating layer using the same Grant 9,561,521 - Jeong , et al. February 7, 2 | 2017-02-07 |
| Coil component and board having the same Grant 9,490,061 - Park , et al. November 8, 2 | 2016-11-08 |
| Inductor App 20160322154 - PARK; Jong Ik | 2016-11-03 |
| Chip Component And Method Of Manufacturing The Same App 20160307688 - PARK; Jong Ik | 2016-10-20 |
| Coil Component And Board Having The Same App 20160268039 - PARK; Jong Ik ; et al. | 2016-09-15 |
| Coil Component App 20160217909 - PARK; Jong Ik ; et al. | 2016-07-28 |
| Coating Apparatus And Method Of Forming Coating Layer Using The Same App 20120107514 - JEONG; Tae-Kyun ; et al. | 2012-05-03 |
| Multi-wavelength semiconductor laser device Grant 7,460,579 - Park , et al. December 2, 2 | 2008-12-02 |
| Multi-wavelength semiconductor laser device App 20060093007 - Moon; Ki Won ; et al. | 2006-05-04 |
| Semiconductor laser device and process for preparing the same App 20060093003 - Moon; Ki Won ; et al. | 2006-05-04 |
| Semiconductor laser diode having a PCB type lead frame App 20050063434 - Park, Chan Wang ; et al. | 2005-03-24 |
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