Patent | Date |
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Thermoplastic Resin Composition and Molded Product Manufactured Therefrom App 20220275194 - PARK; Jee Kwon ;   et al. | 2022-09-01 |
Thermoplastic resin composition for laser direct structuring process and article comprising the same Grant 11,312,832 - Park , et al. April 26, 2 | 2022-04-26 |
Thermally-conductive resin composition, and complex comprising same Grant 11,208,554 - Park , et al. December 28, 2 | 2021-12-28 |
Thermoplastic Resin Composition and Molded Article Produced Therefrom App 20210340366 - PARK; Jee Kwon ;   et al. | 2021-11-04 |
Lens barrel member Grant 11,002,938 - Park , et al. May 11, 2 | 2021-05-11 |
Thermoplastic resin composition for laser direct structuring, and molded article comprising same Grant 10,899,900 - Jung , et al. January 26, 2 | 2021-01-26 |
Thermoplastic Resin Composition for Laser Direct Structuring, and Molded Article Comprising Same App 20200148849 - JUNG; Yoo Jin ;   et al. | 2020-05-14 |
Thermally-Conductive Resin Composition, and Complex Comprising Same App 20190338117 - PARK; Jee Kwon ;   et al. | 2019-11-07 |
Lens Barrel Member App 20190196133 - PARK; Jee Kwon ;   et al. | 2019-06-27 |
Thermoplastic Resin Composition for Laser Direct Structuring Process and Article Comprising the Same App 20190177499 - PARK; Jee Kwon ;   et al. | 2019-06-13 |
Thermoplastic Resin Composition for Laser Direct Structuring Process and Composite Comprising the Same App 20180187007 - Kim; Jung Ki ;   et al. | 2018-07-05 |
Thermoplastic Resin Composition for Laser Direct Structuring Process and Article Comprising the Same App 20180171138 - JUNG; Yoo Jin ;   et al. | 2018-06-21 |
Polyamide Resin Composition and Article Produced Therefrom App 20170029621 - KIM; Nam Hyun ;   et al. | 2017-02-02 |
Composite and Molded Product Thereof App 20140361223 - Park; Jee Kwon ;   et al. | 2014-12-11 |
Thermoplastic Resin Composition with EMI Shielding Properties App 20140238736 - Youm; Kyoung Tae ;   et al. | 2014-08-28 |
High-Rigidity Electromagnetic Shielding Composition and Molded Articles Thereof App 20130177765 - LIM; Yoon Sook ;   et al. | 2013-07-11 |
Bracket for Protecting Liquid Crystal Display (LCD) of Portable Display Device App 20130165576 - SHIN; Chan Gyun ;   et al. | 2013-06-27 |
High flow thermoplastic resin composition with excellent chemical resistance, impact resistance and gloss Grant 8,389,628 - Park , et al. March 5, 2 | 2013-03-05 |
Thermoplastic resin composition with good heat stability, light stability, and impact strength Grant 8,080,618 - Kim , et al. December 20, 2 | 2011-12-20 |
Styrenic thermoplastic resin composition having excellent impact resistance and paintability Grant 8,080,619 - Lee , et al. December 20, 2 | 2011-12-20 |
Chemical and impact resistant thermoplastic resin composition having improved extrudability Grant 8,080,611 - Park , et al. December 20, 2 | 2011-12-20 |
Molded Article for Electronic Device Housing and Method for Preparing the Same App 20110159259 - Park; Jee Kwon ;   et al. | 2011-06-30 |
Chemical-resistant and impact-resistant thermoplastic resin composition with excellent hydrolysis resistance Grant 7,919,559 - Park , et al. April 5, 2 | 2011-04-05 |
Chemical and Impact Resistant Thermoplastic Resin Composition Having Improved Extrudability App 20100249314 - PARK; Jee Kwon ;   et al. | 2010-09-30 |
High Flow Thermoplastic Resin Composition with Excellent Chemical Resistance, Impact Resistance and Gloss App 20100168315 - PARK; Jee Kwon ;   et al. | 2010-07-01 |
Environmentally Sound Thermoplastic Resin Composition Using Recycled Polyester Resin App 20100152359 - PARK; Jee Kwon ;   et al. | 2010-06-17 |
Styrenic Thermoplastic Resin Composition Having Excellent Impact Resistance and Paintability App 20100010146 - LEE; Jae Won ;   et al. | 2010-01-14 |
Thermoplastic Resin Composition with Good Heat Stability, Light Stability, and Impact Strength App 20090318588 - KIM; Jun Myung ;   et al. | 2009-12-24 |
Chemical-Resistant and Impact-Resistant Thermoplastic Resin Composition with Excellent Hydrolysis Resistance App 20090170735 - PARK; Jee Kwon ;   et al. | 2009-07-02 |