loadpatents
name:-0.0094318389892578
name:-0.0057458877563477
name:-0.0049011707305908
PARK; Je Sang Patent Filings

PARK; Je Sang

Patent Applications and Registrations

Patent applications and USPTO patent grants for PARK; Je Sang.The latest application filed is for "antenna substrate".

Company Profile
5.6.11
  • PARK; Je Sang - Suwon-si KR
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Antenna Substrate
App 20220190479 - LEE; Yang Je ;   et al.
2022-06-16
Substrate Having Electronic Component Embedded Therein
App 20220130766 - BYUN; Dae Jung ;   et al.
2022-04-28
Printed Circuit Board And Electronic Package Comprising The Same
App 20220104347 - Park; Je Sang ;   et al.
2022-03-31
Substrate having electronic component embedded therein
Grant 11,251,133 - Byun , et al. February 15, 2
2022-02-15
Substrate with electronic component embedded therein
Grant 11,244,905 - Park , et al. February 8, 2
2022-02-08
Substrate having electronic component embedded therein
Grant 11,183,462 - Hwang , et al. November 23, 2
2021-11-23
Substrate having electronic component embedded therein
Grant 11,075,156 - Byun , et al. July 27, 2
2021-07-27
Substrate Having Electronic Component Embedded Therein
App 20210193580 - BYUN; Dae Jung ;   et al.
2021-06-24
Substrate Having Electronic Component Embedded Therein
App 20210193563 - Byun; Dae Jung ;   et al.
2021-06-24
Electronic Component Embedded Substrate
App 20210193609 - Hwang; Mi Sun ;   et al.
2021-06-24
Substrate Having Electronic Component Embedded Therein
App 20210183784 - HWANG; Mi Sun ;   et al.
2021-06-17
Substrate Embedded Electronic Component Package
App 20210183774 - BYUN; Dae Jung ;   et al.
2021-06-17
Substrate With Electronic Component Embedded Therein
App 20210183783 - Park; Je Sang ;   et al.
2021-06-17
Substrate Having Electronic Component Embedded Therein
App 20210175159 - PARK; Je Sang ;   et al.
2021-06-10
Printed circuit board
Grant 10,925,163 - Park , et al. February 16, 2
2021-02-16
Printed Circuit Board
App 20200396839 - PARK; Je Sang ;   et al.
2020-12-17
Electronic component embedded substrate
Grant 10,863,627 - Park , et al. December 8, 2
2020-12-08

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