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Patent applications and USPTO patent grants for PARK; Je Sang.The latest application filed is for "antenna substrate".
Patent | Date |
---|---|
Antenna Substrate App 20220190479 - LEE; Yang Je ;   et al. | 2022-06-16 |
Substrate Having Electronic Component Embedded Therein App 20220130766 - BYUN; Dae Jung ;   et al. | 2022-04-28 |
Printed Circuit Board And Electronic Package Comprising The Same App 20220104347 - Park; Je Sang ;   et al. | 2022-03-31 |
Substrate having electronic component embedded therein Grant 11,251,133 - Byun , et al. February 15, 2 | 2022-02-15 |
Substrate with electronic component embedded therein Grant 11,244,905 - Park , et al. February 8, 2 | 2022-02-08 |
Substrate having electronic component embedded therein Grant 11,183,462 - Hwang , et al. November 23, 2 | 2021-11-23 |
Substrate having electronic component embedded therein Grant 11,075,156 - Byun , et al. July 27, 2 | 2021-07-27 |
Substrate Having Electronic Component Embedded Therein App 20210193580 - BYUN; Dae Jung ;   et al. | 2021-06-24 |
Substrate Having Electronic Component Embedded Therein App 20210193563 - Byun; Dae Jung ;   et al. | 2021-06-24 |
Electronic Component Embedded Substrate App 20210193609 - Hwang; Mi Sun ;   et al. | 2021-06-24 |
Substrate Having Electronic Component Embedded Therein App 20210183784 - HWANG; Mi Sun ;   et al. | 2021-06-17 |
Substrate Embedded Electronic Component Package App 20210183774 - BYUN; Dae Jung ;   et al. | 2021-06-17 |
Substrate With Electronic Component Embedded Therein App 20210183783 - Park; Je Sang ;   et al. | 2021-06-17 |
Substrate Having Electronic Component Embedded Therein App 20210175159 - PARK; Je Sang ;   et al. | 2021-06-10 |
Printed circuit board Grant 10,925,163 - Park , et al. February 16, 2 | 2021-02-16 |
Printed Circuit Board App 20200396839 - PARK; Je Sang ;   et al. | 2020-12-17 |
Electronic component embedded substrate Grant 10,863,627 - Park , et al. December 8, 2 | 2020-12-08 |
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