Park; Jae Man

Patent Applications and Registrations

Patent applications and USPTO patent grants for Park; Jae Man.The latest application filed is for "gas diffusion layer for fuel cell, method of manufacturing the same, and unit cell for fuel cell including the same".

Company Profile

8.39.51

Park; Jae Man - Yongin-si KR
PARK; Jae Man - Suwon-si KR
Park; Jae Man - Hwaseong-si KR
Park; Jae Man - Cheongju-si KR
PARK; Jae Man - Seoul KR
Park; Jae Man - Incheon KR
Park; Jae Man - Jinju-si KR
Park; Jae Man - Gyunggi-do KR
PARK; Jae Man - Suwon KR
Park; Jae-Man - Yongin Gyeonggi-Do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Gas Diffusion Layer for Fuel Cell, Method of Manufacturing the Same, and Unit Cell for Fuel Cell Including the Same App 20220200017 - Lee; Ji Han ; et al.	2022-06-23
Camera Module App 20220103731 - PARK; Jae Man ; et al.	2022-03-31
Gas diffusion layer for fuel cell and method for manufacturing the same Grant 11,276,863 - Park , et al. March 15, 2	2022-03-15
Device for folding emergency exit seat for bus Grant 11,235,688 - Park February 1, 2	2022-02-01
Multiple Perforation Plate for Separator of Fuel Cell App 20220021008 - Noh; Seung Tak ; et al.	2022-01-20
Camera Module App 20210294113 - PARK; Jae Man ; et al.	2021-09-23
Single-sided high feed cutting insert and cutting tool equipped with same Grant 11,117,201 - Lee , et al. September 14, 2	2021-09-14
High-feed cutting insert and cutting tool equipped with same Grant 11,117,202 - Lee , et al. September 14, 2	2021-09-14
Gas Diffusion Layer For Fuel Cell And Method For Manufacturing The Same App 20210184223 - Park; Jae Man ; et al.	2021-06-17
Device For Folding Emergency Exit Seat For Bus App 20210078465 - Park; Jae Man	2021-03-18
Heat-radiating Substrate App 20200369935 - NA; Se Woong ; et al.	2020-11-26
Printed Circuit Board And Manufacturing Method Therefor App 20200236789 - CHUNG; Hee Young ; et al.	2020-07-23
Electronic device, compiling method and computer-readable recording medium Grant 10,635,421 - Park , et al.	2020-04-28
Gas diffusion layer for fuel cells and method of manufacturing the same Grant 10,593,957 - Park , et al.	2020-03-17
High-feed Cutting Insert And Cutting Tool Equipped With Same App 20200023446 - LEE; Sang Yong ; et al.	2020-01-23
Single-sided High Feed Cutting Insert And Cutting Tool Equipped With Same App 20190388981 - LEE; Sang Yong ; et al.	2019-12-26
Inorganic filler, epoxy resin composition including the same and light emitting element including insulating layer using the composition Grant 10,392,499 - Yun , et al. A	2019-08-27
Epoxy resin composite and printed circuit board comprising insulating layer using the same Grant 10,280,289 - Gu , et al.	2019-05-07
Electronic Device, Compiling Method And Computer-readable Recording Medium App 20180203678 - PARK; Jae-man ; et al.	2018-07-19
Gas Diffusion Layer for Fuel Cells and Method of Manufacturing the Same App 20180175393 - Park; Jae Man ; et al.	2018-06-21
Epoxy resin compound and radiant heat circuit board using the same Grant 9,974,172 - Kim , et al. May 15, 2	2018-05-15
Inorganic filler, resin composition comprising the same and heat radiation substrate using the same Grant 9,902,841 - Ju , et al. February 27, 2	2018-02-27
Radiant heat circuit board and method for manufacturing the same Grant 9,844,142 - Cho , et al. December 12, 2	2017-12-12
Inorganic Filler, Resin Composition Comprising The Same And Heat Radiation Substrate Using The Same App 20170233554 - JU; Sang A ; et al.	2017-08-17
Inorganic filler, resin composition comprising the same and heat radiation substrate using the same Grant 9,670,340 - Ju , et al. June 6, 2	2017-06-06
Interior lamp for vehicle having air vent Grant 9,657,961 - Park May 23, 2	2017-05-23
Inorganic Filler, Epoxy Resin Composition Including The Same And Light Emitting Element Including Insulating Layer Using The Composition App 20170130033 - YUN; Sung Jin ; et al.	2017-05-11
Inorganic Filler, Resin Composition Comprising The Same And Heat Radiation Substrate Using The Same App 20170058107 - Ju; Sang A ; et al.	2017-03-02
Epoxy Resin Composite And Printed Circuit Board Comprising Insulating Layer Using The Same App 20170051133 - Gu; Jina ; et al.	2017-02-23
Radiant heat circuit board, heat generating device package having the same, and backlight unit Grant 9,549,458 - Park , et al. January 17, 2	2017-01-17
Inorganic filler, resin composition comprising the same and heat radiation substrate using the same Grant 9,505,914 - Ju , et al. November 29, 2	2016-11-29
Epoxy resin composition, and printed circuit board using same Grant 9,468,096 - Yun , et al. October 11, 2	2016-10-11
Epoxy resin composition and printed circuit board including insulating layer using the epoxy resin composition Grant 9,462,689 - Kil , et al. October 4, 2	2016-10-04
Epoxy resin compound and radiant heat circuit board using the same Grant 9,451,695 - Park , et al. September 20, 2	2016-09-20
Inorganic Filler, Resin Composition Comprising The Same And Heat Radiation Substrate Using The Same App 20160222195 - JU; Sang A ; et al.	2016-08-04
Epoxy resin compound and radiant heat circuit board using the same Grant 9,357,630 - Moon , et al. May 31, 2	2016-05-31
Radiant heat circuit board, method of manufacturing the same, heat generating device package having the same, and backlight Grant 9,307,675 - Park , et al. April 5, 2	2016-04-05
Epoxy resin compound and radiant heat circuit board using the same Grant 9,282,637 - Yun , et al. March 8, 2	2016-03-08
Multilayer ceramic electronic component and method of manufacturing the same Grant 9,245,689 - Lee , et al. January 26, 2	2016-01-26
Multilayer ceramic electronic component Grant 9,202,629 - Kim , et al. December 1, 2	2015-12-01
Epoxy Resin Composition And Printed Circuit Board Using Same App 20150334827 - KIM; Myeong Jeong ; et al.	2015-11-19
Interior Lamp For Vehicle Having Air Vent App 20150321602 - Park; Jae Man	2015-11-12
Epoxy Resin Composition And Printed Circuit Board Including Insulating Layer Using The Epoxy Resin Composition App 20150305152 - KIL; Geon Young ; et al.	2015-10-22
Nickel nanoparticle, method of preparing the same, and multilayer ceramic capacitor using the same Grant 9,053,857 - Lee , et al. June 9, 2	2015-06-09
Multilayer ceramic electronic component and mounting board therefor Grant 9,040,840 - Chung , et al. May 26, 2	2015-05-26
Epoxy resin, epoxy resin compound comprising the same, and radiant heat circuit board using the compound Grant 9,000,071 - Park , et al. April 7, 2	2015-04-07
Multi-layered ceramic electronic component and method of manufacturing the same Grant 8,964,354 - Park , et al. February 24, 2	2015-02-24
Multilayer ceramic electronic component and method of manufacturing the same Grant 8,941,973 - Kim , et al. January 27, 2	2015-01-27
Multilayer Ceramic Electronic Component And Method Of Manufacturing The Same App 20150022944 - LEE; Seung Ho ; et al.	2015-01-22
Multilayer Ceramic Electronic Component App 20140376150 - KIM; Jong Han ; et al.	2014-12-25
Multilayer Ceramic Electronic Component And Mounting Board Therefor App 20140326494 - CHUNG; Eun Sun ; et al.	2014-11-06
Epoxy Resin Compound And Radiant Heat Circuit Board Using The Same App 20140318835 - Kim; Hae Yeon ; et al.	2014-10-30
Epoxy Resin Compound And Radiant Heat Circuit Board Using The Same App 20140318839 - Moon; Sung Bae ; et al.	2014-10-30
Multilayer ceramic electronic component having an average surface roughness to provide adhesion strength between a dielectric layer and inner electrode and fabrication method thereof Grant 8,867,190 - Kim , et al. October 21, 2	2014-10-21
Epoxy Resin Compound And Radiant Heat Circuit Board Using The Same App 20140290996 - Moon; Sung Bae ; et al.	2014-10-02
Epoxy Resin Compound And Radiant Heat Circuit Board Using The Same App 20140290986 - Kim; Eun Jin ; et al.	2014-10-02
Epoxy Resin Compound And Radiant Heat Circuit Board Using The Same App 20140231122 - Park; Jae Man ; et al.	2014-08-21
Multi-layered Ceramic Electronic Component And Method Of Manufacturing The Same App 20140104748 - PARK; Ye Jun ; et al.	2014-04-17
Epoxy Resin Compound And Radiant Heat Circuit Board Using The Same App 20140048316 - YUN; Sung Jin ; et al.	2014-02-20
Nickel Nanoparticle, Method Of Preparing The Same, And Multilayer Ceramic Capacitor Using The Same App 20130321976 - LEE; Ro Woon ; et al.	2013-12-05
Epoxy Resin, Epoxy Resin Compound Comprising The Same, And Radiant Heat Circuit Board Using The Compound App 20130284502 - PARK; Jae Man ; et al.	2013-10-31
Multilayer Ceramic Electronic Component And Method Of Manufacturing The Same App 20130286538 - KIM; Jong Han ; et al.	2013-10-31
Radiant Heat Circuit Board, Heat Generating Device Package Having The Same, And Backlight Unit App 20130206459 - Park; Hyun Gyu ; et al.	2013-08-15
Radiant Heat Circuit Board, Method Of Manufacturing The Same, Heat Generating Device Package Having The Same, And Backlight App 20130188359 - Park; Hyun Gyu ; et al.	2013-07-25
Radiant Heat Circuit Board And Method For Manufacturing The Same App 20130118782 - Cho; In Hee ; et al.	2013-05-16
Multilayer Ceramic Electronic Component And Fabrication Method Thereof App 20130063862 - KIM; Jong Han ; et al.	2013-03-14
Multilayered Ceramic Electronic Component And Manufacturing Method Thereof App 20130002388 - KIM; Jong Han ; et al.	2013-01-03
Conductive Paste Composition For Inner Electrode, Laminated Ceramic Electronic Part Using The Same And Manufacturing Method Thereof App 20120154976 - LEE; Jai Joon ; et al.	2012-06-21
PSSC complex girder Grant 7,107,730 - Park September 19, 2	2006-09-19
PSSC complex girder App 20040040233 - Park, Jae-Man	2004-03-04

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