Park; Hyung Sang

Patent Applications and Registrations

Patent applications and USPTO patent grants for Park; Hyung Sang.The latest application filed is for "method of depositing silicon oxide films".

Company Profile

2.26.39

Park; Hyung Sang - Seoul-si KR
Park; Hyung Sang - Seoul KR
Park; Hyung Sang - Kyoung-gi-Do KR
Park; Hyung Sang - Kyoggi-do N/A KR
Park; Hyung Sang - Yongin-si KR
Park; Hyung-Sang - Kyunggi-do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method Of Depositing Silicon Oxide Films App 20220145452 - Yoon; Tae Ho ; et al.	2022-05-12
Method of depositing silicon oxide films Grant 11,261,523 - Yoon , et al. March 1, 2	2022-03-01
Trap Device For Powder Coating Apparatus App 20210162428 - Hong; Woong Pyo ; et al.	2021-06-03
Method Of Depositing Silicon Oxide Films App 20200385859 - Yoon; Tae Ho ; et al.	2020-12-10
Surface Treatment Apparatus For Surface-treating Powder And Method Of Surface-treating Powder Using The Same App 20200263299 - Hong; Woong Pyo ; et al.	2020-08-20
Method of forming semiconductor patterns Grant RE47,170 - Beynet , et al. Dec	2018-12-18
System And Method For Atomic Layer Deposition App 20180274096 - PARK; Hyung Sang ; et al.	2018-09-27
Method for forming Si-containing film using two precursors by ALD Grant 8,912,101 - Tsuji , et al. December 16, 2	2014-12-16
Semiconductor device and method of forming vertically offset conductive pillars over first substrate aligned to vertically offset BOT interconnect sites formed over second substrate Grant 8,896,133 - Cho , et al. November 25, 2	2014-11-25
Lateral-flow deposition apparatus and method of depositing film by using the apparatus Grant 8,778,083 - Kim , et al. July 15, 2	2014-07-15
Deposition apparatus Grant 8,747,948 - Park , et al. June 10, 2	2014-06-10
Method for Forming Si-Containing Film Using Two Precursors by ALD App 20130244446 - Tsuji; Naoto ; et al.	2013-09-19
Semiconductor Device and Method of Forming Vertically Offset Conductive Pillars Over First Substrate Aligned to Vertically Offset BOT Interconnect Sites Formed Over Second Substrate App 20130234324 - Cho; SungWon ; et al.	2013-09-12
Semiconductor device and method of making single layer substrate with asymmetrical fibers and reduced warpage Grant 8,502,391 - Park , et al. August 6, 2	2013-08-06
Semiconductor device and method of forming vertically offset conductive pillars over first substrate aligned to vertically offset BOT interconnect sites formed over second substrate Grant 8,492,197 - Cho , et al. July 23, 2	2013-07-23
Semiconductor Device and Method of Making Single Layer Substrate with Asymmetrical Fibers and Reduced Warpage App 20130147053 - Park; Hyung Sang ; et al.	2013-06-13
Methods of depositing a ruthenium film Grant 8,273,408 - Kim , et al. September 25, 2	2012-09-25
Method of forming semiconductor patterns Grant 8,252,691 - Beynet , et al. August 28, 2	2012-08-28
Method for forming a silicon dioxide/metal oxide-nanolaminate with a desired wet etch rate Grant 8,242,029 - Zagwijn , et al. August 14, 2	2012-08-14
Atomic layer deposition apparatus Grant 8,215,264 - Hong , et al. July 10, 2	2012-07-10
Deposition Apparatus App 20120114856 - Park; Hyung Sang ; et al.	2012-05-10
Semiconductor Device and Method of Forming Vertically Offset Conductive Pillars Over First Substrate Aligned to Vertically Offset BOT Interconnect Sites Formed Over Second Substrate App 20120043672 - Cho; SungWon ; et al.	2012-02-23
Deposition apparatus Grant 8,092,606 - Park , et al. January 10, 2	2012-01-10
Atomic Layer Deposition Apparatus App 20110308460 - Hong; Kyung Il ; et al.	2011-12-22
Methods of forming an amorphous silicon thin film Grant 8,076,242 - Kim , et al. December 13, 2	2011-12-13
Method Of Forming Semiconductor Patterns App 20110256727 - Beynet; Julien ; et al.	2011-10-20
Atomic layer deposition apparatus Grant 7,976,898 - Hong , et al. July 12, 2	2011-07-12
Method For Forming A Silicon Dioxide/metal Oxide-nanolaminate With A Desired Wet Etch Rate App 20110121430 - Zagwijn; Peter ; et al.	2011-05-26
Lateral-flow Deposition Apparatus And Method Of Depositing Film By Using The Apparatus App 20110020545 - Kim; Ki Jong ; et al.	2011-01-27
Sink type cup holder for motor vehicle Grant 7,694,928 - Lee , et al. April 13, 2	2010-04-13
Methods Of Forming An Amorphous Silicon Thin Film App 20090278224 - Kim; Jong Su ; et al.	2009-11-12
Methods Of Depositing A Ruthenium Film App 20090163024 - Kim; Jeon Ho ; et al.	2009-06-25
Methods Of Depositing A Silicon Nitride Film App 20090155606 - Yoon; Tae Ho ; et al.	2009-06-18
Deposition Apparatus App 20090156015 - Park; Hyung Sang ; et al.	2009-06-18
Method of depositing Ru films having high density Grant 7,541,284 - Park June 2, 2	2009-06-02
Methods Of Depositing A Ruthenium Film App 20090104777 - Kim; Jong Su ; et al.	2009-04-23
Deposition Apparatus App 20090047426 - PARK; Hyung Sang ; et al.	2009-02-19
Method Of Depositing Silicon Oxide Films App 20090041952 - Yoon; Tae Ho ; et al.	2009-02-12
Sink Type Cup Holder For Motor Vehicle App 20080290125 - Lee; Kwang Gi ; et al.	2008-11-27
Process Of Filling Deep Vias For 3-d Integration Of Substrates App 20080242078 - Sprey; Hessel ; et al.	2008-10-02
Lateral Flow Deposition Apparatus And Method Of Depositing Film By Using The Apparatus App 20080241384 - Jeong; Sang Jin ; et al.	2008-10-02
Atomic Layer Deposition Apparatus App 20080110399 - Park; Hyung-Sang ; et al.	2008-05-15
Atomic Layer Deposition Apparatus App 20080069955 - Hong; Kyung Il ; et al.	2008-03-20
Semiconductor-processing Apparatus With Rotating Susceptor App 20070218702 - SHIMIZU; Akira ; et al.	2007-09-20
Semiconductor-processing apparatus with rotating susceptor App 20070218701 - Shimizu; Akira ; et al.	2007-09-20
Method and apparatus of time and space co-divided atomic layer deposition App 20070215036 - Park; Hyung-Sang ; et al.	2007-09-20
Method of depositing Ru films having high density App 20070190782 - Park; Hyung-Sang	2007-08-16
Plasma enhanced atomic layer deposition (PEALD) equipment and method of forming a conducting thin film using the same thereof App 20060276037 - Lee; Chun Soo ; et al.	2006-12-07
Plasma enhanced atomic layer deposition (PEALD) equipment and method of forming a conducting thin film using the same thereof Grant 7,138,336 - Lee , et al. November 21, 2	2006-11-21
Method of forming a ruthenium thin film using a plasma enhanced atomic layer deposition apparatus and the method thereof App 20060177601 - Park; Hyung-Sang ; et al.	2006-08-10
Expandable interfusion cage Grant 6,955,691 - Chae , et al. October 18, 2	2005-10-18
Method of forming copper interconnections for semiconductor integrated circuits on a substrate App 20050124154 - Park, Hyung-Sang ; et al.	2005-06-09
Expandable interfusion cage App 20050113917 - Chae, Soo-Kyung ; et al.	2005-05-26
Plasma enhanced atomic layer deposition (peald) equipment and method of forming a conducting thin film using the same thereof App 20040231799 - Lee, Chun Soo ; et al.	2004-11-25
Super water-repellent organic/inorganic composite membrane Grant 6,793,821 - Lee , et al. September 21, 2	2004-09-21
Glove box damper system Grant 6,749,242 - Park June 15, 2	2004-06-15
Method of forming copper interconnections and thin films using chemical vapor deposition with catalyst Grant 6,720,262 - Koh , et al. April 13, 2	2004-04-13
Glove box damper system App 20040051334 - Park, Hyung-Sang	2004-03-18
Super water-repellent organic/inorganic composite membrane App 20030080049 - Lee, Soo-Bok ; et al.	2003-05-01
Method of forming copper interconnections and thin films using chemical vapor deposition with catalyst App 20010019891 - Koh, Won Yong ; et al.	2001-09-06

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