PARK; Hyun Mog

Patent Applications and Registrations

Patent applications and USPTO patent grants for PARK; Hyun Mog.The latest application filed is for "semiconductor devices".

Company Profile

22.36.45

PARK; Hyun Mog - Seoul KR
Park; Hyun-Mog - Seongbuk-gu KR
Park; Hyun-Mog - Portland OR
Park; Hyun-Mog - Beaverton OR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor Devices App 20220189940 - PARK; Hyun Mog ; et al.	2022-06-16
Semiconductor devices Grant 11,270,987 - Park , et al. March 8, 2	2022-03-08
Semiconductor Devices And Manufacturing Methods Of The Same App 20220045035 - PARK; Hyun Mog	2022-02-10
Semiconductor device Grant 11,211,372 - Park December 28, 2	2021-12-28
Semiconductor Device App 20210366928 - SHIN; Seung Jun ; et al.	2021-11-25
Semiconductor devices and manufacturing methods of the same Grant 11,171,116 - Park November 9, 2	2021-11-09
Semiconductor device Grant 11,114,463 - Shin , et al. September 7, 2	2021-09-07
Semiconductor Device App 20210249397 - KANAMORI; Kohji ; et al.	2021-08-12
Vertical memory device Grant 11,011,536 - Lee , et al. May 18, 2	2021-05-18
Semiconductor device Grant 10,998,301 - Kanamori , et al. May 4, 2	2021-05-04
Method of aligning wafers, method of bonding wafers using the same, and apparatus for performing the same Grant 10,937,756 - Park March 2, 2	2021-03-02
Semiconductor Device App 20210020781 - CHO; Min Hee ; et al.	2021-01-21
Semiconductor Devices App 20200381413 - PARK; Hyun Mog ; et al.	2020-12-03
Vertical memory devices and methods of manufacturing the same Grant 10,854,622 - Yoon , et al. December 1, 2	2020-12-01
Semiconductor Device App 20200357784 - PARK; Hyun Mog	2020-11-12
Semiconductor device including gates Grant 10,825,832 - Gu , et al. November 3, 2	2020-11-03
Semiconductor Device App 20200303413 - SHIN; Seung Jun ; et al.	2020-09-24
Vertical Memory Devices And Methods Of Manufacturing The Same App 20200295023 - YOON; Young-Bae ; et al.	2020-09-17
Semiconductor devices Grant 10,748,886 - Park , et al. A	2020-08-18
Vertical memory devices and methods of manufacturing the same Grant 10,741,571 - Yoon , et al. A	2020-08-11
Semiconductor device Grant 10,734,371 - Park	2020-08-04
Semiconductor Device App 20200203329 - KANAMORI; Kohji ; et al.	2020-06-25
Semiconductor device Grant 10,680,007 - Shin , et al.	2020-06-09
Semiconductor Device Including Gates App 20200176470 - GU; Ji Mo ; et al.	2020-06-04
Memory Device Including A Random Input And Output Engine And A Storage Device Including The Memory Device App 20200150894 - LEE; SANG-KIL ; et al.	2020-05-14
Semiconductor Device App 20200144242 - PARK; HYUN MOG	2020-05-07
Method Of Aligning Wafers, Method Of Bonding Wafers Using The Same, And Apparatus For Performing The Same App 20200118964 - PARK; Hyun-Mog	2020-04-16
Three-dimensional semiconductor device including a cell array region and a contact region Grant 10,615,124 - Park	2020-04-07
Semiconductor Devices App 20200105735 - PARK; Hyun Mog ; et al.	2020-04-02
Semiconductor Devices And Manufacturing Methods Of The Same App 20200105721 - PARK; Hyun Mog	2020-04-02
Semiconductor device including gates Grant 10,553,605 - Gu , et al. Fe	2020-02-04
Three-dimensional Semiconductor Device App 20190333855 - PARK; Hyun-mog	2019-10-31
Three-dimensional semiconductor device having contact plugs penetrating upper adjacent electrodes Grant 10,396,035 - Park A	2019-08-27
Vertical Memory Device App 20190035805 - Lee; Byoung-Il ; et al.	2019-01-31
Three-dimensional Semiconductor Device App 20190035733 - PARK; Hyun-mog	2019-01-31
Semiconductor Device App 20190027490 - SHIN; Seung Jun ; et al.	2019-01-24
Semiconductor Device Including Gates App 20190019807 - GU; JI MO ; et al.	2019-01-17
Vertical Memory Devices And Methods Of Manufacturing The Same App 20170294388 - YOON; Young-Bae ; et al.	2017-10-12
NAND-type nonvolatile memory device and related method of manufacture Grant 7,675,125 - Park , et al. March 9, 2	2010-03-09
Forming a porous dielectric layer and structures formed thereby Grant 7,544,896 - Boyanov , et al. June 9, 2	2009-06-09
NAND-type nonvolatile memory device and related method of manufacture App 20080079091 - Park; Hyun-Mog ; et al.	2008-04-03
Sealing porous dielectric material using plasma-induced surface polymerization Grant 7,335,586 - RamachandraRao , et al. February 26, 2	2008-02-26
Air gap interconnect structure and method Grant 7,332,406 - Park , et al. February 19, 2	2008-02-19
Via etch process Grant 7,303,648 - Park , et al. December 4, 2	2007-12-04
Forming thin hard mask over air gap or porous dielectric Grant 7,238,604 - Kloster , et al. July 3, 2	2007-07-03
Method of patterning a porous dielectric material Grant 7,220,668 - Park , et al. May 22, 2	2007-05-22
Dielectric with sidewall passivating layer App 20070042598 - Park; Hyun-Mog	2007-02-22
Forming a porous dielectric layer and structures formed thereby Grant 7,179,755 - Boyanov , et al. February 20, 2	2007-02-20
Dielectric with sidewall passivating layer Grant 7,176,122 - Park February 13, 2	2007-02-13
Method of patterning a porous dielectric material App 20060292856 - Park; Hyun-Mog ; et al.	2006-12-28
Interconnect structure for an integrated circuit and method of fabrication Grant 7,151,051 - He , et al. December 19, 2	2006-12-19
Sealing porous dielectric material using plasma-induced surface polymerization App 20060281329 - RamachandraRao; Vijayakumar S. ; et al.	2006-12-14
Etch stopless dual damascene structure and method of fabrication App 20060216929 - Park; Hyun-Mog ; et al.	2006-09-28
Forming a porous dielectric layer and structures formed thereby App 20060145304 - Boyanov; Boyan ; et al.	2006-07-06
Forming a porous dielectric layer and structures formed thereby App 20060145305 - Boyanov; Boyan ; et al.	2006-07-06
Interconnects having a recessed capping layer and methods of fabricating the same App 20060128144 - Park; Hyun-Mog ; et al.	2006-06-15
Supercritical carbon dioxide to reduce line edge roughness Grant 7,049,053 - Ramachandrarao , et al. May 23, 2	2006-05-23
Etch method to minimize hard mask undercut App 20050274691 - Park, Hyun-Mog	2005-12-15
Via etch process App 20050274690 - Park, Hyun-Mog ; et al.	2005-12-15
Interconnect structure for an integrated circuit and method of fabrication App 20050221604 - He, Jun ; et al.	2005-10-06
Creating air gap in multi-level metal interconnects using electron beam to remove sacrificial material App 20050164489 - Kloster, Grant ; et al.	2005-07-28
Interconnect structure for an integrated circuit and method of fabrication Grant 6,919,637 - He , et al. July 19, 2	2005-07-19
Semiconductor device having a region of a material which is vaporized upon exposing to ultraviolet radiation Grant 6,903,461 - Kloster , et al. June 7, 2	2005-06-07
Air gap interconnect structure and method App 20050106852 - Park, Hyun-Mog ; et al.	2005-05-19
Creating air gap in multi-level metal interconnects using electron beam to remove sacrificial material Grant 6,867,125 - Kloster , et al. March 15, 2	2005-03-15
Air gap interconnect method Grant 6,861,332 - Park , et al. March 1, 2	2005-03-01
Supercritical carbon dioxide to reduce line edge roughness App 20040253550 - Ramachandrarao, Vijayakumar ; et al.	2004-12-16
Forming thin hard mask over air gap or porous dielectric App 20040214427 - Kloster, Grant M. ; et al.	2004-10-28
Dielectric with sidewall passivating layer App 20040175925 - Park, Hyun-Mog	2004-09-09
Method of making a semiconductor device by forming a masking layer with a tapered etch profile Grant 6,774,032 - Park August 10, 2	2004-08-10
Forming openings within integrated circuits App 20040132276 - Kloster, Grant M. ; et al.	2004-07-08
Method of making a semiconductor device by forming a masking layer with a tapered etch profile Grant 6,743,712 - Park , et al. June 1, 2	2004-06-01
Air gap interconnect structure and method App 20040099951 - Park, Hyun-Mog ; et al.	2004-05-27
Method of forming an air gap within a structure by exposing an ultraviolet sensitive material to ultraviolet radiation Grant 6,734,094 - Kloster , et al. May 11, 2	2004-05-11
Interconnect structure for an integrated circuit and method of fabrication App 20040061231 - He, Jun ; et al.	2004-04-01
Creating air gap in multi-level metal interconnects using electron beam to remove sacrificial material App 20040063305 - Kloster, Grant ; et al.	2004-04-01
Method Of Making A Semiconductor Device By Forming A Masking Layer With A Tapered Etch Profile App 20040009662 - Park, Hyun-Mog ; et al.	2004-01-15
Forming openings within integrated circuits App 20030203592 - Kloster, Grant M. ; et al.	2003-10-30
Method for controlling etch bias of carbon doped oxide films Grant 6,620,741 - Gracias , et al. September 16, 2	2003-09-16