Park; Hong-Mi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Park; Hong-Mi.The latest application filed is for "method of fabricating a recess channel array transistor using a mask layer with a high etch selectivity with respect to a silicon substrate".

Company Profile

0.5.6

Park; Hong-Mi - Seoul KR
Park; Hong-Mi - Gyeonggi-do KR
Park; Hong-mi - Yongin-si KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method of fabricating a recess channel array transistor using a mask layer with a high etch selectivity with respect to a silicon substrate Grant 7,326,621 - Cho , et al. February 5, 2	2008-02-05
Method of manufacturing a semiconductor device Grant 7,135,407 - Shin , et al. November 14, 2	2006-11-14
Methods of fabricating integrated circuit conductive contact structures including grooves Grant 7,122,468 - Shin , et al. October 17, 2	2006-10-17
Method of fabricating a recess channel array transistor using a mask layer with a high etch selectivity with respect to a silicon substrate App 20050136616 - Cho, Young-sun ; et al.	2005-06-23
Method of forming a contact in a semiconductor device Grant 6,905,960 - Park , et al. June 14, 2	2005-06-14
Methods of fabricating integrated circuit conductive contact structures including grooves App 20050121755 - Shin, Ju-Cheol ; et al.	2005-06-09
Method of manufacturing a semiconductor device App 20040198041 - Shin, Ju-Cheol ; et al.	2004-10-07
Method for forming a conductive film and a conductive pattern of a semiconductor device Grant 6,774,029 - Shin , et al. August 10, 2	2004-08-10
Method of forming a contact in a semiconductor device App 20040053491 - Park, Hong-Mi ; et al.	2004-03-18
Method for forming a conductive film and a conductive pattern of a semiconductor device App 20040038530 - Shin, Ju-Cheol ; et al.	2004-02-26
Integrated circuit conductive contact structures including grooves and fabrication methods thereof App 20040000717 - Shin, Ju-Cheol ; et al.	2004-01-01

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