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name:-0.27027606964111
name:-0.015629053115845
name:-0.0024540424346924
Park; Hong-Bum Patent Filings

Park; Hong-Bum

Patent Applications and Registrations

Patent applications and USPTO patent grants for Park; Hong-Bum.The latest application filed is for "semiconductor package including stacked semiconductor chips".

Company Profile
1.7.14
  • Park; Hong-Bum - Seoul KR
  • Park; Hong-Bum - Seongnam-si KR
  • Park; Hong-Bum - Suwon-si KR
  • Park; Hong-bum - Gyeonggi-do KR
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Semiconductor package including stacked semiconductor chips
Grant 11,380,651 - Park , et al. July 5, 2
2022-07-05
Semiconductor Package Including Stacked Semiconductor Chips
App 20210111152 - PARK; Hong-Bum ;   et al.
2021-04-15
Semiconductor devices including gate dielectric structures
Grant 10,056,491 - Jeong , et al. August 21, 2
2018-08-21
Semiconductor Devices Including Gate Dielectric Structures
App 20170358680 - JEONG; Seong Hoon ;   et al.
2017-12-14
Image Sensor
App 20170330905 - Tak; Yong Suk ;   et al.
2017-11-16
Methods of manufacturing semiconductor devices
Grant 9,502,532 - Park , et al. November 22, 2
2016-11-22
Semiconductor Device And Method For Manufacturing Semiconductor Device
App 20160086943 - LEE; Sun Young ;   et al.
2016-03-24
Methods Of Manufacturing Semiconductor Devices
App 20160020301 - Park; Hong Bum ;   et al.
2016-01-21
Semiconductor Devices Having Shallow Junctions
App 20140287564 - Park; Keum-Seok ;   et al.
2014-09-25
Method for manufacturing a substrate for a semiconductor package
Grant 8,298,865 - Jung , et al. October 30, 2
2012-10-30
Substrate For Semiconductor Package, Method For Manufacturing The Same, And Semiconductor Package Having The Same
App 20120118495 - JUNG; Young Berm ;   et al.
2012-05-17
Semiconductor Devices Having Shallow Junctions
App 20120091469 - Park; Keum-Seok ;   et al.
2012-04-19
Substrate for semiconductor package
Grant 8,125,086 - Jung , et al. February 28, 2
2012-02-28
Semiconductor Memory Device, Method Of Forming The Same, And Memory System
App 20110275197 - PARK; Hong-bum ;   et al.
2011-11-10
Substrate For Semiconductor Package, Method For Manufacturing The Same, And Semiconductor Package Having The Same
App 20090294972 - JUNG; Young Berm ;   et al.
2009-12-03
Capacitor, method of forming the same, semiconductor device having the capacitor and method of manufacturing the same
Grant 7,482,242 - Park , et al. January 27, 2
2009-01-27
Semiconductor device capacitors with oxide-nitride layers and methods of fabricating such capacitors
Grant 7,422,943 - Lee , et al. September 9, 2
2008-09-09
Capacitor and method of manufacturing the same
App 20080054400 - Lee; Woo-Sung ;   et al.
2008-03-06
Capacitor, method of forming the same, semiconductor device having the capacitor and method of manufacturing the same
App 20070066015 - Park; Hong-Bum ;   et al.
2007-03-22
Semiconductor device capacitors with oxide-nitride layers and methods of fabricating such capacitors
App 20070040203 - Lee; Jong-cheol ;   et al.
2007-02-22

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