Park; Ho-Sik

Patent Applications and Registrations

Patent applications and USPTO patent grants for Park; Ho-Sik.The latest application filed is for "coil component and method for manufacturing the same".

Company Profile

3.18.26

Park; Ho-Sik - Hwaseong-si KR
Park; Ho Sik - Suwon-si KR
Park; Ho Sik - Suwon KR
Park; Ho Sik - Gyunggi-do N/A KR
Park; Ho-Sik - Buk-gu KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electronic component embedded printed circuit board and method of manufacturing the same Grant 10,779,414 - Park , et al. Sept	2020-09-15
Coil component and method for manufacturing the same Grant 10,529,476 - Park , et al. J	2020-01-07
Coil Component And Method For Manufacturing The Same App 20180158584 - PARK; Ho Sik ; et al.	2018-06-07
Thin Film-type Inductor And Method For Manufacturing The Same App 20180137975 - CHA; Il Ho ; et al.	2018-05-17
Printed circuit board and manufacturing method thereof Grant 9,674,944 - Kim , et al. June 6, 2	2017-06-06
Printed Circuit Board And Manufacturing Method Thereof App 20170006700 - KIM; Byung-Moon ; et al.	2017-01-05
Electronic Component Embedded Printed Circuit Board And Method Of Manufacturing The Same App 20160219710 - PARK; Ho-Sik ; et al.	2016-07-28
Printed Circuit Board And Method Of Manufacturing The Same App 20150351219 - Oh; Chang Gun ; et al.	2015-12-03
Method of manufacturing and insulating sheet Grant 8,997,340 - Sohn , et al. April 7, 2	2015-04-07
Printed Circuit Board And Method For Manufacturing The Same App 20140174793 - Oh; Chang Gun ; et al.	2014-06-26
Printed circuit board and method for fabricating the same Grant 8,720,049 - Bae , et al. May 13, 2	2014-05-13
Method of fabricating semiconductor plastic package including a core board, build-up insulation layer, printed circuit, and semiconductor chip Grant 8,647,926 - Shin , et al. February 11, 2	2014-02-11
Method of manufacturing a printed circuit board Grant 8,499,441 - Park , et al. August 6, 2	2013-08-06
Printed circuit board with reinforced thermoplastic resin layer Grant 8,450,618 - Sohn , et al. May 28, 2	2013-05-28
Method For Preparing Mesoporous Carbon Having Iron Oxide Nanoparticles App 20130079223 - Kim; Yo-Han ; et al.	2013-03-28
Manufacturing an insulating sheet, a copper clad laminate, and a printed circuit board Grant 8,397,378 - Sohn , et al. March 19, 2	2013-03-19
Method of manufacturing printed circuit board Grant 8,356,405 - Oh , et al. January 22, 2	2013-01-22
Printed Circuit Board And Method Of Manufacturing The Same App 20120261166 - OH; Chang Gun ; et al.	2012-10-18
Method Of Manufacturing Printed Circuit Board App 20120152753 - LEE; Suk Won ; et al.	2012-06-21
Printed Circuit Board and Method For Fabricating The Same App 20120097438 - Bae; Tae Kyun ; et al.	2012-04-26
Method Of Manufacturing Printed Circuit Board App 20120079716 - OH; Chang Gun ; et al.	2012-04-05
Method of manufacturing printed circuit board App 20120030938 - Park; Ho-Sik ; et al.	2012-02-09
Printed circuit board App 20120018195 - Park; Ho-Sik ; et al.	2012-01-26
Printed circuit board App 20120012379 - Park; Ho-Sik ; et al.	2012-01-19
Method of manufacturing insulating sheet and printed circuit board having the same App 20120012247 - Sohn; Keungjin ; et al.	2012-01-19
Printed circuit board with reinforced thermoplastic resin layer App 20110315437 - Sohn; Keung-Jin ; et al.	2011-12-29
Printed circuit board and manufacturing method of the same App 20110139499 - Park; Jung-Hwan ; et al.	2011-06-16
Semiconductor plastic package and fabricating method thereof Grant 7,893,527 - Shin , et al. February 22, 2	2011-02-22
Method of fabricating semiconductor plastic package App 20100330747 - Shin; Joon-Sik ; et al.	2010-12-30
Metal core package substrate and method for manufacturing the same App 20090288293 - Lee; Sang Youp ; et al.	2009-11-26
Manufacturing an insulating sheet, a copper clad laminate, and a printed circuit board App 20090255714 - Sohn; Keung-Jin ; et al.	2009-10-15
Printed circuit board and manufacturing method thereof App 20090250253 - Park; Ho-Sik ; et al.	2009-10-08
Insulating sheet and printed circuit board having the same App 20090242248 - Sohn; Keungjin ; et al.	2009-10-01
Method for manufacturing insulating sheet and method for manufacturing metal clad laminate and printed circuit board using the same App 20090236038 - Ikeguchi; Nobuyuki ; et al.	2009-09-24
Printed circuit board and manufacturing method of the same App 20090084595 - Park; Jung-Hwan ; et al.	2009-04-02
Semiconductor plastic package and fabricating method thereof App 20090026604 - Shin; Joon-Sik ; et al.	2009-01-29

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