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Patent applications and USPTO patent grants for Park; Heungsoo.The latest application filed is for "method for removing residue containing an embedded metal".
Patent | Date |
---|---|
Method for removing residue containing an embedded metal App 20070184666 - Smith; Patricia Beauregard ;   et al. | 2007-08-09 |
Post-etch clean process for porous low dielectric constant materials App 20050045206 - Smith, Patricia Beauregard ;   et al. | 2005-03-03 |
Chemical treatment of low-k dielectric films Grant 6,838,300 - Jin , et al. January 4, 2 | 2005-01-04 |
Chemical treatment of low-k dielectric films App 20040150012 - Jin, Changming ;   et al. | 2004-08-05 |
Hexamethyldisilazane treatment of low-k dielectric films App 20040152296 - Matz, Phillip D. ;   et al. | 2004-08-05 |
Methods for polymer removal following etch-stop layer etch Grant 6,713,402 - Smith , et al. March 30, 2 | 2004-03-30 |
Methods for polymer removal following etch-stop layer etch App 20030224595 - Smith, Patricia Beauregard ;   et al. | 2003-12-04 |
Method to determine a complete etch in integrated devices Grant 6,645,781 - Jiang , et al. November 11, 2 | 2003-11-11 |
Method To Determine A Complete Etch In Integrated Devices App 20030203516 - Jiang, Ping ;   et al. | 2003-10-30 |
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