loadpatents
name:-0.0084290504455566
name:-0.0040919780731201
name:-0.00038790702819824
Park; Heungsoo Patent Filings

Park; Heungsoo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Park; Heungsoo.The latest application filed is for "method for removing residue containing an embedded metal".

Company Profile
0.3.6
  • Park; Heungsoo - McKinney TX
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method for removing residue containing an embedded metal
App 20070184666 - Smith; Patricia Beauregard ;   et al.
2007-08-09
Post-etch clean process for porous low dielectric constant materials
App 20050045206 - Smith, Patricia Beauregard ;   et al.
2005-03-03
Chemical treatment of low-k dielectric films
Grant 6,838,300 - Jin , et al. January 4, 2
2005-01-04
Chemical treatment of low-k dielectric films
App 20040150012 - Jin, Changming ;   et al.
2004-08-05
Hexamethyldisilazane treatment of low-k dielectric films
App 20040152296 - Matz, Phillip D. ;   et al.
2004-08-05
Methods for polymer removal following etch-stop layer etch
Grant 6,713,402 - Smith , et al. March 30, 2
2004-03-30
Methods for polymer removal following etch-stop layer etch
App 20030224595 - Smith, Patricia Beauregard ;   et al.
2003-12-04
Method to determine a complete etch in integrated devices
Grant 6,645,781 - Jiang , et al. November 11, 2
2003-11-11
Method To Determine A Complete Etch In Integrated Devices
App 20030203516 - Jiang, Ping ;   et al.
2003-10-30

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