| Patent | Date |
|---|
Ion implantation apparatus
Grant 11,170,975 - Park , et al. November 9, 2 | 2021-11-09 |
Cathode for ion source comprising a tapered sidewall
Grant 10,923,311 - Choi , et al. February 16, 2 | 2021-02-16 |
Method Of Forming Semiconductor Structure
App 20200219761 - CHOI; JONG-MOO ; et al. | 2020-07-09 |
Ion Implantation Apparatus
App 20200216946 - PARK; HEUNG-WOO ; et al. | 2020-07-09 |
Image sensor assembly, method of manufacturing the same, and camera module
Grant 10,636,823 - Lee , et al. | 2020-04-28 |
Electronic module and method of manufacturing the same
Grant 10,600,835 - Park | 2020-03-24 |
Electronic module and method of manufacturing the same
Grant 10,602,036 - Park , et al. | 2020-03-24 |
Electronic Module And Method Of Manufacturing The Same
App 20180278815 - PARK; Heung Woo ; et al. | 2018-09-27 |
Electronic module and method of manufacturing the same
Grant 10,009,523 - Park , et al. June 26, 2 | 2018-06-26 |
Image Sensor Assembly, Method Of Manufacturing The Same, And Camera Module
App 20180166484 - LEE; Kang Hyun ; et al. | 2018-06-14 |
Electronic Module And Method Of Manufacturing The Same
App 20180166485 - PARK; Heung Woo | 2018-06-14 |
Image sensor assembly, method of manufacturing the same, and camera module
Grant 9,929,195 - Lee , et al. March 27, 2 | 2018-03-27 |
Image Sensor Assembly, Method Of Manufacturing The Same, And Camera Module
App 20170062503 - LEE; Kang Hyun ; et al. | 2017-03-02 |
Printed Circuit Board, Semiconductor Package And Method Of Manufacturing The Same
App 20160353572 - LIM; Jae Hyun ; et al. | 2016-12-01 |
Electronic Module And Method Of Manufacturing The Same
App 20160337561 - PARK; Heung Woo ; et al. | 2016-11-17 |
Micro electro mechanical systems sensor module package and method of manufacturing the same
Grant 9,236,286 - Kim , et al. January 12, 2 | 2016-01-12 |
Mems Structure And Method Of Manufacturing The Same
App 20150329356 - HAN; Jong Woo ; et al. | 2015-11-19 |
Microphone Package
App 20150249891 - KIM; Tae Hyun ; et al. | 2015-09-03 |
Microphone package and mounting structure thereof
Grant 9,120,668 - Park , et al. September 1, 2 | 2015-09-01 |
Mems Microphone
App 20150230028 - PARK; Heung Woo ; et al. | 2015-08-13 |
Angular Velocity Sensor
App 20150219456 - Kim; Jong Woon ; et al. | 2015-08-06 |
Inertial Sensor And Method Of Manufacturing The Same
App 20150211884 - KIM; Jong Woon ; et al. | 2015-07-30 |
Sensor capable of measuring acceleration, angular velocity, and DC acceleration
Grant 9,052,333 - Park , et al. June 9, 2 | 2015-06-09 |
Micro Electro Mechanical Systems Sensor Module Package And Method Of Manufacturing The Same
App 20150153372 - Kim; Tae Hyun ; et al. | 2015-06-04 |
Micro Electro Mechanical Systems Sensor Module Package And Method Of Manufacturing The Same
App 20150153378 - KIM; Tae Hyun ; et al. | 2015-06-04 |
Microphone Package And Method Of Manufacturing The Same
App 20150156575 - KIM; Tae Hyun ; et al. | 2015-06-04 |
Semiconductor Package And Manufacturing Method Thereof
App 20150145076 - KIM; Tae Hyun ; et al. | 2015-05-28 |
Acoustic Device And Microphone Package Including The Same
App 20150139467 - PARK; Heung Woo | 2015-05-21 |
Electronic Component Module
App 20150136451 - PARK; Heung Woo ; et al. | 2015-05-21 |
Microphone Package And Mounting Structure Thereof
App 20150137284 - PARK; Heung Woo ; et al. | 2015-05-21 |
Inertial sensor and method of manufacturing the same
Grant 8,973,438 - Kim , et al. March 10, 2 | 2015-03-10 |
Polling method of piezoelectric element and method of manufacturing inertial sensor
Grant 8,973,230 - Park , et al. March 10, 2 | 2015-03-10 |
Semiconductor Package, Method Of Manufacturing Semiconductor Package And Stack Type Semiconductor Package
App 20150054173 - KIM; Tae Hyun ; et al. | 2015-02-26 |
Inertial sensor and angular velocity detection method using the same
Grant 8,789,417 - Kim , et al. July 29, 2 | 2014-07-29 |
Inertial sensor
Grant 8,739,628 - Kim , et al. June 3, 2 | 2014-06-03 |
Inertial sensor
Grant 8,701,489 - Kim , et al. April 22, 2 | 2014-04-22 |
Micro electro mechanical systems component
Grant 8,607,638 - Jeung , et al. December 17, 2 | 2013-12-17 |
Method of manufacturing inertial sensor
Grant 8,505,190 - Lee , et al. August 13, 2 | 2013-08-13 |
Inertial Sensor
App 20130133426 - PARK; Jung Tae ; et al. | 2013-05-30 |
Inertial Sensor
App 20130081464 - Park; Heung Woo ; et al. | 2013-04-04 |
Inertial Sensor
App 20130074598 - Park; Heung Woo ; et al. | 2013-03-28 |
Micro Electro Mechanical Systems Component
App 20130068022 - JEUNG; WON KYU ; et al. | 2013-03-21 |
Inertial Sensor
App 20130068021 - PARK; Heung Woo ; et al. | 2013-03-21 |
Inertial Sensor And Method Of Manufacturing The Same
App 20130036818 - Kim; Jong Woon ; et al. | 2013-02-14 |
Inertial Sensor And Angular Velocity Detection Method Using The Same
App 20130019679 - Kim; Jong Woon ; et al. | 2013-01-24 |
Inertial Sensor
App 20120297874 - KIM; Jong Woon ; et al. | 2012-11-29 |
Method Of Manufacturing Inertial Sensor
App 20120266460 - LEE; Hyun Kee ; et al. | 2012-10-25 |
Inertial Sensor And Method Of Manufacturing The Same
App 20120266673 - Lee; Hyun Kee ; et al. | 2012-10-25 |
Polling Method Of Piezoelectric Element And Method Of Manufacturing Inertial Sensor Using The Same
App 20120159754 - Park; Heung Woo ; et al. | 2012-06-28 |
Inertial Sensor
App 20120152020 - Kim; Jong Woon ; et al. | 2012-06-21 |
Inertial Sensor
App 20120125096 - Park; Heung Woo ; et al. | 2012-05-24 |
Optical modulator module package
Grant 7,529,013 - Park , et al. May 5, 2 | 2009-05-05 |
Laser Module Package And Display Apparatus Using The Same
App 20090103574 - Park; Heung-Woo | 2009-04-23 |
Projection Display Apparatus For Removing Noise
App 20090027752 - Park; Chang-Su ; et al. | 2009-01-29 |
Optical Modulator Module And Temperature Sensor
App 20080316570 - Park; Heung-Woo ; et al. | 2008-12-25 |
Green Laser Module Package
App 20080317078 - Park; Heung-Woo ; et al. | 2008-12-25 |
Miniature optical modulator module using flexible printed circuit board
Grant 7,405,867 - Park , et al. July 29, 2 | 2008-07-29 |
Optical Modulator Module Package
App 20080158649 - Park; Heung-Woo ; et al. | 2008-07-03 |
Semi-conductor chip package capable of detecting open and short
Grant 7,394,261 - Park , et al. July 1, 2 | 2008-07-01 |
Optical modulator module package using flip-chip mounting technology
Grant 7,394,139 - Park , et al. July 1, 2 | 2008-07-01 |
Light modulator package having inclined light transmissive lid
Grant 7,343,072 - Lee , et al. March 11, 2 | 2008-03-11 |
Semiconductor package using flip-chip mounting technique
Grant 7,227,267 - Lee , et al. June 5, 2 | 2007-06-05 |
MEMS module package
App 20070092179 - Park; Heung-Woo ; et al. | 2007-04-26 |
Semi-conductor chip package capable of detecting open and short
App 20070080704 - Park; Chang-Su ; et al. | 2007-04-12 |
MEMS module package using sealing cap having heat releasing capability and manufacturing method thereof
App 20070075417 - Hwang; Young-Nam ; et al. | 2007-04-05 |
Miniature optical modulator module using flexible printed circuit board
App 20070053628 - Park; Heung-Woo ; et al. | 2007-03-08 |
Optical modulator module package
App 20070047879 - Park; Heung-Woo ; et al. | 2007-03-01 |
Optical modulator module package using flip-chip mounting technology
App 20060198000 - Park; Heung Woo ; et al. | 2006-09-07 |
Embedded integrated circuit packaging structure
Grant 7,102,240 - Park , et al. September 5, 2 | 2006-09-05 |
Micro-electro-mechanical system (MEMS) package with side sealing member and method of manufacturing the same
Grant 7,078,804 - Hong , et al. July 18, 2 | 2006-07-18 |
Semiconductor package using flip-chip mounting technique
App 20060076692 - Lee; Yeong Gyu ; et al. | 2006-04-13 |
Light modulator package having inclined light transmissive lid
App 20060078256 - Lee; Yeong Gyu ; et al. | 2006-04-13 |
Package structure for optical modulator
App 20060078247 - Lee; Yeong Gyu ; et al. | 2006-04-13 |
Wavelength stabilization module having light-receiving element array and method of manufacturing the same
Grant 7,012,939 - Choi , et al. March 14, 2 | 2006-03-14 |
Embedded integrated circuit packaging structure
App 20050275113 - Park, Heung-Woo ; et al. | 2005-12-15 |
Micro-electro-mechanical system (MEMS) package with side sealing member and method of manufacturing the same
App 20050258516 - Hong, Suk-Kee ; et al. | 2005-11-24 |
Wavelength stabilization module having light-receiving element array and method of manufacturing the same
App 20040101319 - Choi, Kwang Seong ; et al. | 2004-05-27 |
Silicon optical bench for packaging optical switch device, optical switch package using the silicon optical bench, and method for fabricating the silicon optical bench
App 20040076367 - Eom, Yong-sung ; et al. | 2004-04-22 |
Disk and hub assembly for electromagnetic clutch and method for manufacturing the same
App 20030155208 - Seok, Jong Myung ; et al. | 2003-08-21 |
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