Park; Doo Cheol

Patent Applications and Registrations

Patent applications and USPTO patent grants for Park; Doo Cheol.The latest application filed is for "3dimension image sensor and system including the same".

Company Profile

0.8.10

Park; Doo Cheol - Hwaseong-si N/A KR
Park; Doo-cheol - Suwon-si KR
Park; Doo Cheol - Kyungki-Do KR
Park; Doo Cheol - Suwon KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Sensor, data processing system, and operating method Grant 9,118,856 - Kim , et al. August 25, 2	2015-08-25
Method of fabricating microlens, and depth sensor including microlens Grant 9,029,785 - Park , et al. May 12, 2	2015-05-12
3dimension Image Sensor And System Including The Same App 20140015932 - KIM; Won Joo ; et al.	2014-01-16
Sensor, Data Processing System, And Operating Method App 20130010072 - Kim; Won Joo ; et al.	2013-01-10
Method Of Fabricating Microlens, And Depth Sensor Including Microlens App 20120224028 - PARK; DOO CHEOL ; et al.	2012-09-06
Shared-pixel-type image sensor and method of fabricating the same Grant 8,193,600 - Noh , et al. June 5, 2	2012-06-05
CMOS image sensors and methods of manufacturing the same Grant 7,875,491 - Park , et al. January 25, 2	2011-01-25
Stack type surface acoustic wave package, and method for manufacturing the same Grant 7,820,468 - Lee , et al. October 26, 2	2010-10-26
Stack Type Surface Acoustic Wave Package, And Method For Manufacturing The Same App 20100047949 - Lee; Seung Hee ; et al.	2010-02-25
Shared-pixel-type Image Sensor And Method Of Fabricating The Same App 20090261443 - Noh; Hyun-Pil ; et al.	2009-10-22
CMOS image sensors and methods of manufacturing the same App 20090179239 - Park; Doo-cheol ; et al.	2009-07-16
Image Sensor And Method Of Fabricating The Same App 20080224190 - Lee; Jong-Min ; et al.	2008-09-18
Stack type surface acoustic wave package, and method for manufacturing the same Grant 7,336,017 - Lee , et al. February 26, 2	2008-02-26
Stack Type Surface Acoustic Wave Package, And Method For Manufacturing The Same App 20070145541 - LEE; Seung Hee ; et al.	2007-06-28
Stack type surface acoustic wave package, and method for manufacturing the same App 20060249824 - Lee; Seung Hee ; et al.	2006-11-09
Radio frequency module and fabrication method thereof App 20060194370 - Lee; Young Jin ; et al.	2006-08-31

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