Park; DongSam

Patent Applications and Registrations

Patent applications and USPTO patent grants for Park; DongSam.The latest application filed is for "semiconductor device and method of embedding tsv semiconductor die within substrate for vertical interconnect in pop".

Company Profile

1.23.18

Park; DongSam - Kyoungki-do KR
Park; DongSam - Ichon si KR
Park; DongSam - Seongnam-si KR
Park; Dongsam - Kyonggi-do KR
Park; DongSam - Singapore SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor Device and Method of Embedding TSV Semiconductor Die Within Substrate for Vertical Interconnect in POP App 20150325553 - Park; DongSam ; et al.	2015-11-12
Semiconductor device and method of embedding TSV semiconductor die within substrate for vertical interconnect in POP Grant 9,087,701 - Park , et al. July 21, 2	2015-07-21
Integrated circuit packaging system with vertical interconnects and method of manufacture thereof Grant 8,970,044 - Choi , et al. March 3, 2	2015-03-03
Semiconductor device and method of embedding TSV semiconductor die within encapsulant with TMV for vertical interconnect in POP Grant 8,883,561 - Park , et al. November 11, 2	2014-11-11
Integrated circuit packaging system having a cavity Grant 8,704,365 - Park , et al. April 22, 2	2014-04-22
Package-on-package system with through vias and method of manufacture thereof Grant 8,598,034 - Park , et al. December 3, 2	2013-12-03
Integrated circuit packaging system with post and method of manufacture thereof Grant 8,460,968 - Park , et al. June 11, 2	2013-06-11
Package-on-package System With Through Vias And Method Of Manufacture Thereof App 20130075933 - Park; DongSam ; et al.	2013-03-28
Integrated circuit package on package system Grant 8,367,465 - Park , et al. February 5, 2	2013-02-05
Integrated Circuit Packaging System With Vertical Interconnects And Method Of Manufacture Thereof App 20120326325 - Choi; A Leam ; et al.	2012-12-27
Package-on-package system with through vias and method of manufacture thereof Grant 8,334,601 - Park , et al. December 18, 2	2012-12-18
Semiconductor Device and Method of Embedding TSV Semiconductor Die Within Substrate for Vertical Interconnect in POP App 20120273959 - Park; DongSam ; et al.	2012-11-01
Semiconductor Device and Method of Embedding TSV Semiconductor Die Within Encapsulant with TMV for Vertical Interconnect in POP App 20120273960 - Park; DongSam ; et al.	2012-11-01
Integrated Circuit Packaging System With Post And Method Of Manufacture Thereof App 20120068332 - Park; DongSam ; et al.	2012-03-22
Integrated circuit packaging system with leadframe interposer and method of manufacture thereof Grant 8,110,905 - Park , et al. February 7, 2	2012-02-07
Integrated Circuit Packaging System Having A Cavity App 20110272807 - Park; DongSam ; et al.	2011-11-10
Package-on-package System With Through Vias And Method Of Manufacture Thereof App 20110254172 - Park; DongSam ; et al.	2011-10-20
Integrated circuit package system with delamination prevention structure Grant 8,008,787 - Park , et al. August 30, 2	2011-08-30
Integrated circuit packaging system having a cavity Grant 7,989,950 - Park , et al. August 2, 2	2011-08-02
Package-on-package system with through vias and method of manufacture thereof Grant 7,986,048 - Park , et al. July 26, 2	2011-07-26
Integrated circuit packaging system with layered packaging and method of manufacture thereof Grant 7,863,100 - Yang , et al. January 4, 2	2011-01-04
Integrated Circuit Packaging System With Layered Packaging And Method Of Manufacture Thereof App 20100237482 - Yang; JoungIn ; et al.	2010-09-23
Package-on-package System With Through Vias And Method Of Manufacture Thereof App 20100207262 - Park; DongSam ; et al.	2010-08-19
Integrated Circuit Packaging System Having A Cavity App 20100038781 - Park; DongSam ; et al.	2010-02-18
Integrated Circuit Packaging System With Leadframe Interposer And Method Of Manufacture Thereof App 20090152547 - Park; DongSam ; et al.	2009-06-18
Integrated Circuit Package System With Delamination Prevention Structure App 20090072377 - Park; DongSam ; et al.	2009-03-19
Stacked integrated circuit package-in-package system Grant 7,482,203 - Song , et al. January 27, 2	2009-01-27
Stacked integrated circuit package-in-package system App 20080105965 - Song; Sungmin ; et al.	2008-05-08
Stacked integrated circuit package-in-package system Grant 7,312,519 - Song , et al. December 25, 2	2007-12-25
Stacked integrated circuit package-in-package system with recessed spacer Grant 7,298,037 - Yim , et al. November 20, 2	2007-11-20
Integrated Circuit Package On Package System App 20070216006 - Park; DongSam ; et al.	2007-09-20
Stacked Integrated Circuit Package-in-package System With Recessed Spacer App 20070194423 - Yim; Choong Bin ; et al.	2007-08-23
Stacked integrated circuit package-in-package system App 20070158810 - Song; Sungmin ; et al.	2007-07-12

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