Park; Dong Joo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Park; Dong Joo.The latest application filed is for "semiconductor devices and methods of manufacturing semiconductor devices".

Company Profile

7.19.21

Park; Dong Joo - Incheon KR
Park; Dong Joo - Gyeonggi-do KR
PARK; Dong Joo - Seoul KR
Park; Dong Joo - Seongnam-si N/A KR
Park; Dong Joo - Gangseo-gu KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrate Grant 11,430,723 - Kim , et al. August 30, 2	2022-08-30
Semiconductor devices and related methods Grant 11,398,455 - Han , et al. July 26, 2	2022-07-26
Semiconductor Devices And Methods Of Manufacturing Semiconductor Devices App 20220122921 - Choi; Myung Jea ; et al.	2022-04-21
Sensor Package And Manufacturing Method Thereof App 20220077013 - Chung; Ji Young ; et al.	2022-03-10
Semiconductor Devices And Methods Of Manufacturing Semiconductor Devices App 20210359175 - Sim; Ki Dong ; et al.	2021-11-18
Sensor package and manufacturing method thereof Grant 11,177,187 - Chung , et al. November 16, 2	2021-11-16
Semiconductor Devices And Related Methods App 20200411397 - Han; Gyu Wan ; et al.	2020-12-31
Semiconductor Devices And Related Methods App 20200381395 - Han; Gyu Wan ; et al.	2020-12-03
Semiconductor Device With Through-mold Via App 20200343163 - PARK; Dong Joo ; et al.	2020-10-29
Semiconductor device with through-mold via Grant 10,811,341 - Park , et al. October 20, 2	2020-10-20
Sensor Package And Manufacturing Method Thereof App 20200294875 - Chung; Ji Young ; et al.	2020-09-17
Sensor package and manufacturing method thereof Grant 10,672,676 - Chung , et al.	2020-06-02
Semiconductor Device With A Semiconductor Die Embedded Between An Extended Substrate And A Bottom Substrate App 20190043793 - Kim; Jae Yun ; et al.	2019-02-07
Semiconductor Device With Through-mold Via App 20180308788 - PARK; Dong Joo ; et al.	2018-10-25
Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrate Grant 10,090,230 - Kim , et al. October 2, 2	2018-10-02
Sensor Package And Manufacturing Method Thereof App 20180269121 - Chung; Ji Young ; et al.	2018-09-20
Fingerprint sensor and manufacturing method thereof Grant 9,984,947 - Chung , et al. May 29, 2	2018-05-29
Semiconductor device having overlapped via apertures Grant 9,837,331 - Kim , et al. December 5, 2	2017-12-05
Fingerprint Sensor And Manufacturing Method Thereof App 20170338163 - Chung; Ji Young ; et al.	2017-11-23
Fingerprint sensor and manufacturing method thereof Grant 9,728,476 - Chung , et al. August 8, 2	2017-08-08
Semiconductor Device With Through-mold Via App 20170117214 - PARK; Dong Joo ; et al.	2017-04-27
Stacked semiconductor package and manufacturing method thereof Grant 9,633,966 - Park , et al. April 25, 2	2017-04-25
Fingerprint Sensor And Manufacturing Method Thereof App 20160358007 - Chung; Ji Young ; et al.	2016-12-08
Stacked Semiconductor Package and Manufacturing Method Thereof App 20160104659 - Park; Dong Joo ; et al.	2016-04-14
Apparatus and method for transmitting and receiving a RACH signal in SC-FDMA system Grant 9,185,713 - Kwon , et al. November 10, 2	2015-11-10
Semiconductor device having overlapped via apertures Grant 9,177,932 - Kim , et al. November 3, 2	2015-11-03
Semiconductor Device With A Semiconductor Die Embedded Between An Extended Substrate And A Bottom Substrate App 20150084185 - Kim; Jae Yun ; et al.	2015-03-26
Apparatus And Method For Transmitting And Receiving A Rach Signal In Sc-fdma System App 20150003421 - KWON; Sung Lark ; et al.	2015-01-01
Semiconductor device having overlapped via apertures Grant 8,557,629 - Kim , et al. October 15, 2	2013-10-15
Apparatus And Method For Transmitting And Receiving A Rach Signal In Sc-fdma System App 20130250922 - KWON; Sung Lark ; et al.	2013-09-26
Apparatus And Method For Transmitting And Receiving A Rach Signal In Sc-fdma System App 20130250921 - KWON; Sung Lark ; et al.	2013-09-26
Semiconductor device and fabricating method thereof Grant 8,525,318 - Kim , et al. September 3, 2	2013-09-03
Apparatus and method for transmitting and receiving a RACH signal in SC-FDMA system Grant 8,457,076 - Kwon , et al. June 4, 2	2013-06-04
Semiconductor device including increased capacity leadframe Grant 8,089,145 - Kim , et al. January 3, 2	2012-01-03
Apparatus and method for transmitting and receiving a RACH signal in SC-FDMA system App 20070171889 - Kwon; Sung Lark ; et al.	2007-07-26

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