| Patent | Date |
|---|
Blower Unit For Vehicle, And Air Conditioning Device Comprising Same
App 20220275810 - PARK; Dae Keun ; et al. | 2022-09-01 |
Air Conditioner For Vehicle
App 20220212520 - LEE; Nam Jun ; et al. | 2022-07-07 |
Heat exchanger
Grant 11,318,809 - Kim , et al. May 3, 2 | 2022-05-03 |
Air Conditioner For Vehicle
App 20200130460 - LEE; Jong Min ; et al. | 2020-04-30 |
Heat Exchanger
App 20200108691 - Kim; Si Hyung ; et al. | 2020-04-09 |
Method and electronic device for generating new luminance level between two adjacent luminance levels
Grant 10,565,959 - Park , et al. Feb | 2020-02-18 |
Heat exchanger
Grant 10,538,139 - Kim , et al. Ja | 2020-01-21 |
Electronic device and display control method thereof
Grant 10,446,091 - Park , et al. Oc | 2019-10-15 |
Filter Cover And Air Conditioning System For Vehicle Having The Same
App 20180257459 - KIM; Dong Gyun ; et al. | 2018-09-13 |
Electronic Device And Display Control Method In Electronic Device
App 20180218710 - PARK; Hyun-Hee ; et al. | 2018-08-02 |
Double pipe type heat exchanger and method for manufacturing the same
Grant 9,821,364 - Byon , et al. November 21, 2 | 2017-11-21 |
Heat Exchanger
App 20170297408 - KIM; Si Hyung ; et al. | 2017-10-19 |
Silencer for a vehicle air conditioning system
Grant 9,541,301 - Jung , et al. January 10, 2 | 2017-01-10 |
Method And Electronic Device For Generating New Luminance Level Between Two Adjacent Luminance Levels
App 20160358583 - PARK; Kee Hyon ; et al. | 2016-12-08 |
Insertable Power Unit with Mounting Contacts for Plugging into a Mother Board
App 20160105983 - Cho; Eung San ; et al. | 2016-04-14 |
Power Unit with Conductive Slats
App 20160105984 - Cho; Eung San ; et al. | 2016-04-14 |
Silencer For A Vehicle Air Conditioning System
App 20160084521 - Jung; Hwan Myeong ; et al. | 2016-03-24 |
Silencer for a vehicle air conditioning system
Grant 9,188,360 - Jung , et al. November 17, 2 | 2015-11-17 |
III-nitride rectifier package
Grant 9,142,503 - Cheah , et al. September 22, 2 | 2015-09-22 |
Electronic Device And Display Control Method Thereof
App 20150243227 - PARK; Kee Hyon ; et al. | 2015-08-27 |
Double Pipe Type Heat Exchanger And Method For Manufacturing The Same
App 20150224561 - Byon; Sang Chul ; et al. | 2015-08-13 |
Double pipe type heat exchanger and method for manufacturing the same
Grant 9,091,487 - Byon , et al. July 28, 2 | 2015-07-28 |
Silencer For A Vehicle Air Conditioning System
App 20150053498 - Jung; Hwan Myeong ; et al. | 2015-02-26 |
Method Of Fabricating A Semiconductor Device
App 20140353790 - Park; Dae-Keun ; et al. | 2014-12-04 |
III-Nitride Rectifier Package
App 20140327014 - Cheah; Chuan ; et al. | 2014-11-06 |
Method of fabricating a semiconductor device
Grant 8,865,508 - Park , et al. October 21, 2 | 2014-10-21 |
High voltage cascoded III-nitride rectifier package with etched leadframe
Grant 8,853,707 - Cheah , et al. October 7, 2 | 2014-10-07 |
High voltage cascoded III-nitride rectifier package with stamped leadframe
Grant 8,853,706 - Cheah , et al. October 7, 2 | 2014-10-07 |
Exposed die overmolded flip chip package and fabrication method
Grant 8,847,372 - Darveaux , et al. September 30, 2 | 2014-09-30 |
High voltage cascoded III-nitride rectifier package
Grant 8,790,965 - Cheah , et al. July 29, 2 | 2014-07-29 |
Electro-Spinning Nozzle Pack and Electro-Spinning System Comprising the Same
App 20140087013 - Park; Dae Keun ; et al. | 2014-03-27 |
High Voltage Cascoded III-Nitride Rectifier Package
App 20140030854 - Cheah; Chuan ; et al. | 2014-01-30 |
Method Of Fabricating A Semiconductor Device
App 20140011316 - Park; Dae-Keun ; et al. | 2014-01-09 |
High voltage cascoded III-nitride rectifier package utilizing clips on package surface
Grant 8,546,849 - Cheah , et al. October 1, 2 | 2013-10-01 |
Exposed die overmolded flip chip package and fabrication method
Grant 8,541,260 - Darveaux , et al. September 24, 2 | 2013-09-24 |
Exposed die overmolded flip chip package and fabrication method
Grant 8,476,748 - Darveaux , et al. July 2, 2 | 2013-07-02 |
Exposed die overmolded flip chip package
Grant 8,368,194 - Darveaux , et al. February 5, 2 | 2013-02-05 |
High Voltage Cascoded III-Nitride Rectifier Package with Stamped Leadframe
App 20120280245 - Cheah; Chuan ; et al. | 2012-11-08 |
High Voltage Cascoded III-Nitride Rectifier Package Utilizing Clips on Package Support Surface
App 20120280247 - Cheah; Chuan ; et al. | 2012-11-08 |
High Voltage Cascoded III-Nitride Rectifier Package with Etched Leadframe
App 20120280246 - Cheah; Chuan ; et al. | 2012-11-08 |
Exposed die overmolded flip chip package method
Grant 8,207,022 - Darveaux , et al. June 26, 2 | 2012-06-26 |
Double Pipe Type Heat Exchanger and Method for Manufacturing the Same
App 20120043055 - Byon; Sang Chul ; et al. | 2012-02-23 |
Exposed die overmolded flip chip package and fabrication method
Grant 7,898,093 - Darveaux , et al. March 1, 2 | 2011-03-01 |
Methods of fabricating semiconductor device having slope at lower sides of interconnection hole with etch-stop layer
Grant 7,534,720 - Kang , et al. May 19, 2 | 2009-05-19 |
Methods Of Fabricating Semiconductor Device Having Slope At Lower Sides Of Interconnection Hole With Etch-stop Layer
App 20070082484 - Kang; Ki-Ho ; et al. | 2007-04-12 |
Methods of fabricating semiconductor device having slope at lower sides of interconnection hole with etch-stop layer
Grant 7,163,890 - Kang , et al. January 16, 2 | 2007-01-16 |
Methods of fabricating semiconductor device having slope at lower sides of interconnection hole with etch-stop layer
App 20050054192 - Kang, Ki-Ho ; et al. | 2005-03-10 |
Semiconductor package having a substrate including a die-attach aperture and method for packaging a semiconductor die
App 20020105095 - Lee, Ki Wook ; et al. | 2002-08-08 |
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