Park; Chi Kwan
Patent Applications and Registrations
Patent applications and USPTO patent grants for Park; Chi Kwan.The latest application filed is for "method for measuring the heights of wire interconnections".
- Park; Chi Kwan - Singapore SG
| Patent | Date |
|---|---|
| Formation of bonding wire vertical interconnects Grant 11,145,620 - Goh , et al. October 12, 2 | 2021-10-12 |
| Method For Measuring The Heights Of Wire Interconnections App 20200348243 - SONG; Keng Yew ; et al. | 2020-11-05 |
| Formation Of Bonding Wire Vertical Interconnects App 20200286855 - GOH; Mow Huat ; et al. | 2020-09-10 |
| Method of forming three-dimensional wire loops and wire loops formed using the method Grant 9,881,891 - Grijaldo , et al. January 30, 2 | 2018-01-30 |
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