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Patent applications and USPTO patent grants for Park; Chan Wang.The latest application filed is for "led package for backlight unit".
Patent | Date |
---|---|
LED package for backlight unit Grant 7,156,538 - Han , et al. January 2, 2 | 2007-01-02 |
LED package for backlight unit App 20060023451 - Han; Kyung Taeg ;   et al. | 2006-02-02 |
Light-emitting diode Grant D512,693 - Kim , et al. December 13, 2 | 2005-12-13 |
High power LED package App 20050199884 - Lee, Seon Goo ;   et al. | 2005-09-15 |
Method for fabricating surface acoustic wave filter package Grant 6,928,719 - Kim , et al. August 16, 2 | 2005-08-16 |
High power light emitting diode package and fabrication method thereof App 20050139846 - Park, Jung Kyu ;   et al. | 2005-06-30 |
Semiconductor laser diode having a PCB type lead frame App 20050063434 - Park, Chan Wang ;   et al. | 2005-03-24 |
Active predistorting linearizer with agile bypass circuit for safe mode operation Grant 6,809,587 - Ghannouchi , et al. October 26, 2 | 2004-10-26 |
Method of manufacturing semiconductor device package Grant 6,730,539 - Park , et al. May 4, 2 | 2004-05-04 |
Method for fabricating surface acoustic wave filter packages Grant 6,670,206 - Kim , et al. December 30, 2 | 2003-12-30 |
Chip package and method of manufacturing the same Grant 6,653,725 - Ahn , et al. November 25, 2 | 2003-11-25 |
Active predistorting linearizer with agile bypass circuit for safe mode operation App 20030197559 - Ghannouchi, Fadhel ;   et al. | 2003-10-23 |
Method of manufacturing semiconductor device package App 20030194855 - Park, Chan Wang ;   et al. | 2003-10-16 |
Chip package and method of manufacturing the same App 20030122230 - Ahn, Moon Bong ;   et al. | 2003-07-03 |
Method for fabricating surface acoustic wave filter packages App 20030109077 - Kim, Tae Hoon ;   et al. | 2003-06-12 |
Method for fabricating surface acoustic wave filter package App 20030009864 - Kim, Tae Hoon ;   et al. | 2003-01-16 |
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