loadpatents
name:-0.014102935791016
name:-0.010135173797607
name:-0.0010859966278076
Park; Chan Wang Patent Filings

Park; Chan Wang

Patent Applications and Registrations

Patent applications and USPTO patent grants for Park; Chan Wang.The latest application filed is for "led package for backlight unit".

Company Profile
0.7.9
  • Park; Chan Wang - Kyungki-do KR
  • Park; Chan Wang - Sungnam KR
  • Park; Chan Wang - Seoul KR
  • Park; Chan-Wang - Montreal CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
LED package for backlight unit
Grant 7,156,538 - Han , et al. January 2, 2
2007-01-02
LED package for backlight unit
App 20060023451 - Han; Kyung Taeg ;   et al.
2006-02-02
Light-emitting diode
Grant D512,693 - Kim , et al. December 13, 2
2005-12-13
High power LED package
App 20050199884 - Lee, Seon Goo ;   et al.
2005-09-15
Method for fabricating surface acoustic wave filter package
Grant 6,928,719 - Kim , et al. August 16, 2
2005-08-16
High power light emitting diode package and fabrication method thereof
App 20050139846 - Park, Jung Kyu ;   et al.
2005-06-30
Semiconductor laser diode having a PCB type lead frame
App 20050063434 - Park, Chan Wang ;   et al.
2005-03-24
Active predistorting linearizer with agile bypass circuit for safe mode operation
Grant 6,809,587 - Ghannouchi , et al. October 26, 2
2004-10-26
Method of manufacturing semiconductor device package
Grant 6,730,539 - Park , et al. May 4, 2
2004-05-04
Method for fabricating surface acoustic wave filter packages
Grant 6,670,206 - Kim , et al. December 30, 2
2003-12-30
Chip package and method of manufacturing the same
Grant 6,653,725 - Ahn , et al. November 25, 2
2003-11-25
Active predistorting linearizer with agile bypass circuit for safe mode operation
App 20030197559 - Ghannouchi, Fadhel ;   et al.
2003-10-23
Method of manufacturing semiconductor device package
App 20030194855 - Park, Chan Wang ;   et al.
2003-10-16
Chip package and method of manufacturing the same
App 20030122230 - Ahn, Moon Bong ;   et al.
2003-07-03
Method for fabricating surface acoustic wave filter packages
App 20030109077 - Kim, Tae Hoon ;   et al.
2003-06-12
Method for fabricating surface acoustic wave filter package
App 20030009864 - Kim, Tae Hoon ;   et al.
2003-01-16

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