Park; Bum Wook
Patent Applications and Registrations
Patent applications and USPTO patent grants for Park; Bum Wook.The latest application filed is for "method for forming bump of semiconductor package".
- Park; Bum Wook - Seoul KR
- Park, Bum-Wook - Ichon-shi KR
| Patent | Date |
|---|---|
| Method for forming bump of semiconductor package Grant 10,032,738 - Park , et al. July 24, 2 | 2018-07-24 |
| Method For Forming Bump Of Semiconductor Package App 20180174990 - PARK; Bum Wook ; et al. | 2018-06-21 |
| Multi-chip package Grant 7,956,450 - Park June 7, 2 | 2011-06-07 |
| Multi-chip Package App 20100084753 - Park; Bum Wook | 2010-04-08 |
| Automatic wire bonder and method for implementing thereof App 20010007084 - Koo, Ja-Hyun ; et al. | 2001-07-05 |
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