Park; Baek Soung

Patent Applications and Registrations

Patent applications and USPTO patent grants for Park; Baek Soung.The latest application filed is for "adhesive film for heat dissipation, semiconductor device including the same, and method of fabricating the semiconductor device".

Company Profile

0.13.14

Park; Baek Soung - Uiwang-si N/A KR
Park; Baek Soung - Gwangmyeong-si KR
Park; Baek Soung - Suwon-si KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Adhesive composition for semiconductor and adhesive film including the same Grant 9,957,425 - Lee , et al. May 1, 2	2018-05-01
Dicing die-bonding film and method of forming a cut on the dicing die-bonding film Grant 9,287,217 - Park , et al. March 15, 2	2016-03-15
Adhesive film for heat dissipation, semiconductor device including the same, and method of fabricating the semiconductor device Grant 9,240,364 - Park , et al. January 19, 2	2016-01-19
Optically clear adhesive for dicing die bonding film Grant 9,133,367 - Ha , et al. September 15, 2	2015-09-15
Adhesive composition for semiconductor and adhesive film comprising the same Grant 9,109,147 - Park , et al. August 18, 2	2015-08-18
Adhesive composition for semiconductors, adhesive film prepared using the same, and semiconductor device including the film Grant 8,946,343 - Park , et al. February 3, 2	2015-02-03
Adhesive Film For Heat Dissipation, Semiconductor Device Including The Same, And Method Of Fabricating The Semiconductor Device App 20140353848 - PARK; Baek Soung ; et al.	2014-12-04
Dicing Die-bonding Film And Method Of Forming A Cut On The Dicing Die-bonding Film App 20140306357 - PARK; Baek Soung ; et al.	2014-10-16
Adhesive Composition For Semiconductor And Adhesive Film Including The Same App 20140194555 - LEE; Jun Woo ; et al.	2014-07-10
Adhesive Composition For Semiconductor And Adhesive Film Comprising The Same App 20130281559 - Park; Baek Soung ; et al.	2013-10-24
Adhesive Composition For Semiconductors, Adhesive Film Prepared Using The Same, And Semiconductor Device Including The Film App 20130041088 - PARK; Baek Soung ; et al.	2013-02-14
Optically Clear Adhesive For Dicing Die Bonding Film App 20120171481 - Ha; Kyoung Jin ; et al.	2012-07-05
Die-attach Film And Method Of Manufacturing The Same App 20110159223 - Park; Baek Soung ; et al.	2011-06-30
Method of and system for evaluating tactile sensations of car seat covers using statistical recursive and artificial neural network models Grant 7,747,548 - Noh , et al. June 29, 2	2010-06-29
Photocurable composition for the formation of pressure-sensitive adhesive layer and dicing tape produced using the same App 20090075008 - Hwang; Yong Ha ; et al.	2009-03-19
Method of and system for evaluating tactile sensations of car seat covers using artificial neural network App 20070085826 - Noh; Jung Gyun ; et al.	2007-04-19

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