PARICHEHREH; Vahidreza
Patent Applications and Registrations
Patent applications and USPTO patent grants for PARICHEHREH; Vahidreza.The latest application filed is for "via structures having tapered profiles for embedded interconnect bridge substrates".
- PARICHEHREH; Vahidreza - Gilbert AZ
| Patent | Date |
|---|---|
| Via Structures Having Tapered Profiles For Embedded Interconnect Bridge Substrates App 20220285278 - ECTON; Jeremy D. ; et al. | 2022-09-08 |
| Via structures having tapered profiles for embedded interconnect bridge substrates Grant 11,373,951 - Ecton , et al. June 28, 2 | 2022-06-28 |
| Electronic device package with reduced thickness variation Grant 10,910,327 - Li , et al. February 2, 2 | 2021-02-02 |
| Electronic Device Package With Reduced Thickness Variation App 20200312787 - Li; Yonggang ; et al. | 2020-10-01 |
| Microelectronic Assemblies Having Conductive Structures With Different Thicknesses App 20200205279 - Ecton; Jeremy ; et al. | 2020-06-25 |
| Prism-mask For Angled Patterning Applications App 20200096873 - PARICHEHREH; Vahidreza ; et al. | 2020-03-26 |
| Via Structures Having Tapered Profiles For Embedded Interconnect Bridge Substrates App 20190304912 - Ecton; Jeremy D. ; et al. | 2019-10-03 |
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