loadpatents
name:-0.019405841827393
name:-0.040876150131226
name:-0.0031599998474121
Paranjpe; Ajit P. Patent Filings

Paranjpe; Ajit P.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Paranjpe; Ajit P..The latest application filed is for "micro-led transfer methods using light-based debonding".

Company Profile
2.33.9
  • Paranjpe; Ajit P. - Basking Ridge NJ
  • Paranjpe; Ajit P. - Fremont CA
  • Paranjpe; Ajit P. - Sunnyvale CA
  • Paranjpe; Ajit P. - Plano TX
  • Paranjpe; Ajit P. - Dallas TX
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Micro-LED transfer methods using light-based debonding
Grant 10,985,046 - Paranjpe , et al. April 20, 2
2021-04-20
Micro-LED Transfer Methods Using Light-Based Debonding
App 20190393069 - Paranjpe; Ajit P. ;   et al.
2019-12-26
Multi-wafer rotating disc reactor with inertial planetary drive
Grant 9,230,846 - Celaru , et al. January 5, 2
2016-01-05
Multi-wafer Rotating Disc Reactor With Inertial Planetary Drive
App 20110300297 - Celaru; Adrian ;   et al.
2011-12-08
Method and apparatus for layer by layer deposition of thin films
Grant 7,393,561 - Paranjpe July 1, 2
2008-07-01
Atomic layer deposition for fabricating thin films
Grant 7,037,574 - Paranjpe , et al. May 2, 2
2006-05-02
Low temperature sin deposition methods
App 20060084283 - Paranjpe; Ajit P. ;   et al.
2006-04-20
Apparatus and method for multi-target physical-vapor deposition of a multi-layer material structure
Grant 6,905,578 - Moslehi , et al. June 14, 2
2005-06-14
Method for fabricating a semiconductor chip interconnect
Grant 6,812,126 - Paranjpe , et al. November 2, 2
2004-11-02
Retrofittable vehicle collision warning apparatus
Grant 6,696,931 - Paranjpe February 24, 2
2004-02-24
Microelectronic interconnect material with adhesion promotion layer and fabrication method
Grant 6,645,847 - Paranjpe , et al. November 11, 2
2003-11-11
Microelectronic interconnect material with adhesion promotion layer and fabrication method
Grant 6,627,995 - Paranjpe , et al. September 30, 2
2003-09-30
Method and system for physically-assisted chemical-vapor deposition
Grant 6,596,133 - Moslehi , et al. July 22, 2
2003-07-22
Method and apparatus for layer by layer deposition of thin films
App 20030134038 - Paranjpe, Ajit P.
2003-07-17
Atomic layer deposition for fabricating thin films
App 20030003635 - Paranjpe, Ajit P. ;   et al.
2003-01-02
Inductively-coupled-plasma ionized physical-vapor deposition apparatus, method and system
Grant 6,471,830 - Moslehi , et al. October 29, 2
2002-10-29
Method for forming a copper film on a substrate
Grant 6,461,675 - Paranjpe , et al. October 8, 2
2002-10-08
Microelectronic interconnect material with adhesion promotion layer and fabrication method
App 20020137332 - Paranjpe, Ajit P. ;   et al.
2002-09-26
Method of chemical-vapor deposition of a material
Grant 6,444,263 - Paranjpe , et al. September 3, 2
2002-09-03
Method and apparatus for thin film deposition using an active shutter
Grant 6,444,103 - Moslehi , et al. September 3, 2
2002-09-03
Microelectronic interconnect material with adhesion promotion layer and fabrication method
App 20020102838 - Paranjpe, Ajit P. ;   et al.
2002-08-01
Method of making an integrated circuit interconnect
Grant 6,391,754 - Paranjpe May 21, 2
2002-05-21
Microelectronic interconnect material with adhesion promotion layer and fabrication method
Grant 6,365,502 - Paranjpe , et al. April 2, 2
2002-04-02
Retrofittable vehicle collision warning apparatus
App 20020030591 - Paranjpe, Ajit P.
2002-03-14
Method For Forming A Copper Film On A Substrate
App 20020006468 - PARANJPE, AJIT P. ;   et al.
2002-01-17
Retrofittable vehicle collision warning apparatus
Grant 6,339,369 - Paranjpe January 15, 2
2002-01-15
Semiconductor chip interconnect barrier material and fabrication method
Grant 6,294,836 - Paranjpe , et al. September 25, 2
2001-09-25
Self-guided, self-propelled, convertible cleaning apparatus
Grant 5,634,237 - Paranjpe June 3, 1
1997-06-03
Method for temperature measurement in rapid thermal process systems
Grant 5,601,366 - Paranjpe February 11, 1
1997-02-11
Use of a capping layer to attain low titanium-silicide sheet resistance and uniform silicide thickness for sub-micron silicon and polysilicon lines
Grant 5,593,924 - Apte , et al. January 14, 1
1997-01-14
Structure and method for incorporating an inductively coupled plasma source in a plasma processing chamber
Grant 5,580,385 - Paranjpe , et al. December 3, 1
1996-12-03
Temperature sensor and method
Grant 5,501,637 - Duncan , et al. March 26, 1
1996-03-26
Method for cleaning semiconductor wafers using liquified gases
Grant 5,494,526 - Paranjpe February 27, 1
1996-02-27
Plasma source employing spiral RF coil and method for using same
Grant 5,436,528 - Paranjpe July 25, 1
1995-07-25
Method and apparatus for low-temperature semiconductor processing
Grant 5,435,379 - Moslehi , et al. July 25, 1
1995-07-25
Method for planarization
Grant 5,434,107 - Paranjpe July 18, 1
1995-07-18
RF induction plasma source for plasma processing
Grant 5,430,355 - Paranjpe July 4, 1
1995-07-04
Plasma processing system using surface wave plasma generating apparatus and method
Grant 5,389,153 - Paranjpe , et al. February 14, 1
1995-02-14
Interferometric temperature measurement system and method
Grant 5,249,865 - Paranjpe , et al. October 5, 1
1993-10-05
Plasma source and method of manufacturing
Grant 5,231,334 - Paranjpe July 27, 1
1993-07-27
Apparatus and method for in-situ deep ultraviolet photon-assisted semiconductor wafer processing
Grant 5,217,559 - Moslehi , et al. June 8, 1
1993-06-08

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