Paquet; Marie-Claude

Patent Applications and Registrations

Patent applications and USPTO patent grants for Paquet; Marie-Claude.The latest application filed is for "method and apparatus for strain relieving surface mount attached connectors".

Company Profile

4.20.18

Paquet; Marie-Claude - Quebec CA
Paquet; Marie-Claude - Bromont CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method and apparatus for strain relieving surface mount attached connectors Grant 10,750,615 - Gaynes , et al. A	2020-08-18
Method And Apparatus For Strain Relieving Surface Mount Attached Connectors App 20190281702 - Gaynes; Michael A. ; et al.	2019-09-12
Method and apparatus for strain relieving surface mount attached connectors Grant 10,368,441 - Gaynes , et al. July 30, 2	2019-07-30
Nanofiller in an optical interface Grant 10,338,325 - Janta-Polczynski , et al.	2019-07-02
Method And Apparatus For Strain Relieving Surface Mount Attached Connectors App 20180213645 - Gaynes; Michael A. ; et al.	2018-07-26
Method and apparatus for strain relieving surface mount attached connectors Grant 9,974,179 - Gaynes , et al. May 15, 2	2018-05-15
Method And Apparatus For Strain Relieving Surface Mount Attached Connectors App 20170196089 - Gaynes; Michael A. ; et al.	2017-07-06
Low-stress dual underfill packaging Grant 9,698,072 - Brofman , et al. July 4, 2	2017-07-04
Method and apparatus for strain relieving surface mount attached connectors Grant 9,627,784 - Gaynes , et al. April 18, 2	2017-04-18
Low-stress dual underfill packaging Grant 9,373,559 - Brofman , et al. June 21, 2	2016-06-21
Low-stress Dual Underfill Packaging App 20160049345 - Brofman; Peter J. ; et al.	2016-02-18
Low-stress Dual Underfill Packaging App 20150255312 - Brofman; Peter J. ; et al.	2015-09-10
Underfill adhesion measurements at a microscopic scale Grant 8,796,049 - Cadotte , et al. August 5, 2	2014-08-05
Passivation layer surface topography modifications for improved integrity in packaged assemblies Grant 8,786,059 - Blander , et al. July 22, 2	2014-07-22
Underfill Adhesion Measurements At A Microscopic Scale App 20140030827 - CADOTTE; Maxime ; et al.	2014-01-30
Underfill flow guide structures and method of using same Grant 8,580,673 - Daubenspeck , et al. November 12, 2	2013-11-12
Controlling Density Of Particles Within Underfill Surrounding Solder Bump Contacts App 20130161822 - Barbeau; Stephane S. ; et al.	2013-06-27
Underfill Flow Guide Structures And Method Of Using Same App 20130122661 - Daubenspeck; Timothy H. ; et al.	2013-05-16
Underfill flow guide structures and method of using same Grant 8,409,980 - Daubenspeck , et al. April 2, 2	2013-04-02
Passivation layer extension to chip edge Grant 8,299,581 - Daubenspeck , et al. October 30, 2	2012-10-30
Passivation Layer Surface Topography Modifications For Improved Integrity In Packaged Assemblies App 20120228748 - BLANDER; ALEXANDRE ; et al.	2012-09-13
Passivation layer surface topography modifications for improved integrity in packaged assemblies Grant 8,236,615 - Blander , et al. August 7, 2	2012-08-07
Controlling Density Of Particles Within Underfill Surrounding Solder Bump Contacts App 20120168956 - Barbeau; Stephane S. ; et al.	2012-07-05
Underfill Flow Guide Structures And Method Of Using Same App 20120108015 - Daubenspeck; Timothy H. ; et al.	2012-05-03
Underfill flow guide structures Grant 8,159,067 - Daubenspeck , et al. April 17, 2	2012-04-17
Passivation Layer Extension To Chip Edge App 20110298095 - Daubenspeck; Timothy H. ; et al.	2011-12-08
Passivation Layer Surface Topography Modifications For Improved Integrity In Packaged Assemblies App 20110121469 - Blander; Alexandre ; et al.	2011-05-26
Underfill Flow Guide Structures And Method Of Using Same App 20100038780 - Daubenspeck; Timothy H. ; et al.	2010-02-18
Transfer molding of integrated circuit packages Grant 6,988,882 - Boyaud , et al. January 24, 2	2006-01-24
Transfer molding of integrated circuit packages App 20050275091 - Boyaud, Marie-France ; et al.	2005-12-15
Transfer molding of integrated circuit packages Grant 6,956,296 - Boyaud , et al. October 18, 2	2005-10-18
Transfer holding of integrated circuit packages App 20040071805 - Boyaud, Marie-France ; et al.	2004-04-15
Transfer molding of integrated circuit packages Grant 6,656,773 - Boyaud , et al. December 2, 2	2003-12-02
Transfer molding of integrated circuit packages App 20020192876 - Boyaud, Marie-France ; et al.	2002-12-19

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