Papathomas; Konstantinos I.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Papathomas; Konstantinos I..The latest application filed is for "electrically conductive adhesive (eca) for multilayer device interconnects".

Company Profile

0.50.42

Papathomas; Konstantinos I. - Endicott NY US

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electrically conductive adhesive (ECA) for multilayer device interconnects Grant 9,451,693 - Das , et al. September 20, 2	2016-09-20
Circuitized substrate with low loss capacitive material and method of making same Grant 8,446,707 - Das , et al. May 21, 2	2013-05-21
Electrically Conductive Adhesive (eca) For Multilayer Device Interconnects App 20130033827 - Das; Rabindra N. ; et al.	2013-02-07
Conductive Metal Micro-pillars For Enhanced Electrical Interconnection App 20120257343 - Das; Rabindra N. ; et al.	2012-10-11
Encapsulant of epoxy or cyanate ester resin, reactive flexibilizer and thermoplastic Grant 7,560,501 - Papathomas July 14, 2	2009-07-14
Encapsulant Composition App 20080227902 - Papathomas; Konstantinos I.	2008-09-18
Method and structure for producing Z-axis interconnection assembly of printed wiring board elements Grant 7,402,254 - Curcio , et al. July 22, 2	2008-07-22
Electronic package with epoxy or cyanate ester resin encapsulant Grant 7,384,682 - Papathomas June 10, 2	2008-06-10
Encapsulant composition and electronic package utilizing same Grant 7,321,005 - Papathomas January 22, 2	2008-01-22
Encapsulant Composition And Electronic Package Utilizing Same App 20080012156 - Papathomas; Konstantinos I.	2008-01-17
Encapsulant Composition And Electronic Package Utilizing Same App 20070185227 - Papathomas; Konstantinos I.	2007-08-09
Encapsulant composition and electronic package utilizing same Grant 7,192,997 - Papathomas March 20, 2	2007-03-20
Solid via layer to layer interconnect Grant 7,076,869 - Curcio , et al. July 18, 2	2006-07-18
Cap attach surface modification for improved adhesion Grant 7,064,013 - Buchwalter , et al. June 20, 2	2006-06-20
Semiconductor device having a thermoset-containing dielectric material and methods for fabricating the same Grant 7,014,731 - Farquhar , et al. March 21, 2	2006-03-21
Formation of multisegmented plated through holes Grant 6,996,903 - Farquhar , et al. February 14, 2	2006-02-14
Method of making and interconnect structure Grant 6,931,726 - Boyko , et al. August 23, 2	2005-08-23
Tamper-responding encapsulated enclosure having flexible protective mesh structure Grant 6,929,900 - Farquhar , et al. August 16, 2	2005-08-16
Formation of multisegmented plated through holes App 20050079289 - Farquhar, Donald S. ; et al.	2005-04-14
Cap attach surface modification for improved adhesion App 20040238967 - Buchwalter, Stephen Leslie ; et al.	2004-12-02
Laminate circuit structure and method of fabricating Grant 6,820,332 - Japp , et al. November 23, 2	2004-11-23
Cap attach surface modification for improved adhesion Grant 6,803,256 - Buchwalter , et al. October 12, 2	2004-10-12
Tamper-responding encapsulated enclosure having flexible protective mesh structure App 20040195001 - Farquhar, Donald S. ; et al.	2004-10-07
Flowable compositions and use in filling vias and plated through-holes Grant 6,794,040 - Johansson , et al. September 21, 2	2004-09-21
Lead protective coating composition, process and structure thereof Grant 6,790,473 - Papathomas , et al. September 14, 2	2004-09-14
Resin composition with a polymerizing agent and method of manufacturing prepreg and other laminate structures therefrom Grant 6,734,259 - Japp , et al. May 11, 2	2004-05-11
Die attachment with reduced adhesive bleed-out Grant 6,734,569 - Appelt , et al. May 11, 2	2004-05-11
Resin Composition With A Polymerizing Agent And Method Of Manufacturing Prepreg And Other Laminate Structures Therefrom App 20040082730 - Japp, Robert M. ; et al.	2004-04-29
Method and structure for producing Z-axis interconnection assembly of printed wiring board elements App 20040052945 - Curcio, Brian E. ; et al.	2004-03-18
Formation of multisegmented plated through holes Grant 6,700,078 - Farquhar , et al. March 2, 2	2004-03-02
Tamper-responding encapsulated enclosure having flexible protective mesh structure Grant 6,686,539 - Farquhar , et al. February 3, 2	2004-02-03
Interconnect structure and method of making same Grant 6,660,945 - Boyko , et al. December 9, 2	2003-12-09
Hole fill composition and method for filling holes in a substrate App 20030216490 - Farquhar, Donald S. ; et al.	2003-11-20
Method and structure for producing Z-axis interconnection assembly of printed wiring board elements Grant 6,645,607 - Curcio , et al. November 11, 2	2003-11-11
Interconnect structure and method of making same App 20030172525 - Boyko, Christina M. ; et al.	2003-09-18
Method and article for filling apertures in a high performance electronic substrate Grant 6,599,833 - Farquhar , et al. July 29, 2	2003-07-29
Printed wiring board structure with z-axis interconnections Grant 6,593,534 - Jones , et al. July 15, 2	2003-07-15
Hole fill composition and method for filling holes in a substrate Grant 6,589,639 - Farquhar , et al. July 8, 2	2003-07-08
Die attachment with reduced adhesive bleed-out App 20030119226 - Appelt, Bernd Karl ; et al.	2003-06-26
Method for filling high aspect ratio via holes in electronic substrates Grant 6,581,280 - Curcio , et al. June 24, 2	2003-06-24
Structure for high speed printed wiring boards with multiple differential impedance-controlled layer Grant 6,570,102 - Miller , et al. May 27, 2	2003-05-27
Interconnect structure and method of making same App 20030070839 - Boyko, Christina M. ; et al.	2003-04-17
Flowable compositions and use in filling vias and plated through-holes App 20030064212 - Johansson, Gary Alan ; et al.	2003-04-03
Laminate circuit structure and method of fabricating App 20030042046 - Japp, Robert M. ; et al.	2003-03-06
Method of controlling the spread of an adhesive on a circuitized organic substrate Grant 6,524,654 - Konrad , et al. February 25, 2	2003-02-25
Solid via layer to layer interconnect App 20030035272 - Curcio, Brian E. ; et al.	2003-02-20
Halogen free triazines, bismaleimide/epoxy polymers, prepregs made therefrom for circuit boards and resin coated articles, and use App 20030003305 - Japp, Robert Maynard ; et al.	2003-01-02
Flip chip package with improved cap design and process for making thereof Grant 6,501,171 - Farquhar , et al. December 31, 2	2002-12-31
Method and structure for producing Z-axis interconnection assembly of printed wiring board elements App 20020192444 - Curcio, Brian E. ; et al.	2002-12-19
Hole fill composition and method for filling holes in a substrate App 20020187316 - Farquhar, Donald S. ; et al.	2002-12-12
Solid Via Layer To Layer Interconnect App 20020179334 - Curcio, Brian E. ; et al.	2002-12-05
Method and article for filling apertures in a high performance electronic substrate App 20020182832 - Farquhar, Donald S. ; et al.	2002-12-05
Method for filling high aspect ratio via holes in electronic substrates and the resulting holes App 20020179335 - Curcio, Brian Eugene ; et al.	2002-12-05
Composite laminate circuit structure and methods of interconnecting the same Grant 6,479,093 - Lauffer , et al. November 12, 2	2002-11-12
Formation of multisegmented plated through holes App 20020164468 - Farquhar, Donald S. ; et al.	2002-11-07
Method And Structure For Producing Z-axis Interconnection Assembly Of Printed Wiring Board Elements App 20020150741 - Curcio, Brian E. ; et al.	2002-10-17
Method and structure for producing Z-axis interconnection assembly of printed wiring board elements Grant 6,465,084 - Curcio , et al. October 15, 2	2002-10-15
Lead protective coating composition, process and structure thereof App 20020132873 - Papathomas, Konstantinos I. ; et al.	2002-09-19
Printed wiring board structure with z-axis interconnections App 20020131229 - Jones, Gerald W. ; et al.	2002-09-19
Method of preparing a printed circuit board Grant RE37,840 - Bhatt , et al. September 17, 2	2002-09-17
Method for filling high aspect ratio via holes in electronic substrates and the resulting holes Grant 6,452,117 - Curcio , et al. September 17, 2	2002-09-17
Cap attach surface modification for improved adhesion App 20020121698 - Buchwalter, Stephen Leslie ; et al.	2002-09-05
Encapsulant composition and electronic package utilizing same App 20020105093 - Papathomas, Konstantinos I.	2002-08-08
Flowable compositions and use in filling vias and plated through-holes Grant 6,427,325 - Johansson , et al. August 6, 2	2002-08-06
Flip chip package with improved cap design and process for making thereof App 20020100969 - Farquhar, Donald S. ; et al.	2002-08-01
Formation of multisegmented plated through holes Grant 6,426,470 - Farquhar , et al. July 30, 2	2002-07-30
Composite laminate circuit structure and methods of interconnecting the same App 20020098331 - Lauffer, John M. ; et al.	2002-07-25
Method and article for filling apertures in a high performance electronic substrate App 20020093072 - Farquhar, Donald S. ; et al.	2002-07-18
Formation Of Multisegmented Plated Through Holes App 20020092677 - Farquhar, Donald S. ; et al.	2002-07-18
Tamper-responding encapsulated enclosure having flexible protective mesh structure App 20020084090 - Farquhar, Donald S. ; et al.	2002-07-04
Multilayer capacitance structure and circuit board containing the same and method of forming the same App 20020080556 - Japp, Robert M. ; et al.	2002-06-27
Structure for high speed printed wiring boards with multiple differential impedance-controlled layer App 20020007966 - Miller, Thomas Richard ; et al.	2002-01-24
Smiconductor device having a thermoset- containing dielectric material and methods for fabricating the same App 20010041389 - Farquhar, Donald S. ; et al.	2001-11-15
Process for reducing extraneous metal plating App 20010040047 - Konrad, John Joseph ; et al.	2001-11-15
Method and structure for preventing adhesive bleed onto surfaces App 20010028117 - Appelt, Bernd K. ; et al.	2001-10-11
Method for filling high aspect ratio via holes in electronic substrates and the resulting holes App 20010027842 - Curcio, Brian E. ; et al.	2001-10-11
Process for filling apertures in a circuit board or chip carrier App 20010008747 - Appelt, Bernd Karl ; et al.	2001-07-19
Semiconductor device having a thermoset-containing dielectric material and methods for fabricating the same Grant 6,254,972 - Farquhar , et al. July 3, 2	2001-07-03
Encapsulating a solder joint with a photo cured epoxy resin or cyanate Grant 6,129,955 - Papathomas , et al. October 10, 2	2000-10-10
Flowable compositions and use in filling vias and plated through-holes Grant 6,090,474 - Johansson , et al. July 18, 2	2000-07-18
Film composition and method for a planar surface atop a plated through hole Grant 6,037,096 - Fletcher , et al. March 14, 2	2000-03-14
Organic controlled collapse chip connector (C4) ball grid array (BGA) chip carrier with dual thermal expansion rates Grant 5,900,675 - Appelt , et al. May 4, 1	1999-05-04
Method of preparing a printed circuit board Grant 5,557,844 - Bhatt , et al. September 24, 1	1996-09-24
Method of sealing a soldered joint between a semiconductor device and a substrate Grant 5,536,765 - Papathomas July 16, 1	1996-07-16
Method for making printed circuit boards with selectivity filled plated through holes Grant 5,487,218 - Bhatt , et al. January 30, 1	1996-01-30
Composite for providing a rigid-flexible circuit board construction and method for fabrication thereof Grant 5,378,306 - Cibulsky , et al. January 3, 1	1995-01-03
Triazine thin film adhesives Grant 5,319,244 - Papathomas , et al. June 7, 1	1994-06-07
Composite for providing a rigid-flexible circuit board construction and method for fabrication thereof Grant 5,288,542 - Cibulsky , et al. February 22, 1	1994-02-22
Triazine networks with homogeneous and oriented structures and method for making same Grant 5,136,011 - Barclay , et al. August 4, 1	1992-08-04

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