| Patent | Date |
|---|
Methods And Apparatus For Processing A Substrate
App 20220181142 - HSIUNG; Chien-Kang ; et al. | 2022-06-09 |
Water Soluble Organic-inorganic Hybrid Mask Formulations And Their Applications
App 20220076944 - Li; Wenguang ; et al. | 2022-03-10 |
Hybrid wafer dicing approach using a split beam laser scribing process and plasma etch process
Grant 11,217,536 - Park , et al. January 4, 2 | 2022-01-04 |
Water soluble organic-inorganic hybrid mask formulations and their applications
Grant 11,211,247 - Li , et al. December 28, 2 | 2021-12-28 |
Laser Scribing Trench Opening Control In Wafer Dicing Using Hybrid Laser Scribing And Plasma Etch Approach
App 20210398854 - Park; Jungrae ; et al. | 2021-12-23 |
Automatic Kerf Offset Mapping And Correction System For Laser Dicing
App 20210398853 - Balakrishnan; Karthik ; et al. | 2021-12-23 |
Light-absorbing mask for hybrid laser scribing and plasma etch wafer singulation process
Grant 11,158,540 - Li , et al. October 26, 2 | 2021-10-26 |
Water Soluble Organic-inorganic Hybrid Mask Formulations And Their Applications
App 20210242014 - Li; Wenguang ; et al. | 2021-08-05 |
Hybrid Wafer Dicing Approach Using A Spatially Multi-focused Laser Beam Laser Scribing Process And Plasma Etch Process
App 20210233816 - Park; Jungrae ; et al. | 2021-07-29 |
Electrostatic Chuck With Reduced Current Leakage For Hybrid Laser Scribing And Plasma Etch Wafer Singulation Process
App 20210175086 - Abhinand; Sai ; et al. | 2021-06-10 |
Hybrid wafer dicing approach using a spatially multi-focused laser beam laser scribing process and plasma etch process
Grant 11,011,424 - Park , et al. May 18, 2 | 2021-05-18 |
Hybrid Wafer Dicing Approach Using A Uniform Rotating Beam Laser Scribing Process And Plasma Etch Process
App 20210050263 - Park; Jungrae ; et al. | 2021-02-18 |
Hybrid Wafer Dicing Approach Using A Spatially Multi-focused Laser Beam Laser Scribing Process And Plasma Etch Process
App 20210043515 - Park; Jungrae ; et al. | 2021-02-11 |
Hybrid wafer dicing approach using a uniform rotating beam laser scribing process and plasma etch process
Grant 10,903,121 - Park , et al. January 26, 2 | 2021-01-26 |
Hybrid wafer dicing approach using a multiple pass laser scribing process and plasma etch process
Grant 10,535,561 - Park , et al. Ja | 2020-01-14 |
Hybrid Wafer Dicing Approach Using A Multiple Pass Laser Scribing Process And Plasma Etch Process
App 20190279902 - PARK; Jungrae ; et al. | 2019-09-12 |
Light-absorbing Mask For Hybrid Laser Scribing And Plasma Etch Wafer Singulation Process
App 20180342422 - Li; Wenguang ; et al. | 2018-11-29 |
Hybrid Wafer Dicing Approach Using A Split Beam Laser Scribing Process And Plasma Etch Process
App 20180226355 - PARK; JUNGRAE ; et al. | 2018-08-09 |
Hybrid wafer dicing approach using a split beam laser scribing process and plasma etch process
Grant 9,972,575 - Park , et al. May 15, 2 | 2018-05-15 |
Hybrid wafer dicing approach using a rotating beam laser scribing process and plasma etch process
Grant 9,852,997 - Park , et al. December 26, 2 | 2017-12-26 |
Etch mask for hybrid laser scribing and plasma etch wafer singulation process
Grant 9,793,132 - Li , et al. October 17, 2 | 2017-10-17 |
Hybrid Wafer Dicing Approach Using A Rotating Beam Laser Scribing Process And Plasma Etch Process
App 20170278801 - Park; Jungrae ; et al. | 2017-09-28 |
Wafer coating
Grant 9,768,014 - Park , et al. September 19, 2 | 2017-09-19 |
Hybrid Wafer Dicing Approach Using A Split Beam Laser Scribing Process And Plasma Etch Process
App 20170256500 - Park; Jungrae ; et al. | 2017-09-07 |
UV-cure pre-treatment of carrier film for wafer dicing using hybrid laser scribing and plasma etch approach
Grant 9,601,375 - Lei , et al. March 21, 2 | 2017-03-21 |
Water soluble mask formation by dry film lamination
Grant 9,583,375 - Lei , et al. February 28, 2 | 2017-02-28 |
Uv-cure Pre-treatment Of Carrier Film For Wafer Dicing Using Hybrid Laser Scribing And Plasma Etch Approach
App 20160315009 - Lei; Wei-Sheng ; et al. | 2016-10-27 |
Water soluble mask formation by dry film vacuum lamination for laser and plasma dicing
Grant 9,443,765 - Lei , et al. September 13, 2 | 2016-09-13 |
Method of outgassing a mask material deposited over a workpiece in a process tool
Grant 9,412,619 - Kumar , et al. August 9, 2 | 2016-08-09 |
Hybrid wafer dicing approach using a line shaped laser beam profile laser scribing process and plasma etch process
Grant 9,355,907 - Lei , et al. May 31, 2 | 2016-05-31 |
Dicing wafers having solder bumps on wafer backside
Grant 9,343,366 - Lei , et al. May 17, 2 | 2016-05-17 |
Screen print mask for laser scribe and plasma etch wafer dicing process
Grant 9,312,177 - Kumar , et al. April 12, 2 | 2016-04-12 |
Method of wafer dicing using hybrid laser scribing and plasma etch approach with mask plasma treatment for improved mask etch resistance
Grant 9,299,611 - Lei , et al. March 29, 2 | 2016-03-29 |
Hybrid Wafer Dicing Approach Using An Adaptive Optics-controlled Laser Scribing Process And Plasma Etch Process
App 20160086851 - Park; Jungrae ; et al. | 2016-03-24 |
Hybrid wafer dicing approach using an adaptive optics-controlled laser scribing process and plasma etch process
Grant 9,281,244 - Park , et al. March 8, 2 | 2016-03-08 |
Dicing processes for thin wafers with bumps on wafer backside
Grant 9,275,902 - Lei , et al. March 1, 2 | 2016-03-01 |
Method Of Outgassing A Mask Material Deposited Over A Workpiece In A Process Tool
App 20160049313 - KUMAR; PRABHAT ; et al. | 2016-02-18 |
Hybrid wafer dicing approach using a bessel beam shaper laser scribing process and plasma etch process
Grant 9,245,803 - Park , et al. January 26, 2 | 2016-01-26 |
Maskless hybrid laser scribing and plasma etching wafer dicing process
Grant 9,209,084 - Lei , et al. December 8, 2 | 2015-12-08 |
Hybrid wafer dicing approach using a phase modulated laser beam profile laser scribing process and plasma etch process
Grant 9,196,536 - Park , et al. November 24, 2 | 2015-11-24 |
Hybrid wafer dicing approach using laser scribing process based on an elliptical laser beam profile or a spatio-temporal controlled laser beam profile
Grant 9,177,861 - Park , et al. November 3, 2 | 2015-11-03 |
Dicing Wafers Having Solder Bumps On Wafer Backside
App 20150303111 - Lei; Wei-Sheng ; et al. | 2015-10-22 |
Method of die singulation using laser ablation and induction of internal defects with a laser
Grant 9,165,832 - Papanu , et al. October 20, 2 | 2015-10-20 |
Water Soluble Mask Formation By Dry Film Lamination
App 20150294892 - Lei; Wei-Sheng ; et al. | 2015-10-15 |
Vacuum lamination of polymeric dry films for wafer dicing using hybrid laser scribing and plasma etch approach
Grant 9,159,624 - Lei , et al. October 13, 2 | 2015-10-13 |
Hybrid Wafer Dicing Approach Using Collimated Laser Scribing Process And Plasma Etch
App 20150287638 - Park; Jungrae ; et al. | 2015-10-08 |
Dicing Processes For Thin Wafers With Bumps On Wafer Backside
App 20150279739 - Lei; Wei-Sheng ; et al. | 2015-10-01 |
Approaches For Cleaning A Wafer During Hybrid Laser Scribing And Plasma Etching Wafer Dicing Processes
App 20150255349 - Holden; James Matthew ; et al. | 2015-09-10 |
Baking Tool For Improved Wafer Coating Process
App 20150255346 - PARK; Jungrae ; et al. | 2015-09-10 |
Baking tool for improved wafer coating process
Grant 9,130,030 - Park , et al. September 8, 2 | 2015-09-08 |
Bi-layer wafer-level underfill mask for wafer dicing and approaches for performing wafer dicing
Grant 9,130,056 - Holden , et al. September 8, 2 | 2015-09-08 |
Hybrid Wafer Dicing Approach Using Temporally-controlled Laser Scribing Process And Plasma Etch
App 20150243559 - Park; Jungrae ; et al. | 2015-08-27 |
Improved Wafer Coating
App 20150221505 - Park; Jungrae ; et al. | 2015-08-06 |
Water Soluble Mask Formation By Dry Film Vacuum Lamination For Laser And Plasma Dicing
App 20150214111 - Lei; Wei-Sheng ; et al. | 2015-07-30 |
Wafer Dicing Using Hybrid Laser Scribing And Plasma Etch Approach With Mask Plasma Treatment For Improved Mask Etch Resistance
App 20150214109 - Lei; Wei-Sheng ; et al. | 2015-07-30 |
Singulation of wafers having wafer-level underfill
Grant 9,093,518 - Lei , et al. July 28, 2 | 2015-07-28 |
Residue removal from singulated die sidewall
Grant 9,076,860 - Lei , et al. July 7, 2 | 2015-07-07 |
Screen Print Mask For Laser Scribe And Plasma Etch Wafer Dicing Process
App 20150162243 - Kumar; Prabhat ; et al. | 2015-06-11 |
Maskless hybrid laser scribing and plasma etching wafer dicing process
Grant 9,041,198 - Lei , et al. May 26, 2 | 2015-05-26 |
Maskless Hybrid Laser Scribing And Plasma Etching Wafer Dicing Process
App 20150111364 - Lei; Wei-Sheng ; et al. | 2015-04-23 |
Maskless Hybrid Laser Scribing And Plasma Etching Wafer Dicing Process
App 20150111363 - Lei; Wei-Sheng ; et al. | 2015-04-23 |
Wafer dicing using hybrid laser scribing and plasma etch approach with intermediate non-reactive post mask-opening clean
Grant 9,012,305 - Lei , et al. April 21, 2 | 2015-04-21 |
Wafer coating
Grant 8,991,329 - Park , et al. March 31, 2 | 2015-03-31 |
Laser-dominated laser scribing and plasma etch hybrid wafer dicing
Grant 8,975,163 - Lei , et al. March 10, 2 | 2015-03-10 |
Water soluble mask formation by dry film lamination
Grant 8,932,939 - Lei , et al. January 13, 2 | 2015-01-13 |
Water soluble mask formation by dry film vacuum lamination for laser and plasma dicing
Grant 8,927,393 - Lei , et al. January 6, 2 | 2015-01-06 |
Dicing wafers having solder bumps on wafer backside
Grant 8,912,078 - Lei , et al. December 16, 2 | 2014-12-16 |
Approaches for cleaning a wafer during hybrid laser scribing and plasma etching wafer dicing processes
Grant 8,883,615 - Holden , et al. November 11, 2 | 2014-11-11 |
Method for forming transparent conductive oxide
Grant 8,361,835 - Komin , et al. January 29, 2 | 2013-01-29 |
Method for forming transparent conductive oxide
Grant 8,318,589 - Komin , et al. November 27, 2 | 2012-11-27 |
Method and apparatus for mask pellicle adhesive residue cleaning
Grant 8,002,899 - Wu , et al. August 23, 2 | 2011-08-23 |
Post-ion implant cleaning for silicon on insulator substrate preparation
Grant 7,914,623 - Papanu , et al. March 29, 2 | 2011-03-29 |
Method For Forming Transparent Conductive Oxide
App 20100311204 - KOMIN; VALERY V. ; et al. | 2010-12-09 |
Method For Forming Transparent Conductive Oxide
App 20100311228 - KOMIN; VALERY V. ; et al. | 2010-12-09 |
Method for removing a halogen-containing residue
Grant 7,846,347 - Kawaguchi , et al. December 7, 2 | 2010-12-07 |
Cleaning submicron structures on a semiconductor wafer surface
Grant 7,718,009 - Verhaverbeke , et al. May 18, 2 | 2010-05-18 |
Process And Hardware For Plasma Treatments
App 20100104953 - Papanu; James S. ; et al. | 2010-04-29 |
Wet clean system design
Grant 7,694,688 - Lester , et al. April 13, 2 | 2010-04-13 |
Method And Appratus For Mask Pellicle Adhesive Residue Cleaning
App 20100078039 - Wu; Banqiu ; et al. | 2010-04-01 |
Backside Cleaning Of Substrate
App 20100028813 - Wu; Banqiu ; et al. | 2010-02-04 |
Method and apparatus for performing hydrogen optical emission endpoint detection for photoresist strip and residue removal
Grant 7,648,916 - Pavel , et al. January 19, 2 | 2010-01-19 |
Cleaning of native oxide with hydrogen-containing radicals
Grant 7,604,708 - Wood , et al. October 20, 2 | 2009-10-20 |
Advanced cleaning process using integrated momentum transfer and controlled cavitation
App 20090255555 - Gouk; Roman ; et al. | 2009-10-15 |
Post-ion implant cleaning for silicon on insulator substrate preparation
Grant 7,432,177 - Papanu , et al. October 7, 2 | 2008-10-07 |
Wet Clean System Design
App 20080166208 - Lester; Paul ; et al. | 2008-07-10 |
Method and apparatus for removing a halogen-containing residue
Grant 7,374,696 - Kawaguchi , et al. May 20, 2 | 2008-05-20 |
Methods To Accelerate Photoimageable Material Stripping From A Substrate
App 20080078424 - Gouk; Roman ; et al. | 2008-04-03 |
Post-ion implant cleaning on silicon on insulator substrate preparation
App 20080081485 - Papanu; James S. ; et al. | 2008-04-03 |
Temperature control of a substrate during wet processes
App 20080041427 - Brown; Brian ; et al. | 2008-02-21 |
Apparatus For Removing A Halogen-containing Residue
App 20070272359 - KAWAGUCHI; MARK N. ; et al. | 2007-11-29 |
Method For Removing A Halogen-containing Residue
App 20070254489 - KAWAGUCHI; MARK N. ; et al. | 2007-11-01 |
Apparatus and methods for mask cleaning
App 20070068558 - Papanu; James S. ; et al. | 2007-03-29 |
Methods and apparatus for stripping
App 20070051471 - Kawaguchi; Mark N. ; et al. | 2007-03-08 |
Method And Apparatus For Performing Hydrogen Optical Emission Endpoint Detection For Photoresist Strip And Residue Removal
App 20060289384 - Pavel; Elizabeth G. ; et al. | 2006-12-28 |
Post-ion implant cleaning for silicon on insulator substrate preparation
App 20060286783 - Papanu; James S. ; et al. | 2006-12-21 |
Temperature control of a substrate during wet processes
App 20060254616 - Brown; Brian ; et al. | 2006-11-16 |
Cleaning submicron structures on a semiconductor wafer surface
App 20060042651 - Verhaverbeke; Steven ; et al. | 2006-03-02 |
Method of photoresist removal in the presence of a dielectric layer having a low k-value
Grant 6,991,739 - Kawaguchi , et al. January 31, 2 | 2006-01-31 |
Cleaning of native oxide with hydrogen-containing radicals
App 20040219789 - Wood, Bingxi Sun ; et al. | 2004-11-04 |
Method and apparatus for removing a halogen-containing residue
App 20040203251 - Kawaguchi, Mark N. ; et al. | 2004-10-14 |
Method and apparatus for performing hydrogen optical emission endpoint detection for photoresist strip and residue removal
App 20040195208 - Pavel, Elizabeth G. ; et al. | 2004-10-07 |
Substrate cleaning apparatus and method
Grant 6,692,903 - Chen , et al. February 17, 2 | 2004-02-17 |
Method of photoresist removal in the presence of a dielectric layer having a low k-value
App 20030075524 - Kawaguchi, Mark N. ; et al. | 2003-04-24 |
Substrate cleaning apparatus and method
App 20020072016 - Chen, Haojiang ; et al. | 2002-06-13 |
Workpiece support platen for semiconductor process chamber
Grant 6,120,608 - Shendon , et al. September 19, 2 | 2000-09-19 |
Gas injection slit nozzle for a plasma process reactor
Grant 5,885,358 - Maydan , et al. March 23, 1 | 1999-03-23 |
Method and apparatus for cleaning by-products from plasma chamber surfaces
Grant 5,756,400 - Ye , et al. May 26, 1 | 1998-05-26 |
Gas injection slit nozzle for a plasma process reactor
Grant 5,746,875 - Maydan , et al. May 5, 1 | 1998-05-05 |
Gas injection slit nozzle for a plasma process reactor
Grant 5,643,394 - Maydan , et al. July 1, 1 | 1997-07-01 |
Passivating, stripping and corrosion inhibition of semiconductor substrates
Grant 5,545,289 - Chen , et al. August 13, 1 | 1996-08-13 |
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