Pao; Chih-Min
Patent Applications and Registrations
Patent applications and USPTO patent grants for Pao; Chih-Min.The latest application filed is for "package structure and manufacturing method thereof".
- Pao; Chih-Min - Ciaotou Township TW
- Pao; Chih-Min - Ciaotou TW
- Pao; Chih-Min - Kaoshiung TW
- Pao; Chih Min - Kaohsiung TW
| Patent | Date |
|---|---|
| Package structure and manufacturing method thereof App 20090079045 - Pao; Chih-Min | 2009-03-26 |
| Package structure with a heat spreader and manufacturing method thereof Grant 6,967,403 - Chuang , et al. November 22, 2 | 2005-11-22 |
| Pakage structure with a heat spreader and manufacturing method thereof App 20040256643 - Chuang, Chi-Ta ; et al. | 2004-12-23 |
| Semiconductor wafer cassette Grant 6,691,876 - Tsai , et al. February 17, 2 | 2004-02-17 |
| Semiconductor wafer cassette App 20030075518 - Tsai, Yu-Pin ; et al. | 2003-04-24 |
| Method for fabricating stacked chip package Grant 6,503,776 - Pai , et al. January 7, 2 | 2003-01-07 |
| Method for fabricating stacked chip package App 20020090753 - Pai, Tsung-Ming ; et al. | 2002-07-11 |
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